Patents by Inventor James K. Guest

James K. Guest has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11480398
    Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: October 25, 2022
    Assignee: The Johns Hopkins University
    Inventors: Kevin J. Hemker, Timothy P. Weihs, Stephen Ryan, Longyu Zhao, Seunghyun Ha, Yong Zhang, James K. Guest
  • Publication number: 20220310243
    Abstract: An implant customization platform may receive image data associated with a bone of a patient. The implant customization platform may convert the image data to a structural representation of the bone. The implant customization platform may identify, based on the structural representation, a placement for an orthopaedic implant relative to the bone. The implant customization platform may determine a performance characteristic for a combination of the bone and the orthopaedic implant. The implant customization platform may determine, using an implant customization model, a data representation of the orthopaedic implant based on the structural representation, the placement, and the performance characteristic. The implant customization platform may perform an action associated with the data representation to permit the orthopaedic implant to be formed.
    Type: Application
    Filed: July 22, 2020
    Publication date: September 29, 2022
    Applicant: The Johns Hopkins University
    Inventors: Jarred A. BRESSNER, Mikhail OSANOV, James K. GUEST
  • Patent number: 10982913
    Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.
    Type: Grant
    Filed: May 23, 2016
    Date of Patent: April 20, 2021
    Assignees: The Johns Hopkins University, Saertex USA, LLC
    Inventors: Kevin J. Hemker, Timothy P. Weihs, Stephen Ryan, Longyu Zhao, Seunghyun Ha, Yong Zhang, Sen Lin, James K. Guest, Keith Sharp
  • Patent number: 10253836
    Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.
    Type: Grant
    Filed: April 1, 2016
    Date of Patent: April 9, 2019
    Assignee: The Johns Hopkins University
    Inventors: James K. Guest, Kevin J. Hemker, Timothy P. Weihs, Stephen M. Ryan, Stefan Szyniszewski
  • Publication number: 20170023084
    Abstract: The present invention is directed to three dimensional weaves composed of wires or yarns that offer the potential for damping not achievable with solid materials, including high temperature damping. Three damping mechanisms have been identified: (1) Internal material damping, (2) Frictional energy dissipation (Coulomb damping), and (3) inertial damping (tuned mass damping). These three damping mechanisms can be optimized by modifying the wire material chemistries (metals, ceramics, polymers, etc.), wire sizes, wire shapes, wire coatings, wire bonding, and wire architecture (by removing certain wires). These have the effect of modifying the lattice and wire stiffnesses, masses, coefficients of friction, and internal material damping. Different materials can be used at different locations in the woven lattice. These design variables can also be modified to tailor mechanical stiffness and strength of the lattice, in addition to damping.
    Type: Application
    Filed: April 1, 2016
    Publication date: January 26, 2017
    Inventors: James K. Guest, Kevin J. Hemker, Timothy P. Weihs, Stephen M. Ryan, Stefan Szyniszewski
  • Publication number: 20170023310
    Abstract: The present invention is directed to devices formed from three-dimensional (3D) structures composed of metallic, ceramic or polymeric wires or bundles and yarns of wires that are either solid or hollow like a tube. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, in some cases using a topology optimization routine that includes the 3D manufacturing constraints. The properties can be optimized in different directions. The 3D structures of the present invention include multiple properties that are optimized for a range of different applications, including heat transfer. The present invention also includes the methods for optimization of the 3D structures as well as methods of use of the 3D structures in heat transfer applications.
    Type: Application
    Filed: May 23, 2016
    Publication date: January 26, 2017
    Inventors: Kevin J. Hemker, James K. Guest, Timothy P. Weihs, Stephen M. Ryan, Longyu Zhao, Seunghyun Ha, Yong Zhang, Stefan Szyniszewski, Sergey Kuznetsov
  • Publication number: 20160363389
    Abstract: The present invention is directed to devices formed from three dimensional (3D) structures composed of wires, yarns of wires, or 3D printed structures. The devices of the present invention offer the potential for 3D structures with multiple properties optimized concurrently, using optimization within the 3D manufacturing constraints. The 3D structures of the present invention include multiple properties that are optimized for heat transfer applications. The present invention also includes the methods for optimization of the 3D woven lattices as well as methods of use of the 3D woven lattices in heat transfer applications.
    Type: Application
    Filed: May 23, 2016
    Publication date: December 15, 2016
    Inventors: Kevin J. Hemker, Timothy P. Weihs, Stephen Ryan, Longyu Zhao, Seunghyun Ha, Yong Zhang, Sen Lin, James K. Guest, Keith Sharp
  • Publication number: 20160341495
    Abstract: The present invention is directed to a manifold for directing cooling fluid and/or gas to a heat exchanger in a flow configuration designed to optimize heat transfer from the heat exchanger. The manifold can take many different forms such as a layered construction with distributed inlet paths, local outlet paths, a central collection changer and a path for fluid removal. The manifold can be formed from a metal, plastic, rubber, ceramic, or other heat resistant material known to or conceivable by one of skill in the art. The manifold can also be combined with any type of heat exchanger known to or conceivable by one of skill in the art to form a thermal management unit. To optimize overall properties such as low pressure drop, high heat transfer, and excellent temperature uniformity of the thermal management unit, the manifold can be graded, expanded and scaled as needed.
    Type: Application
    Filed: May 23, 2016
    Publication date: November 24, 2016
    Inventors: Kevin J. Hemker, Timothy P. Weihs, Stephen Ryan, Longyu Zhao, Seunghyun Ha, Yong Zhang, James K. Guest