Patents by Inventor James J. Hedrick

James J. Hedrick has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Single step electrical/mechanical connection process for connecting I/O pins and creating multilayer structures
    Patent number: 5303862
    Abstract: A single step electrical/mechanical connection process utilizes an adhesive layer (3 or 26) that is patterned on a substrate (1 or 21) to mechanically connect adjacent substrates in a multilayered structure (28) or to connect a pin (2) assembly to a device (5). In a preferred embodiment, the adhesive layer (3 or 26) and substrate (1 or 21) are made from materials which will undergo transesterification under heat and pressure to create a very strong bond therebetween. The adhesive layer (3 or 26) is positioned around and does not cover the solder (4) in the pin connector assembly or the alignment holes (24) in the molding/sheet (21), thereby allowing bonding metallurgy to make positive electrical connections between pins (2) and pads (6) and adjacent spheres (22) in a multilayered structure (28).
    Type: Grant
    Filed: December 31, 1992
    Date of Patent: April 19, 1994
    Assignee: International Business Machines Corporation
    Inventors: Arthur Bross, James J. Hedrick, Robert D. Johnson, Robert O. Lussow, James R. Lyerla, Jr., Donald E. Myers, Joseph D. Peruffo, Krishna G. Sachdev, Thomas J. Walsh