Abstract: An integrated circuit chip and method of manufacturing the same which includes the use of a wafer cap having depressions therein for aligning with micro-electro-mechanical systems included in said integrated circuit when said cap is placed over a wafer containing numerous integrated circuits, the wafer is then cut, after the wafer cap is bound to the wafer. The wafer cap may also include a piezo-resistive element thereon for measuring pressure around the hermetically sealed MEMS.

Abstract: An in-flight entertainment system provides live video/audio programming to passengers and operators over an aircraft video/audio distribution system. The programming signals are derived from intermediate frequency (IF) signals that are produced by frequency downconverting satellite broadcast signals and supplied over a pair of IF signal output cables. The control signals and the DC power used in the frequency downconversion process are received over the same IF signal output cables, but in a reverse direction. A bias-T connector is provided in each of the IF signal output cables to extract out the control signals and the DC power.

Abstract: An in-flight entertainment system provides live video/audio programming to passengers and operators over an aircraft video/audio distribution system. The programming signals are derived from satellite broadcast signals that may be in either circular polarized form or linear polarized form. The broadcast signals are collected by two probes and extracted as right and left circular polarized signals. The right and left circular polarized signals are converted into either circular or linear polarized IF signals, and the IF signals are processed by a receiver/decoder unit to produce the live video/audio programming signals.

Abstract: A high-Q precision integrated reversibly trimmable singleband oscillator and tunable multiband oscillator are presented that overcome the problems laser trimming and solid state switches. This is accomplished using micro-electromechanical system (MEMS) technology to integrate an amplifier and its tunable LC network on a common substrate. The LC network can be configured to provide a very narrow bandwidth frequency response which peaks at one or more very specific predetermined frequencies without de-Qing the oscillator.

Abstract: Power amplifiers having reactive networks (such as classes C, C-E, E and F) employ tunable reactive devices in their reactive networks, with the reactive devices respective reactance values capable of being adjusted by means of respective control signals. The tunable reactive devices are made from micro-electromechanical (MEM) devices capable of being integrated with the control circuitry needed to produce the control signals and other amplifier components on a common substrate. The reactive components have high Q values across their adjustment range, enabling the amplifier to produce an output with a low harmonic content over a wide range of input signal frequencies, and a frequency agile, high quality output. The invention can be realized on a number of foundry technologies.

Abstract: A frequency stabilizer circuit in the form of a charge-pump phase-lock loop utilizing a MEMS capacitance device, preferably a tunable MEMS capacitor or a MEMS capacitor bank, which more rapid and with a greater precision determine the phase and frequency of a carrier signal so that it can be extracted, providing an information signal of interest. Such MEMS devices have the added advantage of providing linear capacitance, low insertion losses, higher isolation and high reliability, they run on low power and permit the entire circuit to be fabricated on a common substrate. The use of the MEMS capacitance device reduces unwanted harmonics generated by the circuit's charge pump allowing the filtering requirements to be relaxed or perhaps eliminated.

Abstract: The passive components of a transceiver, such as transmit/receive switches, antennas, inductors, capacitors and resonators, are integrated together on a common substrate to form an integrated passive transceiver section, which, in combination with other components, provides a highly reliable, low-cost, high-performance transceiver. Micro-electromechanical (MEM) device fabrication techniques are used to provide low-loss, high-performance switches and low-loss, high-Q reactive components, and enable the passive transceiver section's high level of integration. The passive components are preferably integrated on a low-cost glass substrate, with transceiver circuits containing active components fabricated on a separate substrate; the separate substrates are interconnected to implement the RF/analog and analog/digital interface portions of a transceiver. Additional MEM switching devices permit multiple, parallel signal paths to be switched in and out of the transceiver circuitry as needed to optimize performance.

Abstract: A high Q MEMS capacitor that can be continuously tuned with a large tuning ratio or reversibly trimmed using an electrostatic force. The tunable capacitor has a master/slave structure in which a control voltage is applied to the master (control) capacitor to set the capacitance of the slave (signal) capacitor to which an RF signal is applied via a suspended mechanical coupler. The master-slave structure reduces tuning error by reducing the signal capacitor's surface area and increasing its spring constant, and may eliminate the need for discrete blocking inductors by electrically isolating the control and signal capacitors. The trimmable capacitor provides an electrostatic actuator that selectively engages a stopper with teeth on a tunable capacitor structure to fix the trimmed capacitance.

Abstract: A monolithically integrated switched capacitor bank using MEMS technology that is capable of handling GHz signal frequencies in both the RF and millimeter bands while maintaining precise digital selection of capacitor levels over a wide tuning range. Each MEMS switch includes a cantilever arm that is affixed to the substrate and extends over a ground line and a gapped signal line. An electrical contact is formed on the bottom of the cantilever arm positioned above and facing the gap in the signal line. A top electrode atop the cantilever arm forms a control capacitor structure above the ground line. A capacitor structure, preferably a MEMS capacitor suspended above the substrate at approximately the same height as the cantilever arm, is anchored to the substrate and connected in series with a MEMS switch.

Abstract: An integrated, tunable inductance network features a number of fixed inductors fabricated on a common substrate along with a switching network made up of a number of micro-electromechanical (MEM) switches. The switches selectably interconnect the inductors to form an inductance network having a particular inductance value, which can be set with a high degree of precision when the inductors are configured appropriately. The preferred MEM switches introduce a very small amount of resistance, and the inductance network can thus have a high Q. The MEM switches and inductors can be integrated using common processing steps, reducing parasitic capacitance problems associated with wire bonds and prior art switches, increasing reliability, and reducing the space, weight and power requirements of prior art designs.

Abstract: An integrated, variable gain microwave frequency power amplifier comprises a number of individual amplifier stages which contain microwave frequency active devices. Each stage is fed with a common input signal, and the individual stage outputs are connected to respective micro-electromechanical (MEM) switches which, when closed, connect the individual outputs together to form the power amplifier's output. The power amplifier's gain is determined by the number of outputs connected together. The preferred switch provides low insertion loss and excellent electrical isolation, enabling a number of amplifier stages to be efficiently interconnected to provide a wide dynamic range power amplifier. The switches are preferably integrated on a common substrate with the active devices, eliminating the need for wire bonds and reducing parasitic capacitances.

Abstract: This invention relates to a reverse osmosis membrane module for separating a selected fluid component from a feed stock. The module comprises a mandrel having an axial passageway forming a flow path for the selected fluid component through the mandrel. A flow guide means is attached to the mandrel and forms a channel for the selected fluid component as it flows through the membrane module. A plurality of generally rectangular membrane envelopes are joined to the flow guide mandrel and are formed from a plurality of elongated permeate collector sheets each forming a flow path for the selected fluid component from the outer periphery of the envelope to the flow guide. A plurality of folded sheets of support material with each sheet having predetermined membrane areas where reverse osmosis occurs are joined to the collector sheets so as to form the membrane envelope. Each sheet of support material is formed such that there are no fold lines on the membrane areas where reverse osmosis occurs.

Abstract: End portions of the choke valve shaft project outside the carburetor mixing passage duct. One end portion is connected with an actuator mechanism that is responsive to either engine speed or manifold pressure. The other projects into a cylindrical chamber on the carburetor body that houses a spirally coiled bimetal strip having its inner end connected with the shaft, its outer end engageable with circumferentially spaced abutments. The chamber is communicated with the crankcase breather and also with the mixing duct through a flapper valve, so that the bimetal is subjected to the temperature of vented crankcase vapors.