Abstract: A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

Abstract: A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.

Abstract: A printed circuit board has one or more layers on which electrically conductive traces reside. The printed circuit board also includes a thru-hole via formed in one or more of the layers. The thru-hole via includes at least two electrically conductive portions that are electrically isolated from each other, where the electrically conductive portions connect electrically to separate conductive traces.

Abstract: A circuit board construction which reduces unwanted electrical effects and lower signal quality resulting from the use of vias in relatively thick circuit boards or in circuit boards carrying signals of relatively high frequency. The circuit board includes a through-hole in the circuit board substrate for carrying a conductive via stub, the stub having an inherent stub characteristic; and a compensation element, such as a surface mount capacitor, positioned on the substrate such that when the stub is carried by the through-hole the inherent stub characteristic is adjusted to define a compensated stub characteristic.

Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.