Patents by Inventor James J. Mezey

James J. Mezey has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods and apparatus for thermally processing wafers
    Patent number: 6774060
    Abstract: The method provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature control capabilities. The method may include rotating the wafers in addition to providing a gas flow velocity gradient above the wafer for improved temperature and processing uniformity results.
    Type: Grant
    Filed: July 7, 2001
    Date of Patent: August 10, 2004
    Assignee: Avansys, LLC.
    Inventor: James J. Mezey, Sr.
  • Methods and apparatus for thermally processing wafers
    Patent number: 6331212
    Abstract: The apparatus provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature control capabilities. The apparatus is capable of rotating the wafer in addition to providing a gas flow velocity gradient above the wafer for improved temperature and processing uniformity results.
    Type: Grant
    Filed: April 17, 2000
    Date of Patent: December 18, 2001
    Assignee: Avansys, LLC
    Inventor: James J. Mezey, Sr.
  • Methods and apparatus for thermally processing wafers
    Publication number: 20010046768
    Abstract: The method provides a temperature controlled environment for processing semiconductor wafers at elevated temperatures. A hot wall process chamber is used for the process steps. The process chamber includes three zones with independent temperature control capabilities. The method may include rotating the wafers in addition to providing a gas flow velocity gradient above the wafer for improved temperature and processing uniformity results.
    Type: Application
    Filed: July 7, 2001
    Publication date: November 29, 2001
    Inventor: James J. Mezey