Abstract: An approach to repairing broken or missing leads of integrated microcircuit assemblies includes the use of a repair enhancement device (30). The enhancement device (30) is welded to an attachment end of a replacement lead (20), where the enhancement device (30) has a larger contact surface area than the attachment end of the replacement lead (20). The enhancement device (30) is then attached to a housing (40) of the microcircuit assembly such that the surface area of the enhancement device (30) provides significant mechanical reinforcement to the replacement lead. Welding the enhancement device (30) to the replacement lead (20) eliminates problems associated with subsequent soldering operations. An attachment region (42) is also etched out of the housing (40) adjacent to a conductive element (44) of the housing, where the conductive element (44) provides a conductive pathway through the housing to the underlying microcircuit.

Abstract: A rotary coupler having two housing portions, one housing portion being rotatable with respect to the other housing portion includes two fluid channels including a water channel extending axially the length of the coupler and a slurry channel disposed radially outwardly of the water channel. A flow directing surface is disposed within the rotatable housing portion to direct a slurry of abrasive particles and air through the housing to the outlet in a continuous manner substantially without disruption of the compositional integrity of the slurry.