Patents by Inventor James Klekotka

James Klekotka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • System and Method For Removing Post-Etch Residue
    Publication number: 20090211603
    Abstract: Embodiments of the invention provide post-etch cleaning systems and methods for removing post-etch residue material from one or more surfaces of semiconductor wafers. Embodiments of the invention may be applied to process wafers at different points in a manufacturing cycle, and the wafers can include one or more metal layers.
    Type: Application
    Filed: February 22, 2008
    Publication date: August 27, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Thomas Winter, James Klekotka
  • System and Method For Removing Edge-Bead Material
    Publication number: 20090211604
    Abstract: Embodiments of the invention provide edge-bead removal systems and methods for removing edge-bead material from one or more surfaces of semiconductor wafers. Embodiments of the invention may be applied to process wafers at different points in a manufacturing cycle, and the wafers can include one or more metal layers.
    Type: Application
    Filed: February 22, 2008
    Publication date: August 27, 2009
    Applicant: TOKYO ELECTRON LIMITED
    Inventors: Thomas Winter, James Klekotka