Abstract: AC and/or DC testing of an optoelectronic device at the wafer level. In one example embodiment, a method of testing one or more devices at a wafer level includes generating a test signal; supplying the test signal to a single device on a wafer; providing an output of the single device to each of a plurality of devices on the wafer by way of a common electrical connection between the single device and the plurality of devices; providing an output of each of the plurality of devices to a corresponding return connection by way of electrical connections between the plurality of devices and the plurality of return connections; and receiving return currents from each of the return connections.

Abstract: A die having a semiconductor laser driven by a differential drive circuit is provided. The die provides a matched load to the drive circuit by also having a balancing load with an impedance, including both resistive and reactive components substantially identical to the load impedance of the semiconductor laser fabricated on the die. With the balancing load and semiconductor laser pair, the die prevents impedance-mismatch-induced drive problems that occur in high frequency operation, e.g., above about 1 GHz. The semiconductor laser may be a vertical cavity surface emitting laser (VCSEL), for example, as are used in high bandwidth applications like Gigabit Ethernet and Fibre Channel Applications. Furthermore, the die can form an array of balancing and semiconductor laser pairs.

Abstract: A die having a semiconductor laser driven by a differential drive circuit is provided. The die provides a matched load to the drive circuit by also having a balancing load with an impedance, including both resistive and reactive components, substantially identical to the load impedance of the semiconductor laser fabricated on the die. With the balancing load and semiconductor laser pair, the die prevents impedance-mismatch-induced drive problems that occur in high frequency operation, e.g., above about 1 GHz. The semiconductor laser may be a vertical cavity surface emitting laser (VCSEL), for example, as are used in high bandwidth applications like Gigabit Ethernet and Fibre Channel Applications. Furthermore, the die can form an array of balancing and semiconductor laser pairs.

Abstract: A versatile optical sensor method and assembly (200) is disclosed, providing cost-effective and readily adaptable optical sensor packaging while minimizing product variance, and comprising an integrally molded or single foundation piece (202) formed with a light source housing (302), a lens alignment feature (304) surrounding the light source housing, a mounting alignment feature (210), a sensor housing (206), and a barrier feature (204), further comprising a light source member (300) mounted to the foundation piece within the light source housing, a single lens member (214) enclosing the light source member and formed to engage with the lens alignment feature, and a detector member (208) mounted to the foundation piece within the sensor housing.