Abstract: A system for extending a vehicular alarm system includes a base unit and a remote unit. The system is configured to extend the vehicular alarm system to an accessory or equipment secured to, carried by (e.g., outside or inside) or in proximity to an automobile and/or to equipment secured to the accessory. The base unit is configured to be carried by the automobile and to communicate with the vehicular alarm system. The base unit may be configured to mimic activation of a sensor of the vehicular alarm system in a manner that can activate the vehicular alarm system. The remote unit is configured to be carried by the accessory, and may sense removal of the accessory from the automobile, opening of the accessory and/or removal of equipment from the accessory. Methods for extending a vehicular alarm system to operate with one or more accessories are also disclosed, as are methods for detecting and providing an alarm when an accessory or equipment secured by the accessory is undesirably disturbed.

Abstract: A system for extending a vehicular alarm system includes a base unit and a remote unit. The system is configured to extend the vehicular alarm system to an accessory or equipment secured to, carried by (e.g., outside or inside) or in proximity to an automobile and/or to equipment secured to the accessory. The base unit is configured to be carried by the automobile and to communicate with the vehicular alarm system. The base unit may be configured to mimic activation of a sensor of the vehicular alarm system in a manner that can activate the vehicular alarm system. The remote unit is configured to be carried by the accessory, and may sense removal of the accessory from the automobile, opening of the accessory and/or removal of equipment from the accessory. Methods for extending a vehicular alarm system to operate with one or more accessories are also disclosed, as are methods for detecting and providing an alarm when an accessory or equipment secured by the accessory is undesirably disturbed.

Abstract: A dispenser for pills, candy or other items includes one or more pods that are configured to hold an item, such as a pill, a piece of candy or the like, to be inserted into an individual's mouth and to enable the individual to remove the item by squeezing the item out of the pod with his or her mouth or otherwise. Such a dispenser may be configured to be worn by an individual or secured to an object that is readily accessible to an individual or his or her mouth. Methods for providing, dispensing and taking (i.e., consuming) items, such as pills or candy, are also disclosed.

Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.

Abstract: Disclosed are embodiments of a method of removing patterned circuit structures from the surface of a semiconductor wafer. The method embodiments comprise blasting the surface of the semiconductor wafer with particles so as to remove substantially all of the patterned circuit structures. The blasting process is followed by one or more grinding, polishing and/or cleaning processes to remove any remaining circuit structures, to remove any lattice damage and/or to achieve a desired smoothness across the surface of the semiconductor wafer.

Abstract: A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process of directing the particles at the wafer is controlled to stop directing the particles when substantially all of the patterned structures are removed from the wafer. This process also comprises selecting the particles to have a size equal to or less than 3 microns. For example, the particles can comprise aluminum oxide, silicon oxide, cerium, and/or a plastic. By maintaining the particle size equal to 3 microns or less, the blasting produces a substantially smooth wafer surface, thereby omitting the need for subsequent wafer polishing. Further, the wafers produced by such processing do not exhibit the highly stress lattice and fragile nature of wafers processed by wet processing.

Abstract: A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.

Abstract: Disclosed are embodiments of a method of removing patterned circuit structures from the surface of a semiconductor wafer. The method embodiments comprise blasting the surface of the semiconductor wafer with particles so as to remove substantially all of the patterned circuit structures. The blasting process is followed by one or more grinding, polishing and/or cleaning processes to remove any remaining circuit structures, to remove any lattice damage and/or to achieve a desired smoothness across the surface of the semiconductor wafer.

Abstract: A method holds wafers that contain patterned structures using a particle blasting tool. Next, the method directs particles at the patterned structures, such that the particles contact the patterned structures with a predetermined velocity and remove the patterned structures. This process of directing the particles at the wafer is controlled to stop directing the particles when substantially all of the patterned structures are removed from the wafer. This process also comprises selecting the particles to have a size equal to or less than 3 microns. For example, the particles can comprise aluminum oxide, silicon oxide, cerium, and/or a plastic. By maintaining the particle size equal to 3 microns or less, the blasting produces a substantially smooth wafer surface, thereby omitting the need for subsequent wafer polishing. Further, the wafers produced by such processing do not exhibit the highly stress lattice and fragile nature of wafers processed by wet processing.

Abstract: An electrical cord retainer apparatus adapted for securing the interconnection of two or more electrical cords is disclosed. The retainer includes a flexible housing fitted with a longitudinally non-stretchable retainer strip. The housing is adapted to be encased about a connection of electrical power cords and to provide a high coefficient of friction fit between the interior of the housing and the elecrical cord plugs sufficient to retain those plugs in intercooperation notwithstanding the application of forces to the cords at a distant location. The housing is fitted with a connection structure such as a zipper which is adapted to close the housing about the structure of electrical cord for purposes of creating this friction union.