Patents by Inventor James LaGassa

James LaGassa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink and cover for tab integrated circuits
    Patent number: 5280409
    Abstract: An apparatus providing a heat sink and protective cover for a Tape Automated Bonding ("TAB") integrated circuit mounted on a printed circuit board. The apparatus is comprised of a printed circuit board with a plurality of thermal vias drilled through it. The TAB integrated circuit is mounted on the printed circuit board over the thermal vias. The vias draw then heat generated by the TAB integrated circuit to the other side of the printed circuit board. A heat sink is then placed over the thermal vias on the opposite side of the board to dissipate the heat. The heat sink is held in place by a spring clip which hooks onto a molded plastic cover placed over the TAB integrated circuit. The apparatus is easy to manufacture and efficiently dissipates the heat generated by TAB integrated circuits.
    Type: Grant
    Filed: October 9, 1992
    Date of Patent: January 18, 1994
    Assignee: Sun Microsystems, Inc.
    Inventors: Erich Selna, Ehsan Ettehadieh, James LaGassa