Abstract: A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

Abstract: A circuit assembly includes multiple substrate with a regions of embedded signal processing circuitry can be connected to a region of adjustable signal processing circuitry and a cavity formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are connected to the embedded signal processing circuitry and/or to the customizable circuitry and enables the addition of a circuit element to the assembly after the bonding of the substrate layers and enables the connection of that added element to the signal processing circuitry and to the adjustable processing circuitry.

Abstract: A coupling assembly includes multiple composite substrate layers and a flange layer fusion bonded together in a stacked arrangement. The substrate layers are positioned on top of the flange layer and include embedded signal processing circuitry connected to a signal input and a signal output. A cavity is formed through an area of the substrate layers to expose signal connection terminals. These signal connection terminals are coupled to the embedded signal processing circuitry and they enable the addition of a circuit element to the assembly after the fusion bonding of the flange and substrate layers, and they enable the coupling of that added element to the signal processing circuitry.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A system and method is provided to allow designers to access a design system remotely. The design system allows a user to remotely utilize one or more engines to which access is provided by the remote design system provider. The engines, which offer a user an engine workspace where models may be built, synthesized, analyzed, and optimized, may physically reside on different servers. An optional feature is to provide access to a consultant for users requesting assistance during sessions.

Abstract: A microwave coupler is constructed in a multilayer, vertically-connected stripline architecture provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. Such a coupler has a vertically-connected stripline structure in which multiple sets of stripline layers are separated by interstitial groundplanes, and wherein more than one set of layers has a segment of coupled stripline. A typical implementation operates at frequencies from approximately 0.5 to 6 GHz, although other frequencies are achievable.

Abstract: A double-balanced ring mixer is provided in the form of a microwave integrated circuit that has a homogeneous, multilayer structure. The mixer utilizes baluns comprising rectangular coaxial transmission lines that are capable of operating over a wide range of frequencies while taking up little space. A typical implementation operates at frequencies from approximately 0.9 to 6 GHz, although other frequencies, such as approximately 0.1 to 10 GHz, are achievable.

Abstract: A platform is provided for the manufacture of microwave, multilayer integrated circuits and microwave, multifunction modules. The manufacturing process involves bonding fluoropolymer composite substrates into a multilayer structure using fusion bonding. The bonded multilayers, with embedded semiconductor devices, etched resistors and circuit patterns, and plated via holes form a self-contained surface mount module. Film bonding, or fusion bonding if possible, may be used to cover embedded semiconductor devices, including embedded active semiconductor devices, with one or more layers.

Abstract: A double-balanced microwave biphase modulator circuit is provided with a first balun for transforming the unbalanced RF Input impedance to a balanced diode impedance and providing direct current ground return paths, and a second balun for transforming the balanced diode impedance to the unbalanced RF Output impedance and providing access for data input. The first balun consists of a transmission line attached from a coupled pair of transmission lines to ground. The second balun consists of three pairs of coupled transmission lines, in which the first two pairs of transmission lines are attached to a diode ring, to a data input filter, to a circuit ground, and to the third pair of transmission lines.