Abstract: A system and method for accessing and using one or more networked services of a cloud computing infrastructure by a user of a client computer includes an identity-based access management system that is configured to receive a request for a session via an API to use a specific service of the one or more networked services. A credential store includes a credential library that receives and stores credentials for authorizing and enabling the session with the specific service of the one or more networked services. A target service is configured to authorize and enable the session based on the received credentials. A secrets management system is configured to authenticate the user and the client computer to access and use the specific service authorized by the target service, and to generate a lease to a credential that is transmitted to the client computer to authorize the session with the specific service.

Abstract: A system for accessing computing elements of a cloud computing infrastructure includes a dynamic host interface associated with an identity-based access management system. The dynamic host interface is configured to receive host catalogs from components of the cloud computing infrastructure, each host catalog including one or more host sets, each of the one or more host sets including references to one or more hosts, where each of the one or more hosts represents an addressable computing element. The system further includes a plugin-based hosts model in a memory, and being configured to receive, from the dynamic host interface, the host catalogs for identity-based access to the one or more host sets by a user of a client computer to address the addressable computing element represented by the host.

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

Abstract: The present invention provides a method of treating melanoma, in a subject in need of such a treatment, a therapeutically effective amount of a compound of the formula: I or a pharmaceutically acceptable salt thereof, a solvate thereof, or a combination thereof, wherein X1 and X2 are as defined herein. Methods of the invention can further include administering other oncolytic agents and/or immunotherapy in treating a patient with melanoma.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna board may include a plurality of antenna patches coupled to a dielectric material and a plurality of pedestals extending from a face of the dielectric material and at least partially embedded in the dielectric material.

Abstract: Disclosed herein are integrated circuit (IC) packages, antenna boards, antenna modules, and communication devices (e.g., for millimeter wave communications). For example, in some embodiments, an antenna module may include: a logic die; a radio frequency front-end (RFFE) die in electrical communication with the logic die; and an antenna patch, wherein the RFFE die is closer to the antenna patch than the logic die is to the antenna patch.

Abstract: A system, method, and computer program product for self-identification of a device. The disclosure utilizes generation of a public/private key pair, within the device itself, and completes at least a portion of an authentication process within the device itself using a securely stored private key that never leaves the device. By not transferring the private key away from the device, potential vulnerabilities of known systems due to transfer of identification information during or after manufacturing is effectively eliminated.

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.

Abstract: An adjustable mandibular repositioning appliance including first and second connecting members and a link arm which is pivotable about an axis wherein protrusive positioning of the mandible is provided by relative positioning of the link arm along aid axis, to kits and couplings for making a readily adjustable mandibular appliance, to a system for providing a readily adjustable mandibular repositioning appliance and methods of use.

Abstract: A system, method, and computer program product for self-identification of a device. The disclosure utilizes generation of a public/private key pair, within the device itself, and completes at least a portion of an authentication process within the device itself using a securely stored private key that never leaves the device. By not transferring the private key away from the device, potential vulnerabilities of known systems due to transfer of identification information during or after manufacturing is effectively eliminated.

Abstract: Disclosed herein are tunable capacitor arrangements in integrated circuit (IC) package substrates, as well as related methods and devices. For example, in some embodiments, an IC package substrate may include a first embedded capacitor, a second embedded capacitor, and a fuse electrically coupled between the first embedded capacitor and the second embedded capacitor such that when the fuse is in a closed state, the first embedded capacitor and the second embedded capacitor are connected in parallel, and when the fuse is in an open state, the first embedded capacitor and the second embedded capacitor are not connected in parallel.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are antenna boards, antenna modules, and communication devices. For example, in some embodiments, an antenna module may include: an antenna patch support including a flexible portion; an integrated circuit (IC) package coupled to the antenna patch support; and an antenna patch coupled to the antenna patch support.

Abstract: Disclosed herein are radio frequency (RF) front-end structures, as well as related methods and devices. In some embodiments, an RF front-end package may include an RF package substrate including an embedded passive circuit element. At least a portion of the embedded passive circuit element may be included in a metal layer of the RF package substrate. The RF package substrate may also include a ground plane in the metal layer.

Abstract: Disclosed herein are integrated circuit (IC) structures that may be included in package substrates. For example, disclosed herein are passive components in package substrate, wherein the passive components include at least one non-circular via and at least one pad in contact with the at least one non-circular via, and the passive components include an inductor or a capacitor. Other embodiments are also disclosed.