Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material.

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Abstract: Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Abstract: A method for making a glass article comprising contacting a first surface of a glass substrate with a laser to produce a plurality of light extraction features having a diameter and a depth, wherein the light extraction features produce a color shift ?y of extracted light where ?y<0.01 per 500 mm of length. A glass article as described can comprise a first surface and an opposing second surface, wherein the first surface comprises a plurality of laser induced light extraction features, and wherein the plurality of laser induced light extraction features produces a color shift ?y<0.01 per 500 mm of length.

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

Abstract: A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimeters between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

Abstract: Methods and apparatus for cutting a glass sheet along a cutting line into a desired shape. A laser source is configured to apply a laser beam to a beam location on the cutting line of the glass sheet. A source of cooling fluid is configured to apply a cooling fluid to a cooling band on the glass sheet to reduce a temperature of the glass sheet along the cooling path while elevating the temperature of the glass sheet at the beam location with the laser beam. The source of cooling fluid is configured to apply the cooling path as a cooling ring to circumscribe the beam location on the cutting line with the cooling band circumferentially spaced from the beam location while the cooling path and the beam location move simultaneously together in order to propagate a fracture in the glass sheet along the cutting line.

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.

Abstract: The present invention relates to a laser cutting technology for cutting and separating thin substrates of transparent materials, for example to cutting of display glass compositions mainly used for production of Thin Film Transistors (TFT) devices. The described laser process can be used to make straight cuts, for example at a speed of >0.25 m/sec, to cut sharp radii outer corners (<1 mm), and to create arbitrary curved shapes including forming interior holes and slots. A method of laser processing an alkaline earth boro-aluminosilicate glass composite workpiece includes focusing a pulsed laser beam into a focal line. The pulsed laser produces pulse bursts with 5-20 pulses per pulse burst and pulse burst energy of 300-600 micro Joules per burst. The focal line is directed into the glass composite workpiece, generating induced absorption within the material.

Abstract: A method for forming an initiation defect in a glass substrate to facilitate separating the glass substrate into a plurality of substrates is provided. The method includes providing the glass substrate and contacting a broad surface of the glass substrate with an abrasive surface thereby forming a field of initiation defects in the broad surface of the glass substrate. The field of initiation defects has a width of at least about three millimetres between outermost initiation defects. At least one initiation defect is heated with a laser source. The at least one initiation defect is cooled with a cooling fluid such that a crack initiates from the at least one initiation defect, the crack extending through a thickness of the glass substrate and propagating across the glass substrate to separate the glass substrate into the plurality of substrates.

Abstract: Cutting a desired final shape in a glass sheet, wherein the glass sheet is about 0.3 mm or less in thickness by applying a laser beam to the glass and continuously moving the laser relative to the glass along the cutting line. The laser is of a circular shape, and cooling fluid is applied simultaneously with the application of the laser, such that the cooling fluid at least reduces the temperature of the glass in order to propagate a fracture in the glass. The method includes controlling at least one of: (i) an energy density of the laser, (ii) a velocity of the laser relative to the glass along the cutting line, (iii) a fluid flow of the cooling fluid, and (iv) a minimum radius of curvature of the cutting line, such that a B10 edge strength of a cut edge of the glass is at least about 300 MPa.

Abstract: Methods and apparatus provide for: cutting a thin glass sheet along a curved cutting line, where the curve is divided into a plurality of line segments; applying a laser beam and continuously moving the laser beam along the cutting line; applying a cooling fluid simultaneously with the application of the laser beam in order to propagate a fracture in the glass sheet along the cutting line; and varying one or more cutting parameters as the laser beam moves from one of the plurality of line segments to a next one of the plurality of line segments, wherein the one or more cutting parameters include at least one of: (i) a power of the laser beam, (ii) a speed of the movement, (iii) a pressure of the cooling fluid, and (iv) a flow rate of the cooling fluid.

Abstract: Systems and methods for laser-cutting thermally tempered substrates are disclosed. In one embodiment, a method of separating a thermally tempered substrate includes directing a laser beam focal line such that at least a portion of the laser beam focal line is within a bulk of the thermally tempered substrate. The focused pulsed laser beam is pulsed to form a sequence of pulse bursts comprising one or more sub-pulses. The laser beam focal line produces a damage track within the bulk of the tempered substrate along the laser beam focal line. Relative motion is provided between the focused pulsed laser beam and the tempered substrate such that the pulsed laser beam forms a sequence of damage tracks within the tempered substrate. Individual damage tracks of the sequence of damage tracks are separated by a lateral spacing, and one or more microcracks connect adjacent damage tracks of the sequence of damage tracks.

Abstract: A method of separating a thin glass substrate from a carrier plate to which edge portions of the glass substrate are bonded, including irradiating a surface of the glass substrate with a pulsed laser beam, the laser beam moving along a plurality of parallel scan paths within a raster envelope, producing relative motion between the raster envelope and the glass substrate so that the raster envelope is moved along an irradiation path on the unbonded central portion. The irradiating produces ablation of the glass substrate along the irradiation path that forms a channel having a width W1 at the first surface greater than a width W2 at the second surface and extending through the thickness of the glass substrate, thus separating a thin glass sheet from the glass substrate-carrier plate assembly.

Abstract: Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples.

Abstract: Gradient-index (GRIN) lens fabrication employing laser pulse width duration control, and related components, systems, and methods are disclosed. GRIN lenses can be fabricated from GRIN rods by controlling the pulse width emission duration of a laser beam emitted by a laser to laser cut the GRIN rod, as the GRIN rod is disposed in rotational relation to the laser beam. Controlling laser pulse width emission duration can prevent or reduce heat accumulation in the GRIN rod during GRIN lens fabrication. It is desired that the end faces of GRIN lenses are planar to facilitate light collimation, easy bonding or fusing of the GRIN lens to optical fibers to reduce optical losses, polishing to avoid spherical aberrations, and/or cleaning the end faces when disposed in a fiber optic connector, as non-limiting examples.

Abstract: Strengthened glass articles having laser etched features, electronic devices, and methods of fabricating etched features in strengthened glass articles are disclosed. In one embodiment, a strengthened glass article includes a first strengthened surface layer and a second strengthened surface layer under a compressive stress and extending from a first surface and a second surface, respectively, of the strengthened glass article to a depth of layer, and a central region between the first strengthened surface layer and the second strengthened surface layer that is under tensile stress. The strengthened glass article further includes at least one etched feature formed by laser ablation within the first surface or the second surface having a depth that is less than the depth of layer and a surface roughness that is greater than a surface roughness of the first surface or second surface outside of the at least one etched feature.