Patents by Inventor James L. Carper

James L. Carper has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Planarized plastic package modules for integrated circuits
    Patent number: 6603195
    Abstract: A semiconductor module includes a semiconductor chip, a lead frame having lead fingers, and a down set member within an encapsulant for reduce warpage and providing a more planar package by balancing thermal stress between the lead fingers and the encapsulant. The down set member can be a bent portion of the lead frame. It can also be a separate body, such as a dummy semiconductor chip.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: August 5, 2003
    Assignee: International Business Machines Corporation
    Inventors: David V. Caletka, James L. Carper, John P. Cincotta, Kibby B. Horsford, Gary H. Irish, John J. Lajza, Jr., Gordon C. Osborne, Jr., Charles R. Ramsey, Robert M. Smith, Michael J. Vadnais
  • Leadframe having contact pads defined by a polymer insulating film
    Patent number: 5776801
    Abstract: A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
    Type: Grant
    Filed: February 23, 1996
    Date of Patent: July 7, 1998
    Assignee: International Business Machines Corporation
    Inventors: James L. Carper, Gary H. Irish, Sheldon C. Rieley, Robert M. Smith, Robert L. Jackson
  • Leadframe having contact pads defined by a polymer insulating film
    Patent number: 5608260
    Abstract: A leadframe has conductive fingers with an insulating film located on a first portion of the fingers. The insulating film has openings into which contact pads formed of a noble metal are provided. Pads on a chip are wire bonded to these contact pads on the leadframe. The first portion is encapsulated in a molded package. The structure inhibits silver migration, provides insulation between wires and leadframe, and provides improved adhesion between plastic package and leadframe. A single insulating film with openings for providing the contact pads provides all these features.
    Type: Grant
    Filed: December 30, 1994
    Date of Patent: March 4, 1997
    Assignee: International Business Machines Corporation
    Inventors: James L. Carper, Gary H. Irish, Sheldon C. Rieley, Robert M. Smith, Robert L. Jackson