Patents by Inventor James J. McNamara
James J. McNamara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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BUILDING MANAGEMENT SYSTEM WITH INTELLIGENT VISUALIZATION FOR OCCUPANCY AND ENERGY USAGE INTEGRATION
Publication number: 20240142930Abstract: A building system including one or more storage devices storing instructions thereon that, when executed by one or more processors, cause the one or more processors to ingest information comprising at least one of occupancy information or energy usage information associated with a building. The instructions further cause the one or more processors to generate a space usage recommendation based on the information. The instructions further cause the one or more processors to cause a graphical model of the building to include a representation of the information and the space usage recommendation. The instructions further cause the one or more processors to cause a display device of a user device to display the graphical model within a user interface.Type: ApplicationFiled: October 16, 2023Publication date: May 2, 2024Inventors: Jason Pelski, James Callanan, Edward Gerard McNamara, Michael J. Wenzel, Robbie Glen Davis, Shawn D. Schubert, Evan O'Gorman, Himanshu Gupta, Kristian Koivisto-Kokko, Ashteya Biharisingh -
Publication number: 20240127943Abstract: A pathogen detection and display system is configured to discover and display the location of substances of interest, particularly pathogens that can spread infection. The detection and display system can be used in healthcare facilities on surfaces, medical equipment and devices, patients, and staff, for example.Type: ApplicationFiled: December 15, 2023Publication date: April 18, 2024Applicant: Cardeya CorporationInventors: Charles R. Sperry, Lawrence J. Pillote, Vincent A. Piucci, Dennis F. McNamara, JR., James M. Wilson, III, Lisa Ruth Stowe, Brett M. Sitzlar, Barbara A. Piucci, David C. Chase
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Patent number: 8558374Abstract: An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.Type: GrantFiled: February 8, 2011Date of Patent: October 15, 2013Assignee: Endicott Interconnect Technologies, Inc.Inventors: Voya R. Markovich, Rabindra N. Das, Frank D. Egitto, James J. McNamara, Jr.
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Patent number: 8446707Abstract: A low loss capacitance and low loss insulating dielectric material consisting of a thermosetting resin, thermoplastic resin, a cross-linker, and containing a quantity of ferroelectric ceramic nano-particles of barium titanate within. The combined low loss insulating dielectric layer and a low loss capacitive layer resulting from the material allows one continuous layer that can form internal capacitors and permit the modifying the dielectric thickness between signal layers for impedance matching within a layer of substrate. More significantly, the applied layer of low loss capacitive materials can simultaneously act as a capacitor as well as a dielectric for separation of signal layers.Type: GrantFiled: October 10, 2011Date of Patent: May 21, 2013Assignee: Endicott Interconnect Technologies, Inc.Inventors: Rabindra N. Das, Konstantinos I. Papathomas, Voya R. Markovich, James J. McNamara
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Patent number: 8299371Abstract: A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.Type: GrantFiled: December 20, 2010Date of Patent: October 30, 2012Assignee: Endicott Interconnect Technologies, Inc.Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr.
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Patent number: 8288857Abstract: A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.Type: GrantFiled: September 17, 2010Date of Patent: October 16, 2012Assignee: Endicott Interconnect Technologies, Inc.Inventors: Rabindra N. Das, Voya R. Markovich, James J. McNamara, Jr., Mark D. Poliks
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Publication number: 20120201006Abstract: An electronic package with two circuitized substrates which sandwich an interposer therebetween, the interposer electrically interconnecting the substrates while including at least one electrical component (e.g., a power module) substantially therein to provide even further operational capabilities for the resulting package.Type: ApplicationFiled: February 8, 2011Publication date: August 9, 2012Applicant: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.Inventors: Voya R. Markovich, Rabindra N. Das, Frank D. Egitto, James J. McNamara, JR.
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Publication number: 20120152605Abstract: A circuitized substrate and method of making same in which quantities of thru-holes are formed within a dielectric interposer layer. The substrate includes two printed circuit board (PCB) layers bonded to opposing sides of the interposer with electrically conductive features of each PCB aligned with the interposer thru-holes. Resistive paste is positioned on the conductive features located adjacent the thru-holes to form controlled electrically resistive connections between conductive features of the two PCBs. A circuitized substrate assembly and method of making same are also disclosed.Type: ApplicationFiled: December 20, 2010Publication date: June 21, 2012Applicant: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.Inventors: Rabindra N. Das, John M. Lauffer, Voya R. Markovich, James J. McNamara, JR.
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Publication number: 20120068326Abstract: A tamper-resistant microchip package contains fluid- or nanofluid-filled capsules, channels, or reservoirs, wherein the fluids, either alone or in combination, can destroy circuitry by etching, sintering, or thermally destructing when reverse engineering of the device is attempted. The fluids are released when the fluid-filled cavities are cut away for detailed inspection of the microchip. Nanofluids may be used for the sintering process, and also to increase the thermal conductivity of the fluid for die thermal management. Through-vias and micro vias may be incorporated into the design to increase circuitry destruction efficacy by improving fluid/chip contact. Thermal interface materials may also be utilized to facilitate chip cooling.Type: ApplicationFiled: September 17, 2010Publication date: March 22, 2012Applicant: ENDICOTT INTERCONNECT TECHNOLOGIES, INC.Inventors: Rabindra N. Das, Voya R. Markovich, James J. McNamara, JR., Mark D. Poliks
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Publication number: 20110173809Abstract: Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.Type: ApplicationFiled: January 20, 2010Publication date: July 21, 2011Inventors: John M. Lauffer, Voya R. Markovich, James J. McNamara, JR., Peter A. Moschak
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Patent number: 7977034Abstract: Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.Type: GrantFiled: January 20, 2010Date of Patent: July 12, 2011Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr., Peter A. Moschak
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Patent number: 7827682Abstract: Apparatus and method for making circuitized substrates using a continuous roll format in which a layer of conductor is fed into the apparatus, layers of photo-imageable dielectric are applied to opposite sides of the conductor layer, thru-holes are formed through the composite, and then metal layers are added over the dielectric and then patterns (e.g., circuit) are formed therein. Several operations are performed in addition to these to form the final end product, a circuitized substrate (e.g., printed circuit board), all while the conductor layer of the product is retained in a solid format, up to the final separation from the continuous layer.Type: GrantFiled: April 21, 2005Date of Patent: November 9, 2010Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr., Peter A. Moschak
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Patent number: 7801833Abstract: A system and method for identifying and controlling the movement of various items, e.g., suitcases, associated with respective ones of various individuals, e.g., those desiring to travel on a selected means of transportation such as an airline, railway or the like. The system includes a plurality of programmable fingerprint readers each associated with a respective one of the items, a fingerprint scanner for scanning fingerprints from each individual and associating it with one or more of the items, a CPU for receiving readings from each of the item fingerprint readers and information from the scanner, and a retrieving unit (e.g., such as one owned by the transporting party) which retrieves selected ones of the fingerprint readings stored by the CPU for comparing with also retrieved readings from the respective fingerprint readers when the traveling individual presents an item to the transporting party for travel.Type: GrantFiled: December 22, 2003Date of Patent: September 21, 2010Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar Bhatt, Michael Hills, James J. McNamara, Jr., Candido Tiberia
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Patent number: 7627947Abstract: A method of making a multilayered circuitized substrate in which a continuous process is used to form electrically conductive layers which each will form part of a sub-composite. The sub-composites are then aligned such that openings within the conductive layers are also aligned, the sub-composites are then bonded together, and a plurality of holes are then laser drilled through the entire thickness of the bonded structure. The dielectric layers used in the sub-composites do not include continuous or semi-continuous fibers therein, thus expediting hole formation there-through.Type: GrantFiled: May 2, 2007Date of Patent: December 8, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Thomas J. Davis, Subahu D. Desai, John M. Lauffer, James J. McNamara, Jr., Voya R. Markovich
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Patent number: 7530167Abstract: A method of making a printed circuit board in which the board includes a common power plane having dielectric layers on opposing sides thereof and a signal layer on each of said dielectric layers, each signal layer comprising a plurality of substantially parallel signal lines running in substantially similar directions across said signal layers. Predetermined portions of the signal lines in one signal layer are aligned relative to and also parallel to corresponding signal lines in the other signal layer, with the power plane being located between these portions. Through hole connections are provided between selected signal lines in the two layers, these occurring through clearance holes in the power plane so as to be isolated therefrom.Type: GrantFiled: December 6, 2006Date of Patent: May 12, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: John M. Lauffer, Voya R. Markovich, James J. McNamara, Jr., David L. Thomas
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Patent number: 7510324Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.Type: GrantFiled: August 2, 2007Date of Patent: March 31, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
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Patent number: 7490984Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.Type: GrantFiled: February 22, 2008Date of Patent: February 17, 2009Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe
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Publication number: 20080170670Abstract: A method of inspecting articles using an imaging inspection apparatus which utilizes a plurality of individual imaging devices for directing beams onto the articles having objects therein to detect the objects based on established criteria. The method involves the enhanced cooling of the heat-generating imaging devices in which a fan directs cooling fluid onto a plurality of deflectors which in turn direct said fluid onto selected ones of said imaging devices.Type: ApplicationFiled: August 2, 2007Publication date: July 17, 2008Applicant: Endicott Interconnect Technologies , Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Sanjeev Sathe
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Publication number: 20080144768Abstract: A method of making an imaging inspection apparatus which involves positioning a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The method also involves providing a cooling structure in such a manner that it will direct cooling fluid onto the imaging devices to cool these during apparatus operation.Type: ApplicationFiled: February 22, 2008Publication date: June 19, 2008Applicant: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara,, Sanjeev Sathe
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Patent number: 7354197Abstract: An imaging inspection apparatus which utilizes a plurality of individual imaging devices (e.g., X-ray Computer Tomography scanning devices) positioned on a frame for directing beams onto articles having objects therein to detect the objects based on established criteria. The apparatus utilizes a cooling structure to provide cooling to the imaging devices.Type: GrantFiled: June 1, 2005Date of Patent: April 8, 2008Assignee: Endicott Interconnect Technologies, Inc.Inventors: Ashwinkumar C. Bhatt, Varaprasad V. Calmidi, James J. McNamara, Jr., Sanjeev Sathe