Patents by Inventor James L. Knighten

James L. Knighten has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7791896
    Abstract: A circuit board includes power reference layers and a capacitor provided between the power reference layers such that a shorter dimension of the capacitor defines a space between the power reference layers. The capacitor has plural conductive plates and plural dielectric layers.
    Type: Grant
    Filed: June 20, 2007
    Date of Patent: September 7, 2010
    Assignee: Teradata US, Inc.
    Inventors: Jun Fan, James L. Knighten, Norman W. Smith
  • Patent number: 7652364
    Abstract: A printed circuit board includes at least two conductive traces, each having a first portion and a second portion. The printed circuit board also includes a cross-over section that includes two electrically conductive portions, each connecting electrically to the first and second portions of a corresponding one of the conductive traces, such that the conductive traces in their first portions lie on opposite sides of each other as they do in their second portions.
    Type: Grant
    Filed: November 28, 2006
    Date of Patent: January 26, 2010
    Assignee: Teradata US, Inc.
    Inventors: James L. Knighten, Norman Smith, Jun Fan
  • Patent number: 7626828
    Abstract: A circuit board includes reference plane layers and a dielectric between the reference plane layers. A resistive element is also provided between the reference plane layers to provide a resistive path between the reference plane layers. Optimally, a decoupling capacitor is provided having a first electrode electrically connected to the resistive element, and a second electrode electrically connected to one of the reference plane layers.
    Type: Grant
    Filed: July 30, 2003
    Date of Patent: December 1, 2009
    Assignee: Teradata US, Inc.
    Inventors: Arthur R. Alexander, Jun Fan, James L. Knighten, Norman W. Smith
  • Patent number: 7435912
    Abstract: A circuit board includes multiple signal layers, in which signal lines are routed, and reference plane layers, in which power reference planes are provided. To connect signal lines at different signal layers, vias are passed through at least one signal layer and at least one reference plane layer. At the one signal layer, a first clearance (or anti-pad) is defined around the via. At the reference plane layer, a second clearance is defined around the via. The second clearance is larger in size than the first clearance to match the impedance of the via as closely as possible with the impedance of a signal line the via is electrically connected to.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: October 14, 2008
    Assignee: Teradata US, Inc.
    Inventors: Arthur R. Alexander, James L. Knighten, Jun Fan
  • Patent number: 7271348
    Abstract: A circuit board includes first and second reference plane layers. A first decoupling capacitor is mounted to a surface of the first reference plane layer, and a second decoupling capacitor is mounted to a surface of the second reference plane layer. Vias extend generally along a first direction through the circuit board. The first and second decoupling capacitors are aligned generally along the first direction to increase an amount of space through which the vias are extendable.
    Type: Grant
    Filed: September 25, 2003
    Date of Patent: September 18, 2007
    Assignee: NCR Corp.
    Inventors: Jun Fan, Arthur R. Alexander, Norman W. Smith, James L. Knighten
  • Publication number: 20070138617
    Abstract: A printed circuit board includes multiple layers on which electrically conductive traces reside, where at least two of the electrically conductive traces each has a first portion formed on one layer of the printed circuit board and a second portion formed on another layer of the printed circuit board. The printed circuit board also includes a thru-hole via that includes at least two electrically conductive portions electrically isolated from each other, such that each of the electrically conductive portions connects electrically to both the first and second portions of a corresponding one of the electrically conductive traces.
    Type: Application
    Filed: November 28, 2006
    Publication date: June 21, 2007
    Inventors: James L. Knighten, Jun Fan, Norman Smith
  • Publication number: 20070138626
    Abstract: A printed circuit board includes at least two conductive traces, each having a first portion and a second portion. The printed circuit board also includes a cross-over section that includes two electrically conductive portions, each connecting electrically to the first and second portions of a corresponding one of the conductive traces, such that the conductive traces in their first portions lie on opposite sides of each other as they do in their second portions.
    Type: Application
    Filed: November 28, 2006
    Publication date: June 21, 2007
    Inventors: James L. Knighten, Norman Smith, Jun Fan
  • Patent number: 7216422
    Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.
    Type: Grant
    Filed: December 8, 2004
    Date of Patent: May 15, 2007
    Assignee: NCR Corp.
    Inventors: Jun Fan, James L. Knighten, Arthur R. Alexander, Norman W. Smith
  • Patent number: 7196906
    Abstract: A circuit board includes multiple segments, with a first segment having plural signal layers and a second segment having plural signal layers. Signal paths provided by signal layers of the first segment exhibit higher speed signal transmission capability than signal paths provided by the signal layers of the second segment.
    Type: Grant
    Filed: August 15, 2003
    Date of Patent: March 27, 2007
    Assignee: NCR Corp.
    Inventors: Arthur R. Alexander, James L. Knighten, Jun Fan, Norman W. Smith
  • Patent number: 7045719
    Abstract: A circuit board includes multiple signal layers, in which signal lines are routed, and power reference plane layers, in which power reference planes (e.g., power supply voltage or ground) are provided. Vias are passed through at least one signal layer and at least one power reference plane layer, or alternatively, vias are passed through at least two power reference plane layers. In one arrangement, a first clearance is defined around the via at the signal layer and a second clearance is defined around the via at the power reference plane layer. The second clearance is larger in size than the first clearance to match or tailor the impedance of the via as closely as possible with the impedance of the signal line that the via is electrically connected to.
    Type: Grant
    Filed: October 21, 2002
    Date of Patent: May 16, 2006
    Assignee: NCR Corp.
    Inventors: Arthur R. Alexander, James L. Knighten, Jun Fan
  • Patent number: 6912135
    Abstract: A supplemental shield is used to cover a radiation leakage path through a chassis of the system. The supplemental shield is attached to at least one surface in the system to cover the radiation leakage path. In one arrangement, the supplemental shield has an adhesive portion to attach the supplemental shield to the at least one surface.
    Type: Grant
    Filed: November 13, 2002
    Date of Patent: June 28, 2005
    Assignee: NCR Corporation
    Inventors: James L. Knighten, Jun Fan
  • Patent number: 6887105
    Abstract: A method and apparatus to provide a shield assembly for a connector, with the shield assembly having a cover to enclose the connector and a neck portion adapted to surround an outer surface of a portion of the cable. An inner surface of the neck portion makes contact with the outer surface of the cable. When the cable carries a high frequency signal, a capacitive impedance is provided between the neck portion and an outer shield of the cable to reduce electromagnetic signal leakage. Alternatively, the neck portion can make electrical contact with the cable shield, either by use of elements protruding from the inner surface of the neck portion or by removing an insulating jacket of the cable.
    Type: Grant
    Filed: June 14, 2001
    Date of Patent: May 3, 2005
    Assignee: NCR Corporation
    Inventors: James L. Knighten, Arthur R. Alexander
  • Patent number: 6844505
    Abstract: A circuit board includes an assembly having first and second power reference plane layers, and an insulator layer between the first and second power reference plane layers. Discrete decoupling capacitors are further provided with the assembly. Additional layers are provided above and below the assembly.
    Type: Grant
    Filed: November 4, 2002
    Date of Patent: January 18, 2005
    Assignee: NCR Corporation
    Inventors: Jun Fan, James L. Knighten, Arthur R. Alexander, Norman W. Smith
  • Patent number: 6785625
    Abstract: A test mechanism includes test equipment to measure frequency-domain data, such as scattering or S parameters. The S parameters are transformed to a different type of network parameters, such as transmission or T parameters. Contributions of test fixtures can be easily removed for the overall T-parameter matrix of a device under test connected in cascade with the test fixture. The test mechanism provides accurate measurement of a device under test represented by a multi-port (greater than two ports) network that is cascaded with another multi-port network representing the test fixture.
    Type: Grant
    Filed: May 14, 2002
    Date of Patent: August 31, 2004
    Assignee: NCR Corporation
    Inventors: Jun Fan, Arthur R. Alexander, James L. Knighten, Norman W. Smith
  • Publication number: 20030024717
    Abstract: A method and apparatus to provide a shield assembly for a connector, with the shield assembly having a cover to enclose the connector and a neck portion adapted to surround an outer surface of a portion of the cable. An inner surface of the neck portion makes contact with the outer surface of the cable. When the cable carries a high frequency signal, a capacitive impedance is provided between the neck portion and an outer shield of the cable to reduce electromagnetic signal leakage. Alternatively, the neck portion can make electrical contact with the cable shield, either by use of elements protruding from the inner surface of the neck portion or by removing an insulating jacket of the cable.
    Type: Application
    Filed: June 14, 2001
    Publication date: February 6, 2003
    Inventors: James L. Knighten, Arthur R. Alexander
  • Patent number: 6434312
    Abstract: A shield for fiber optic connectors and cables is provided. This shield minimizes the effects of EMI (electromagnetic interference) either radiating from or radiating into an electronic enclosure. Embodiments include this shield as an integral part of the enclosure chassis, a separate shield, or integrated into the fiber optic cable and connector.
    Type: Grant
    Filed: December 17, 1999
    Date of Patent: August 13, 2002
    Assignee: NCR Corporation
    Inventor: James L. Knighten