Patents by Inventor James J. Heaps-Nelson

James J. Heaps-Nelson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090072400
    Abstract: Methods of forming a contact in two or more portions and a contact so formed are disclosed. One method includes providing a device including a silicide region; and forming a contact to the silicide region by: first forming a lower contact portion to the silicide region through a first dielectric layer, and second forming an upper contact portion to the lower contact portion through a second dielectric layer over the first dielectric layer. A contact may include a first contact portion contacting a silicide region, the first contact portion having a width less than 100 nm; and a second contact portion coupled to the first contact portion from above, the second contact portion having a width greater than the width of the first contact portion.
    Type: Application
    Filed: September 18, 2007
    Publication date: March 19, 2009
    Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Huilong Zhu, James J. Heaps-Nelson, Mahender Kumar, Christine Norris, Ravikumar Ramachandran