Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns.The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract: Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400.degree. C. at 65.degree.-200.degree. C./second.

Abstract: The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection means electrically interconnecting each assembly. The electrical interconnection means is formed from an elastomeric interposer. The elastomeric interposer is formed from an elastomeric material having a plurality of electrical conductors extending therethrough, either in a clustered or un-clustered arrangement. The electrical interconnection means is fabricated having a plurality of apertures extending therethrough.

Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.

Abstract: Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

Abstract: The present invention is directed to a structure for packaging electronic devices, such as semiconductor chips, in a three dimensional structure which permits electrical signals to propagate both horizontally and vertically. The structure is formed from a plurality of assemblies. Each assembly is formed from a substrate having disposed on at least one surface a plurality of electronic devices. Each assembly is disposed in a stack of adjacent assemblies. Between adjacent assemblies there is an electrical interconnection electrically interconnecting each assembly. The electrical interconnection formed from an elastomeric interposer having a plurality of apertures extending therethrough. The array of apertures corresponds to the array of electronic devices on the substrates. The aperture and electrical interconnection is disposed over the array of electronic devices so that the electrical interconnection between adjacent electronic devices.

Abstract: Hot roll fusers are made with a matrix resin which is an elastomer having a glass transition between 90.degree. C. and 160.degree. C. and a structure represented by the formula X--Ar--Y--Ar--X wherein Ar is an aromatic ring structure, Y is O, S, C.dbd.O, SO.sub.2, C(CH.sub.3).sub.2, C(CF.sub.3).sub.2, CH.sub.2 or (CF.sub.2).sub.n and X is --O--C.tbd.N, --C.tbd.

Abstract: Block copolymers of polyimide and poly (phenylquinoxaline) have been synthesized. They are useful, particularly as dielectric layers in thin film multilayer structures. The most preferred embodiments are formed from polyimides which are those from pyromellitic dianhydride and oxydianiline. The most preferred poly (phenylquinoxaline) is a monofunctional oligomer, which yields the best microstructure.

Abstract: A roll for hot fusing having a coating comprising a cross-linked elastomeric random copolymer of dimethylsiloxane and diphenylsiloxane and three additives, (1) from 40 to 55% by weight of small zinc oxide particles, (2) from 5 to 10% by weight of small graphite particles and (3) from 1 to 5% by weight of ceric dioxide particles.