Abstract: In one embodiment, a computer-implemented method includes collecting data from at least one component of a micromobility vehicle. The method includes analyzing the data to determine whether a condition of the micromobility vehicle corresponds to an unsafe condition. The method includes determining, based on analysis, that the condition of the micromobility vehicle corresponds to the unsafe condition. The method includes activating an immobilization lock on the micromobility vehicle to immobilize a wheel of the micromobility vehicle responsive to determining that the condition of the micromobility vehicle corresponds to the unsafe condition.

Abstract: Techniques are disclosed for systems and methods associated with locking a micromobility transit vehicle to a stationary object. A multimodal transportation system may include a docking station including a securement point, and a micromobility transit vehicle securable to the securement point of the docking station. The micromobility transit vehicle may include a storage basket and a lock cable including a first end coupled to the storage basket and a second end. The second end of the lock cable may be securable to the securement point of the docking station to lock the micromobility transit vehicle to the docking station. The storage basket may include a pin lock. The pin lock may engage a locking pin of the lock cable to lock the micromobility transit vehicle via the lock cable.

Abstract: A reticle-masking structure is provided. The reticle-masking structure includes a magnetic substrate and a paramagnetic part disposed on the magnetic substrate. The paramagnetic part includes a plurality of fractions disposed on a plurality of protrusion structures. In some embodiments, the fractions are irregularly arranged. A method for forming a reticle-masking structure and an extreme ultraviolet apparatus are also provided.

Abstract: A method for polishing a semiconductor substrate includes the following operations. A semiconductor substrate is received. An abrasive slurry having a first temperature is dispensed to a polishing surface of a polishing pad. The semiconductor substrate is polished. The abrasive slurry have a second temperature is dispensed to the polishing surface of the polishing pad during the polishing of the semiconductor substrate. The second temperature is different from the first temperature.

Abstract: An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a slurry temperature control device coupled to the shiny dispenser and configured to control a temperature of the abrasive slurry. The slurry temperature control device includes a heat transferring portion surrounding a portion of the slurry dispenser, and a thermos-electric (TE) chip coupled to the heat transferring portion and configured to control the temperature of the abrasive slurry.

Abstract: A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

Abstract: The disclosed computer-implemented method may include a magnetic insertable lock component with a magnet-sensing lock housing. By using a magnet within a pin and a magnetic field sensor within the lock housing, the apparatus may accurately detect the state of the lock. In some embodiments, the apparatus may determine the pin is inserted fully into the lock, the pin is inserted partially into the lock, the pin is not inserted in the lock, and/or that a foreign object that is not the pin is inserted into the lock. By using a magnet within the pin to track the state of the lock, the apparatus may improve both the user experience and the security of the lock. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: The disclosed computer-implemented method may include a magnetic insertable lock component with a magnet-sensing lock housing. By using a magnet within a pin and a magnetic field sensor within the lock housing, the apparatus may accurately detect the state of the lock. In some embodiments, the apparatus may determine the pin is inserted fully into the lock, the pin is inserted partially into the lock, the pin is not inserted in the lock, and/or that a foreign object that is not the pin is inserted into the lock. By using a magnet within the pin to track the state of the lock, the apparatus may improve both the user experience and the security of the lock. Various other methods, systems, and computer-readable media are also disclosed.

Abstract: A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

Abstract: A method for polishing a semiconductor substrate includes the following operations. A semiconductor substrate is received. An abrasive slurry having a first temperature is dispensed to a polishing surface of a polishing pad. The semiconductor substrate is polished. The abrasive slurry have a second temperature is dispensed to the polishing surface of the polishing pad during the polishing of the semiconductor substrate. The second temperature is different from the first temperature.

Abstract: A reticle-masking structure is provided. The reticle-masking structure includes a magnetic substrate and a paramagnetic part disposed on the magnetic substrate. The paramagnetic part includes a plurality of fractions disposed on a plurality of protrusion structures. In some embodiments, the fractions are irregularly arranged. A method for forming a reticle-masking structure and an extreme ultraviolet apparatus are also provided.

Abstract: Techniques are disclosed for systems and methods associated with locking a micromobility transit vehicle to a stationary object. A multimodal transportation system may include a docking station including a securement point, and a micromobility transit vehicle securable to the securement point of the docking station. The micromobility transit vehicle may include a storage basket and a lock cable including a first end coupled to the storage basket and a second end. The second end of the lock cable may be securable to the securement point of the docking station to lock the micromobility transit vehicle to the docking station. The storage basket may include a pin lock. The pin lock may engage a locking pin of the lock cable to lock the micromobility transit vehicle via the lock cable.

Abstract: A reticle-masking structure is provided. The reticle-masking structure includes a magnetic substrate and a paramagnetic part disposed on the magnetic substrate. The paramagnetic part includes a plurality of fractions disposed on a plurality of protrusion structures. In some embodiments, the protrusion structures are irregularly arranged. A method for forming a reticle-masking structure and an extreme ultraviolet apparatus are also provided.

Abstract: Techniques are disclosed for systems and methods associated with locking a micromobility transit vehicle to a stationary object. A multimodal transportation system may include a docking station including a securement point, and a micromobility transit vehicle securable to the securement point of the docking station. The micromobility transit vehicle may include a storage basket and a lock cable including a first end coupled to the storage basket and a second end. The second end of the lock cable may be securable to the securement point of the docking station to lock the micromobility transit vehicle to the docking station. The storage basket may include a pin lock. The pin lock may engage a locking pin of the lock cable to lock the micromobility transit vehicle via the lock cable.

Abstract: Techniques are disclosed for systems and methods associated with locking a micromobility transit vehicle to a stationary object. A multimodal transportation system may include a docking station including a securement point, and a micromobility transit vehicle securable to the securement point of the docking station. The micromobility transit vehicle may include a storage basket and a lock cable including a first end coupled to the storage basket and a second end. The second end of the lock cable may be securable to the securement point of the docking station to lock the micromobility transit vehicle to the docking station. The storage basket may include a pin lock. The pin lock may engage a locking pin of the lock cable to lock the micromobility transit vehicle via the lock cable.

Abstract: A method for transmitting upstream data in a cable network is provided. The method includes a cable modem (CM) receiving a generic service identifier (G-SID) included in a corresponding information element (IE) in a data over cable service interface specification (DOCSIS) upstream bandwidth allocation MAP message. The G-SID is a unique identifier assigned to the CM. The method includes the CM transmitting the upstream data for one or more service flows of the CM via at least a portion of the CM bandwidth allocation.

Abstract: A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

Abstract: A reticle-masking structure is provided. The reticle-masking structure includes a magnetic substrate and a paramagnetic part disposed on the magnetic substrate. The paramagnetic part includes a plurality of fractions disposed on a plurality of protrusion structures. In some embodiments, the protrusion structures are irregularly arranged. A method for forming a reticle-masking structure and an extreme ultraviolet apparatus are also provided.

Abstract: An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a slurry temperature control device coupled to the shiny dispenser and configured to control a temperature of the abrasive slurry. The slurry temperature control device includes a heat transferring portion surrounding a portion of the slurry dispenser, and a thermos-electric (TE) chip coupled to the heat transferring portion and configured to control the temperature of the abrasive slurry.

Abstract: An apparatus for CMP includes a wafer carrier retaining a semiconductor wafer during a polishing operation, a slurry dispenser dispensing an abrasive slurry, and a temperature control system monitoring and controlling a temperature variation during the polishing operation. The temperature control system includes a temperature sensor detecting a temperature during the polishing operation and providing a signal corresponding to the temperature, a temperature controller coupled to the temperature sensor and receiving the signal from the temperature sensor, and a cooling device coupled to the temperature controller and providing a coolant to the apparatus for CMP.