Patents by Inventor James J. Motta

James J. Motta has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Abrasive article including shaped abrasive particles comprising a particular toothed body
    Patent number: 11932802
    Abstract: Various shaped abrasive particles are disclosed. Each shaped abrasive particle includes a body having at least one major surface and a side surface extending from the major surface.
    Type: Grant
    Filed: December 2, 2022
    Date of Patent: March 19, 2024
    Assignee: SAINT-GOBAIN CERAMICS & PLASTICS, INC.
    Inventors: Todd M. Cotter, Francois Wagner, Rene G. Demers, Richard J. Klok, Alexandra Marazano, Adam D. Lior, James A. Salvatore, Sujatha K. Iyengar, David F Louapre, Sidath S. Wijesooriya, Ronald Christopher Motta, Gary A. Guertin, Michael D. Kavanaugh, Doruk O. Yener, Jennifer H. Czerepinski, Jun Jia, Frederic Josseaux, Ralph Bauer, Frank J. Csillag, Yang Zhong, James P. Stewart, Mark P. Dombrowski, Sandhya Jayaraman Rukmani, Amandine Martin, Stephen E. Fox, Nilanjan Sarangi, Dean S. Matsumoto
  • Surface mount molded relay package and method of manufacturing same
    Patent number: 6683518
    Abstract: The electromechanical device of the present invention is a low profile reed switch package for surface mounting on a printed circuit board. The reed device package includes a reed switch with two signal terminals emanating from opposing sides thereof. A leadframe is employed with signal conductors and ground conductors. The signal conductors are respectively attached to each of the signal terminals. A ground shield surrounds the body of the reed switch. The ground conductors are connected to the ground shield on a first side of the reed switch with the signal conductor on one side of the reed switch being positioned between the two ground conductors. Another pair of ground conductors are connected to the ground shield on the other side of the switch and are similarly positioned with the other signal conductor positioned therebetween.
    Type: Grant
    Filed: March 7, 2003
    Date of Patent: January 27, 2004
    Assignee: Kearney-National, Inc.
    Inventor: James J. Motta
  • Surface mount molded relay package and method of manufacturing same
    Publication number: 20030169138
    Abstract: The electromechanical device of the present invention is a low profile reed switch package for surface mounting on a printed circuit board. The reed device package includes a reed switch with two signal terminals emanating from opposing sides thereof. A leadframe is employed with signal conductors and ground conductors. The signal conductors are respectively attached to each of the signal terminals. A ground shield surrounds the body of the reed switch. The ground conductors are connected to the ground shield on a first side of the reed switch with the signal conductor on one side of the reed switch being positioned between the two ground conductors. Another pair of ground conductors are connected to the ground shield on the other side of the switch and are similarly positioned with the other signal conductor positioned therebetween.
    Type: Application
    Filed: March 7, 2003
    Publication date: September 11, 2003
    Inventor: James J. Motta