Patents by Inventor James K. Koch

James K. Koch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7561027
    Abstract: A sensing device is provided. The sensing device includes two or more sensors for sensing one or more physical properties. A first sensor draws a first electrical signal, and similarly, a second sensor draws a second electrical signal. The first and second electrical signals correspond to values of the physical properties sensed by the respective first and second sensors. The sensing device further includes an electrical circuit connected to the first and second sensors. The electrical circuit draws a third electrical signal. The electrical circuit is configured such that the total electrical signal drawn by the sensing device is proportional to either the first or the second electrical signal, whichever has a higher value.
    Type: Grant
    Filed: October 26, 2006
    Date of Patent: July 14, 2009
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kais Kaizar Badami, James K. Koch
  • Publication number: 20080100434
    Abstract: A sensing device is provided. The sensing device includes two or more sensors for sensing one or more physical properties. A first sensor draws a first electrical signal, and similarly, a second sensor draws a second electrical signal. The first and second electrical signals correspond to values of the physical properties sensed by the respective first and second sensors. The sensing device further includes an electrical circuit connected to the first and second sensors. The electrical circuit draws a third electrical signal. The electrical circuit is configured such that the total electrical signal drawn by the sensing device is proportional to either the first or the second electrical signal, whichever has a higher value.
    Type: Application
    Filed: October 26, 2006
    Publication date: May 1, 2008
    Inventors: Kais Kaizar Badami, James K. Koch
  • Patent number: 7263620
    Abstract: A host processor card configured to be fitted into a server system includes a processor, and a memory coupled to the processor for storing an operating system. A power control line controls the power state of the host processor card. A graceful shutdown circuit is coupled to the processor and the power control line. The processor is configured to provide a graceful shutdown signal to the graceful shutdown circuit. The graceful shutdown circuit is configured to allow a graceful shutdown of the host processor card when the power control line indicates that the host processor card is to be powered down if the processor has provided the graceful shutdown signal.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: August 28, 2007
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kirk Bresniker, James K. Koch
  • Patent number: 7049796
    Abstract: A hot swap power delivery circuit. Specifically, the hot swap power delivery circuit is used for controlling current to a load. The hot swap power delivery circuit comprises a field effect transistor (FET), a ramp circuit, and a source follower feedback circuit. The FET comprises a gate, a source, and a drain. The ramp circuit is coupled to the gate of the FET, and is used for delivering current to a load that is coupled to the source of the FET. The source follower feedback circuit is coupled to the source and the gate and is used for de-linearizing an output voltage on said source affecting the delivery of the current.
    Type: Grant
    Filed: January 17, 2003
    Date of Patent: May 23, 2006
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: A. Michael Cherniski, James K. Koch
  • Patent number: 6891347
    Abstract: Various systems and methods are provided for cooling a cabinet. In one embodiment, a method is provided that comprises the steps of controlling a speed of the at least one cooling fan in response to a temperature of the cabinet, and, controlling the speed of the at least one cooling fan in response to a position of an access panel relative to the cabinet.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: May 10, 2005
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert W. Dobbs, James K. Koch, Jeremy I. Wilson
  • Patent number: 6822878
    Abstract: Various embodiments of a circuit board support arrangement and associated methods are provided that facilitate hot plug access to circuit components in a server, computer system or other device. A circuit board support arrangement comprises a first circuit board and a second circuit board that is attached to a pivot joint. The second circuit board is juxtaposed over and pivotal relative to the first circuit board, and, an electronic coupling is attached between the first circuit board and the second circuit board.
    Type: Grant
    Filed: October 9, 2002
    Date of Patent: November 23, 2004
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Robert W. Dobbs, James K. Koch, Thane M. Larson
  • Publication number: 20040177201
    Abstract: A hot swap power delivery circuit. Specifically, the hot swap power delivery circuit is used for controlling current to a load. The hot swap power delivery circuit comprises a field effect transistor (FET), a ramp circuit, and a source follower feedback circuit. The FET comprises a gate, a source, and a drain. The ramp circuit is coupled to the gate of the FET, and is used for delivering current to a load that is coupled to the source of the FET. The source follower feedback circuit is coupled to the source and the gate and is used for de-linearizing an output voltage on said source affecting the delivery of the current.
    Type: Application
    Filed: January 17, 2003
    Publication date: September 9, 2004
    Inventors: A. Michael Cherniski, James K. Koch
  • Publication number: 20040070932
    Abstract: Various systems and methods are provided for cooling a cabinet. In one embodiment, a method is provided that comprises the steps of controlling a speed of the at least one cooling fan in response to a temperature of the cabinet, and, controlling the speed of the at least one cooling fan in response to a position of an access panel relative to the cabinet.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 15, 2004
    Inventors: Robert W. Dobbs, James K. Koch, Jeremy I. Wilson
  • Publication number: 20040070955
    Abstract: Various embodiments of a circuit board support arrangement and associated methods are provided that facilitate hot plug access to circuit components in a server, computer system or other device. A circuit board support arrangement comprises a first circuit board and a second circuit board that is attached to a pivot joint. The second circuit board is juxtaposed over and pivotal relative to the first circuit board, and, an electronic coupling is attached between the first circuit board and the second circuit board.
    Type: Application
    Filed: October 9, 2002
    Publication date: April 15, 2004
    Inventors: Robert W. Dobbs, James K. Koch, Thane M. Larson
  • Publication number: 20030033546
    Abstract: A host processor card configured to be fitted into a server system includes a processor, and a memory coupled to the processor for storing an operating system. A power control line controls the power state of the host processor card. A graceful shutdown circuit is coupled to the processor and the power control line. The processor is configured to provide a graceful shutdown signal to the graceful shutdown circuit. The graceful shutdown circuit is configured to allow a graceful shutdown of the host processor card when the power control line indicates that the host processor card is to be powered down if the processor has provided the graceful shutdown signal.
    Type: Application
    Filed: August 7, 2001
    Publication date: February 13, 2003
    Inventors: Kirk Bresniker, James K. Koch
  • Patent number: 6175509
    Abstract: The present invention is a mounting platform for placement of a first device on a first plane in close proximity to a second device on a second plane. In the preferred embodiment, the first device is a voltage regulator circuit, the second device is a microprocessor, the first plane is the surface of the platform printed circuit board (PCB), and the second plane is the surface of the base printed circuit board. Typically the microprocessor is electrically coupled to the base printed circuit board and the voltage regulator circuit is electrically coupled to the platform printed circuit board. The mounting platform is mounted as a mezzanine over the base printed circuit board on the platform printed circuit board. Mounting the voltage regulator in this way allows the voltage regulator output to be placed adjacent to the microprocessor chip while at the same time minimizing the amount of valuable board space that is used.
    Type: Grant
    Filed: May 14, 1997
    Date of Patent: January 16, 2001
    Assignee: Hewlett-Packard Company
    Inventor: James K. Koch
  • Patent number: 6153946
    Abstract: A method and apparatus provide redundant power by connecting power supplies in a segment or ring. In a first embodiment, a redundant power supply is provided at the "top" of a redundant power segment, with one or more computer devices coupled "beneath" the redundant power supply. If the power supply of any device fails, that device "borrows" power from the device immediately upstream in the redundant power segment. If the power supply of the device immediately upstream in the redundant power segment no longer has sufficient capacity to power its own circuits, that device borrows power form the device immediately upstream from it. This process may continue until the power requirements of all devices are met by the excess capacities of all power supplies in devices upstream from the device with the failing power supply, or until the redundant power supply is reached.
    Type: Grant
    Filed: October 30, 1998
    Date of Patent: November 28, 2000
    Assignee: Hewlett-Packard Company
    Inventors: James K. Koch, Thane Larson
  • Patent number: 6024589
    Abstract: The present invention provides a reliable high current connector for connecting the ground and power planes of a first PCB to the ground and power planes of a second PCB. The power bus bar is comprised of a first conductive structure having a first and second surface, a second conductive structure having a first and second, and an inner insulative structure positioned between the first surface of the first conductive structure and the first surface of the second conductive structure. A fastening means, inserted through openings in the conductive structures, provides a secure, low resistance electrical connection from the first or second conductive structure of the bus bar to the electrical traces of the PCB. The high dielectric constant of the insulator provides distributed capacitance between the first conductive structure and the second conductive structure, lowering the AC impedance.
    Type: Grant
    Filed: May 14, 1997
    Date of Patent: February 15, 2000
    Assignee: Hewlett-Packard Company
    Inventors: John W. Hahn, IV, James K. Koch
  • Patent number: 6014326
    Abstract: The present invention provides a voltage transformer circuit which combines half-bridge topology with a current-mode control according to the present invention. The DC--DC converter circuit according to the present invention includes: a power transformer, where the primary side of the transformer includes a power winding and a balance winding and a means for injecting a correction current proportional to the amount of current flowing in the balance winding, where the means for injecting a correction current proportionate to the amount of current flowing in the balance winding including a means for sensing the amount of current in the balance winding. The correction current is injected in such a way so that current from the means for injecting a correction current is subtracted from the switch current lengthening the on-time of the switches in the half-bridge circuit thereby driving the bridge center tap back towards V.sub.in /2, preventing an unstable or runaway operating condition.
    Type: Grant
    Filed: October 27, 1998
    Date of Patent: January 11, 2000
    Assignee: Hewlett-Packard Company
    Inventor: James K. Koch
  • Patent number: 5793628
    Abstract: An N-phase power converter uses a ring oscillator to generate a series of switching signals having substantially equally distributed phase relationships with respect to one another. The ring oscillator is formed from an alternating string of inverters and RC networks with the voltage over each capacitor of each RC network provided to a phase comparator. The phase comparators shape a saw-tooth waveform present over each capacitor into a pulse-width-modulated switching signal that drive switches which alternately charge and discharge inductors. One terminal of each inductor is coupled to common node at which the converter output voltage is provided. A feedback unit generates a feedback signal is used to vary the pulse width of the switching signals.
    Type: Grant
    Filed: April 30, 1997
    Date of Patent: August 11, 1998
    Assignee: Hewlett-Packard Company
    Inventor: James K. Koch
  • Patent number: 4881906
    Abstract: A method for providing an electrical connection (via) between the top and bottom of a printed circuit board (PCB) is presented. An eyelet extends through a hole in the PCB. The top of the PCB has a first conductive layer. Around the hole the first conductive layer is shaped such that a conductive pad is isolated from the rest of the first conductive layer, except that spokes of the first conductive layer extend from the conductive pad to the rest of the first conductive layer. The eyelet is crimped such that crimped fingers or tabs of the eyelet cause the eyelet to be mechanically retained in the hole. The tabs are curved so that the tabs do not lie flat upon the conductive pad. The bottom of the PCB is then wave soldered so that a base of the eyelet is electrically coupled to a conductive layer on the bottom of the PCB and the tabs are electrically coupled to the conductive pad.
    Type: Grant
    Filed: February 25, 1988
    Date of Patent: November 21, 1989
    Assignee: Helwett-Packard Company
    Inventors: James C. Mackanic, Dawn M. Lelko, Steven A. Shugart, James K. Koch