Abstract: The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.

Abstract: The present invention relates to a process for making a dehydrated pulp slurry comprising the steps of de-sugaring a pulp slurry, said de-sugaring process producing a pulp slurry with substantially no sugar content, and dehydrating said pulp slurry. The dehydrated pulp slurry produced by this process is such that, when reconstituted, the color, shape, and texture of the pulp contained therein is substantially the same as it was prior to undergoing the dehydrating step.

Abstract: Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.

Abstract: The present invention relates to a topical cosmetic composition that has improved non-oily feel comprising: (a) a hybrid silicone composite powder having a spherical shape with particle diameter ranging from 2 to 10 ?m, of which each particle has a composite structures consisting of two interpenetrating polymer networks of polydimethylsiloxane (PMS) and polymethylsilsesquioxane (PMSQ). These two interpenetrating polymer networks are joined together by physical entanglements instead of chemical bonds; (b) a volatile cosmetic fluid; (c) a silicone fluid with viscosity ranging from 2 to 350 cSt; (d) an oil base consisting of an oil, wax, oil gelling agent or the mixture thereof; (e) a surface active agent; (f) a cosmetic pigment; and (g) an optional aqueous gel containing glycerin, glycols and an aqueous thickening agent. The cosmetic composition provides an improved skin sensory feel and a superior matte finish, and is useful for skin treatment, makeup and personal hygiene products.

Abstract: Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.

Abstract: Quad Flat No-Lead (QFN) packages are provided. An embodiment of a QFN package includes a semiconductor chip including an active surface and an inactive surface, a plurality of leads, a plurality of wire bonds configured to couple the plurality of leads to the semiconductor chip, and a mold material including a mounting side and having a perimeter. The active surface is oriented toward the mounting side, the plurality of wire bonds are disposed between the active surface and the mounting side within the mold material, and the plurality of leads are exposed on the mounting side and are at least partially encapsulated within the perimeter of the mold material.

Abstract: Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material 340, 440 substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds 330, 430 disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.

Abstract: Methods are provided for forming Quad Flat No-Lead (QFN) packages. An embodiment includes disposing an active side of a semiconductor chip on a plurality of leads, coupling a plurality of wire bonds to the active side of the semiconductor chip, coupling the plurality of wire bonds to the plurality of leads in a space between the active side and the plurality of leads, and encasing the semiconductor chip, at least a portion of each of the plurality of leads, and the plurality of wire bonds in a mold material to define a mounting side of the QFN package. The mounting side has a perimeter, the plurality of leads are oriented on and exposed on the mounting side within the perimeter, and the plurality of wire bonds are oriented between the active side and the mounting side within the mold material.

Abstract: A cosmetic composition is disclosed containing hydrophilic, spherical powder of polymethylsilsesquioxane having a particle size ranged from 1-20 microns with a narrow particle size distribution. The hydrophilic, spherical powder in the composition is prepared by a process comprising (1) hydrolyzing and condensing methyltrimethoxysilane in water in the presence of a thickener as suspending agent, an oil as surface tension modifier and an acid or base as catalyst to form spherical particles, (2) post-hydrolyzing the spherical particles in an aqueous NaOH solution and (3) purifying the spherical particles by repeated washing and vacuum stripping.

Abstract: Methods and apparatus are provided for decreasing the size of Quad Flat No-Lead (QFN) packages (300, 400) down to chip-scale packages. Such QFN packages include a first semiconductor chip (310, 410), a plurality of recessed leads (306, 406, 408, 411) having mold lock features, and a mold material 340, 440 substantially encasing all sides of the semiconductor chip. An active surface (314, 414) of the semiconductor chip is oriented toward a mounting side (307, 407) of the QFN package, and a plurality of wire bonds 330, 430 disposed between the active surface and the mounting side couple the active side to the leads. The QFN packages may also include a second semiconductor chip (452) coupled to a plurality of leads (408) and to the first semiconductor chip via wire bonds (431, 432) in a manner similar to the first semiconductor chip.

Abstract: A carton for enclosing a number of products. The carton may include a top panel, a first side panel, a second side panel, and a top panel tab positioned adjacent to the top panel and separated by a top panel fold line. The carton may have a first score line extending across the top panel from the first side panel to the second side panel and a pair of second score lines extending across the top panel from the first side panel and the second side panel to the first fold line, thus forming a first and a second corner flap along the top panel.

Abstract: One embodiment relates to using a robust metal layer of a semiconductor device to form landing pads. In one embodiment, a sputterable, nonwettable refractory metal is used as a solder mask for the landing pads. A second device may then be coupled to the robust metal layer landing pads of the semiconductor device. In one embodiment, the landing pads are formed while the semiconductor device is in wafer form, and a second device is then coupled to the landing pads of each of the plurality of semiconductor devices within the wafer, such that each semiconductor device within the wafer is electrically coupled to a second device. In this manner, each semiconductor device within the wafer and its corresponding second device may be probed and tested as a system. After probing and testing, the wafer may be singulated into a plurality of individual device assemblies which may then be packaged.

Abstract: A system and method of continuously forming, sealing, and filling flexible packages with sterile beverages is disclosed wherein the forming, sealing, and filling is performed without stopping or indexing the packages in order to achieve high throughput rates and efficiency. A web feeding device inputs sheet material into the system, which is continuously formed into a series of juxtaposed shaped packages in a forming unit. The packages are formed by a folding technique resulting in top and bottom gussets, and sealed side seams with an open top for filling thereof with liquid. The entire web of formed packages is transported through a filling device, which continuously fills the packages while in web form. The top fill openings of the packages are then sealed in a continuous process, and fabrication within an aseptic or ultra-clean environment is thereby completed. Post-treatment of the packages outside of the aseptic environment, but in a clean environment, then may proceed.

Abstract: A valve assembly for filling containers with metered quantities of materials includes a valve body having a chamber therein, the valve body having open-top and bottom ends with substantially smooth interior sidewalls defining the chamber. A valve element for opening and closing the openable bottom end of the valve body is disposed in the chamber adjacent to the openable bottom end. An actuator device, including a pair of air cylinders, provides for relative movement between a lower portion of the valve body in which the openable bottom end is disposed and the valve element in order to open and close the openable bottom end. A concentric sleeve is telescopically connected to the bottom portion of the main valve body, and is reciprocably movable in response to actuation of the air cylinders to open and close the valve.

Abstract: A valve assembly for filling containers with metered quantities of materials includes a valve body having a chamber therein, the valve body having open-top and bottom ends with substantially smooth interior sidewalls defining the chamber. A valve 5 element for opening and closing the openable bottom end of the valve body is disposed in the chamber adjacent to the openable bottom end. An actuator device, including a pair of air cylinders, provides for relative movement between a lower portion of the valve body in which the openable bottom end is disposed and the valve element in order to open and close the openable bottom end. A concentric sleeve is telescopically connected to the bottom portion of the main valve body, and is reciprocably movable in response to actuation of the air cylinders to open and close the valve.

Abstract: A system and method of continuously forming, sealing, and filling flexible packages with sterile beverages is disclosed wherein the forming, sealing, and filling is performed without stopping or indexing the packages in order to achieve high throughput rates and efficiency. A web feeding device inputs sheet material into the system, which is continuously formed into a series of juxtaposed shaped packages in a forming unit. The packages are formed by a folding technique resulting in top and bottom gussets, and sealed side seams with an open top for filling thereof with liquid. The entire web of formed packages is transported through a filling device, which continuously fills the packages while in web form. The top fill openings of the packages are then sealed in a continuous process, and fabrication within an aseptic or ultra-clean environment is thereby completed. Post-treatment of the packages outside of the aseptic environment, but in a clean environment, then may proceed.

Abstract: A method and system for packaging hot beverages in flexible aseptic pouches includes filling the pouches with a hot beverage concentrate, immediately thereafter filling the pouches with chilled sterile water in order to lower the temperature of the resulting mixture of concentrate and water in the pouches, sealing the pouches, and transporting the pouches directly to a bundler or multi-pac assembling device. The method and system does not require the use of a separate cooling station for the hot pouches between the filler and bundler due to the introduction of chilled sterile water into the pouches at the outset, as part of a two-stage filling process. Containers of other types than flexible packages may also be filled by the method and system.

Abstract: A unitary beverage container includes a main body defining a container volume in which a beverage is contained. A top of the main body includes a channel disposed horizontally therealong as well as an uppermost bisecting ridge extending from one side of the main body to the other and a respective remainder portion on each side of the ridge sloping downwardly away from the ridge. A bottom of the main body has a lowermost continuous base surface and a central concavity extending inwardly therefrom. The central concavity is particularly formed by a horizontal recess surface and a peripheral recess band sloped radially inward. A flexible straw has a proximal end fluidly connected with the container volume and a distal end having an aperture therein which is located in the channel of the top. A holding mechanism removably holds the distal end of the flexible straw in the channel. In order to fill the beverage container, the bottom includes a filling conduit extending from the central concavity.

Abstract: A wax (13) dissolved in solvent is placed on a semiconductor wafer (12) and made uniform. An assembly is formed by bonding the semiconductor wafer (12) to a submount (17) with a uniform wax layer (14). The submount (17) supports and allows handling of the semiconductor wafer (12) during wafer process steps. The assembly is heated in a vacuum to remove solvent and air trapped in the uniform wax layer (14) thereby minimizing air voids which can cause a non-uniform bond. The assembly is then annealed to reduce stress on the semiconductor wafer (12) induced by differing material thermal expansion rates of the semiconductor wafer (12), the uniform wax layer (14), and the submount (17).