Patents by Inventor James J. Hjerpe Kaskade

James J. Hjerpe Kaskade has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7245507
    Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
    Type: Grant
    Filed: July 23, 2002
    Date of Patent: July 17, 2007
    Inventors: Joseph T. DiBene, II, David H. Hartke, James J. Hjerpe Kaskade, Carl E. Hoge
  • Publication number: 20020196614
    Abstract: A microprocessor packaging architecture using a modular circuit board assembly that provides power to a microprocessor while also providing for integrated thermal and electromagnetic interference (EMI) is disclosed. The modular circuit board assembly comprises a substrate, having a component mounted thereon, a circuit board, including a circuit for supplying power to the component, and at least one conductive interconnect device disposed between the substrate and the circuit board, the conductive interconnect device configured to electrically couple the circuit to the component.
    Type: Application
    Filed: July 23, 2002
    Publication date: December 26, 2002
    Applicant: INCEP Technologies, Inc.
    Inventors: Joseph T. DiBene, David H. Hartke, James J. Hjerpe Kaskade, Carl E. Hoge