Abstract: A system and method for cooling individual electronic components utilizes individual manifolds to create individual flows of a negatively pressurized cooling fluid. This permits components with significantly different cooling loads to be located immediately adjacent each other on a circuit board, but without loss of space and computation time efficiencies, because cooling the components individually avoids heat generated by each component from adversely affecting the performance of the cooling system for adjacent components. A heat sink can be coupled to the components for increased heat transfer, and a preferred design of heat sink both dissipates heat and directs the flow of the fluid in an optimum manner.