Patents by Inventor James Jens Hansen

James Jens Hansen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacture multilayer circuit package
    Patent number: 5867898
    Abstract: A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.
    Type: Grant
    Filed: March 3, 1997
    Date of Patent: February 9, 1999
    Assignee: International Business Machines Corporation
    Inventors: John Matthew Lauffer, David John Russell, James Jens Hansen
  • Planar transformer and method of manufacture
    Patent number: 5754088
    Abstract: A planar transformer wherein a conformal dielectric epoxy composition is provided on the planes containing the primary and secondary windings to encapsulate the windings and to insulate the windings from the perimeter of each plane to prevent the primary windings from electrically contacting the secondary windings around the edges of the planes. Also, a conformal dielectric epoxy composition separates the plane with the primary windings from the plane with the secondary windings from primary and secondary circuits directly and below windings.
    Type: Grant
    Filed: November 17, 1994
    Date of Patent: May 19, 1998
    Assignee: International Business Machines Corporation
    Inventors: David Robert Fletcher, John Michael Gallagher, Terry Chester Lahr, Garey George Roden, James Jens Hansen, Kenneth Andrew Wallace
  • Electric circuit card having a donut shaped land
    Patent number: 5670750
    Abstract: A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.
    Type: Grant
    Filed: April 27, 1995
    Date of Patent: September 23, 1997
    Assignee: International Business Machines Corporation
    Inventors: John Matthew Lauffer, David John Russell, James Jens Hansen