Abstract: The present disclosure provides AAV capsid proteins comprising a modification in the amino acid sequence and virus vectors comprising the modified AAV capsid protein. The disclosure also provides methods of administering the virus vectors and virus capsids of the disclosure to a cell or to a subject in vivo.

Abstract: The present disclosure provides AAV capsid proteins comprising a modification in the amino acid sequence and virus vectors comprising the modified AAV capsid protein. The disclosure also provides methods of administering the virus vectors and virus capsids of the disclosure to a cell or to a subject in vivo.

Abstract: The disclosure provides variant AAV capsid proteins and AAV capsids and virus vectors comprising the same. The virus vectors described herein may have increased transduction in a target cell of interest, such as a T-cell, compared to native AAV capsid sequences. The disclosure also provides methods of administering the virus vectors and virus capsids of the disclosure to a cell or to a patient in need thereof.

Abstract: The present disclosure provides AAV capsid proteins comprising a modification in the amino acid sequence and virus vectors comprising the modified AAV capsid protein. The disclosure also provides methods of administering the vims vectors and virus capsids of the disclosure to a cell or to a subject in vivo.

Abstract: The present disclosure provides AAV capsid proteins comprising a modification in the amino acid sequence and virus vectors comprising the modified AAV capsid protein. The disclosure also provides methods of administering the virus vectors and virus capsids of the disclosure to a cell or to a subject in vivo.

Abstract: An electrostatic clamp for use in a lithographic apparatus includes burls and an electrode surrounded by an insulator and/or a dielectric material between adjacent burls. In an embodiment, two or more layers of dielectric material are provided between adjacent burls and surround an electrode provided between adjacent burls. The electrostatic clamp may be used to clamp an object to an object support in a lithographic apparatus.

Abstract: A lithographic projection apparatus includes a beam production system to provide a beam of radiation, pattern the beam of radiation, and project the patterned beam onto a target portion of a substrate, a support table including protrusions to support an article, a detector to detect height deviations of the protrusions, a material removing device arranged to modify a height of the protrusion material, a controller coupled between the detector and the material removing device, wherein material removing device includes a removal tool selected from the group consisting of a mechanical polishing device, a magneto rheological finishing tool, and a single or multipoint diamond tool.

Abstract: An electrostatic clamp for use in a lithographic apparatus includes burls and an electrode surrounded by an insulator and/or a dielectric material between adjacent burls. In an embodiment, two or more layers of dielectric material are provided between adjacent burls and surround an electrode provided between adjacent burls. The electrostatic clamp may be used to clamp an object to an object support in a lithographic apparatus.

Abstract: A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.

Abstract: A lithographic projection apparatus includes a beam production system to provide a beam of radiation, pattern the beam of radiation, and project the patterned beam onto a target portion of a substrate, a support table including protrusions to support an article, a detector to detect height deviations of the protrusions, a material removing device arranged to modify a height of the protrusion material, a controller coupled between the detector and the material removing device, wherein material removing device includes a removal tool selected from the group consisting of a mechanical polishing device, a magneto rheological finishing tool, and a single or multipoint diamond tool.

Abstract: A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.

Abstract: A method of fabricating or preparing an optical component, such as a mirror, using an amorphous oxide coated substrate is presented. An amorphous oxide coating is applied to an optical substrate. An assessment of surface roughness of the coated surface is performed. The coated surface is polished based on the assessment. Initial assessments can be conducted and polishing can be performed based on those initial assessments prior to applying the coating to better prepare the surface for the coating. Each assessment can assess the surface's Mid-Spatial Frequency Roughness (MSFR), High-Spatial Frequency Roughness (HSFR), or both. The performing of the assessments, polishing and/or coating can be computer-controlled. This process is ideal in the fabrication of an optical component formed from a substrate with a near-zero coefficient of thermal expansion. An optical component fabricated in this manner is also presented.

Abstract: There is disclosed an expandable seal for sealing at least part of a wall of a well borehole, an expandable seal assembly comprising at least two such expandable seals, and a method of sealing at least part of a well borehole using such a seal. In one embodiment, the expandable seal (32) comprises an expandable tubular support member (34) and an inflatable seal element (36) mounted externally of the expandable tubular support member (34) for inflation radially outwardly into sealing engagement with at least part of a wall (50) of a well borehole (10). There is also disclosed a sealing apparatus for sealing at least one flow port in an expandable downhole tubular, in one embodiment, the sealing apparatus (332) comprising a sealing member (384) coupled to an expandable tubular (334), the sealing member (384) including a deformable portion (387) movable between a closed position preventing fluid flow through a flow port (356) and an open position permitting fluid flow through the flow port (356).

Abstract: A system and method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Abstract: A method for polishing the edges of a plurality of semiconductor wafers rotates a stack of wafers against a polish one or more pads such that both the wafer edges and the sides of the edges are polished to a mirror finish. The polish pad has a series of grooves through which the wafer edges are passed to polish the sides of the wafer edges, or two pads are used, one with grooves and one without grooves.

Abstract: A diaphragm assembly includes a pair of superposed flexible diaphragms adhesively secured to an annular spacer ring. The space between the diaphragms and the interior of the rings is filled preferably with de-ionized water. The resistivity of the water is monitored to detect conductivity changes upon leakage or diaphragm rupture when pumped materials or pump lubricant mix with the water. Diaphragm assembly and rupture detection methods are disclosed.

Abstract: A molding system and process is disclosed to interface with existing wire bonders using a single track design from the bonder through the molding process. During the molding operation, the bonded lead frame is transferred into the mold on a guide track system built into the mold chase. The mold closes and clamps the lead frame after which a compound charging system meters and injects a compound into the mold cavities. The mold is opened and the strip ejected and transferred out of the mold via internal guide tracks. A granular or pellet form of compound is use in the charging system.