Abstract: An infusion pump for detecting an occlusion is provided. The memory stores instructions that cause the one or more processors to input data into a trained neural network, and generate an alert when the trained neural network outputs an amount of occlusion flags above a predetermined threshold.

Abstract: A system and method for automatically opening a heat bonded connection site between two conjoined tubing segments of a medical fluid path is provided. A pair of rollers is utilized to draw the connection site of the conjoined tubing segments between the rollers to compress the connection site with sufficient force to open the connection site. A guide in the form of an elongated groove is provided in a support surface of the system that properly aligns the seal line axis of the conjoined tubing segments relative to the rollers.

Abstract: A system and method for automatically opening a heat bonded connection site between two conjoined tubing segments of a medical fluid path is provided. A pair of rollers is utilized to draw the connection site of the conjoined tubing segments between the rollers to compress the connection site with sufficient force to open the connection site. A guide in the form of an elongated groove is provided in a support surface of the system that properly aligns the seal line axis of the conjoined tubing segments relative to the rollers.

Abstract: This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

Abstract: This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

Abstract: This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

Abstract: This invention relates to thermally sprayed coatings having an amorphous-nanocrystalline-microcrystalline composition structure, said thermally sprayed coating comprising from about 1 to about 95 volume percent of an amorphous phase, from about 1 to about 80 volume percent of a nanocrystalline phase, and from about 1 to about 90 volume percent of a microcrystalline phase, and wherein said amorphous phase, nanocrystalline phase and microcrystalline phase comprise about 100 volume percent of said thermally sprayed coating. This invention also relates to methods for producing the coatings, thermal spray processes for producing the coatings, and articles coated with the coatings. The thermally sprayed coatings of this invention provide enhanced wear and corrosion resistance for articles used in severe environments (e.g., landing gears, airframes, ball valves, gate valves (gates and seats), pot rolls, and work rolls for paper processing).

Abstract: A fishing lure includes a fishing lure body and a waterproof camera. The waterproof camera is operatively connected to the fishing lure body.

Abstract: An article of eyewear includes an eyeglass frame having an integrally formed camera enclosure, and an imaging sensor disposed within the camera enclosure. The eyeglass frame may have a camouflage pattern. A system for recording video includes an eyeglass frame having an integrally formed camera enclosure, an imaging sensor disposed within the camera enclosure, and a wireless transceiver disposed within the eyeglass frame. A method of documenting a hunt using an article of eyewear is provided. The method includes providing the article of eyewear, the article of eyewear comprising (a) an eyeglass frame having an integrally formed camera enclosure, (b) an imaging sensor disposed within the camera enclosure, and (c) wherein the eyeglass frame having a camouflage pattern. The method further includes activating a video recording functionality of the article of eyewear during the hunt and video recording the hunt using the article of eyewear.

Abstract: A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

Abstract: A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.

Abstract: A semiconductor device (10) includes a semiconductor die (20) and an inductor (30, 50) formed with a bonding wire (80) attached to a top surface (21) of the semiconductor die. The bonding wire is extended laterally a distance (L30, L150) greater than its height (H30, H50) to define an insulating core (31, 57). In one embodiment, the inductor is extended beyond an edge (35, 39) of the semiconductor die to reduce loading.

Abstract: A method and apparatus for providing machine guidance of all types of earthmoving machinery, other heavy equipment, and work site vehicles. The method and apparatus is applicable to any industrial work site such as a construction site, open pit mine, quarry operation, or landfill. The machinery, equipment, or vehicle is not required to be equipped with a positional receiver of any kind. The position of all machinery, equipment, and vehicles is performed by employing an array of 3D laser scanners (or any 3D digital imaging devices) positioned throughout the work site. 3D images of the work site are transmitted from the laser scanners to a remote processing unit via a data link or network. The processing unit analyzes the images and determines the position of the machinery, equipment and vehicles. The positions are transmitted to the machinery, equipment, and vehicles via the data link or network.

Abstract: A method of forming a leadframe and a semiconductor package using the leadframe facilitates selectively forming leads for the package. The leadframe is formed with a first portion of the leads extending from a panel of the leadframe into a molding cavity section of the leadframe. After encapsultaion, a portion of the leadframe panel is used to form a second portion of the leads that is external to the package body.

Abstract: An improved cutting insert for a cutting tool is designed from a blank of a regular geometry. The blank is designed so that an even number of channels are spaced equidistant around the periphery of the blank. The channels are elliptical in shape, and are arranged in alternating directions around the face of the insert. The grooves are designed to have a 7 degree relief angle.

Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).

Abstract: A method for forming a direct chip attach (DCA) device (1) includes attaching a chip (3) to a lead frame (2). Conductive studs (22) are attached to bonding pads (13) on the chip (3) and a flag (18) on lead frame (2). The chip (3) and flag (18) are enclosed with an encapsulating layer (4), and openings (6) are formed in an upper surface (7) to expose conductive studs (22). In one embodiment, a masking layer (51) is applied to the lead frame (2), and the structure is then placed in an electroless plating apparatus (61). While in the plating apparatus (61), an injection device (66) injects plating solution (71) towards the upper surface (7) and openings (6) to enhance the formation of barrier layers (24) on the conductive studs (22). Solder bumps (9) are then attached to barrier layers (24) through the openings (6).

Abstract: A automated pilling, snag, and fuzziness inspection and grading method and apparatus for quantifying, locating, and sizing pills, snags, and/or fuzz on fabric rolls or fabric sample swatches, which includes a fulcrum about which the fabric is bent, the fulcrum defining an apex portion in the fabric where the fulcrum contacts the fabric. A moving mechanism is provided for moving a length of the fabric across the fulcrum causing the apex portion to be temporally redefined along the length of the moving fabric. An illumination mechanism is provided for projecting a light upon one side of the temporally redefined apex portion and a recording device is also provided for recording a horizon image of the temporally redefined apex portion where the horizon image being back lit by the illumination mechanism.

Abstract: An integrated circuit (100) includes a semiconductor die (102, 103) and a semiconductor package (101) that has a leadframe (20, 40, 60, 80) for mounting the semiconductor die. The leadframe includes a first laminate (20) whose bottom surface (7) is patterned with leads (106, 107, 131, 132) of the integrated circuit. A second laminate (40) has a bottom surface (3) attached to a top surface (5) of the first laminate to electrically coupling the leads to the semiconductor die.

Abstract: A method of making a semiconductor device (100) by attaching a top surface of a first laminate (630) to a bottom surface of a second laminate (650) to form a leadframe (620) and mounting a semiconductor die (102) to the leadframe to form the semiconductor device. The first semiconductor die is encapsulated with a molding compound (108) and material is removed from the first laminate to form a mold lock (120) with the molding compound.