Abstract: Aspects of an apparatus for characterizing an integrated circuit device are provided. The apparatus includes a first connection circuit configured to selectively couple at least one terminal of the integrated circuit device to a termination circuit for AC loopback and a second connection circuit configured to selectively couple the at least one terminal of the integrated circuit device to a test resource for DC characterization. In another aspect, an apparatus for characterizing an integrated circuit is provided. The apparatus includes a board configured to couple to the integrated circuit and a resource to characterize the integrated circuit. The board includes means for detecting physical misalignment of the board and the resource to characterize the integrated circuit.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A high speed flexible interconnect cable for an electronic assembly includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The cable can be coupled to electronic components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure. The cable can be coupled to destination components using a variety of connection techniques. The cable can also be terminated with any number of known or standardized connector packages.

Abstract: A host device in a data communication system provides a dual-function clock/enable signal at a single output port shared by at least one asynchronous target device and at least one synchronous target device. In the asynchronous operating mode, the host device generates an asynchronous gated-clock signal that facilitates read/write functions of one or more selected asynchronous target devices. In the synchronous operating mode, the host device generates a synchronous clock-gate signal that facilitates read/write functions of one or more selected synchronous target devices. The target devices and the host device share both a common data bus and a common clock bus. The host device supplies the dual-function clock/enable signal on the common clock bus.

Abstract: An optical transport network data frame structure is configured to provide an in-band data channel. The in-band channel data is contained in the data frame space that would otherwise be allocated to forward error correction (“FEC”) bytes. Consequently, the provision of the in-band data channel does not affect the number of client data bytes contained in the data frame structure. In accordance with a practical embodiment, the data frame structure is compliant with Intra Domain Interface (IaDI) specifications set forth in International Telecommunication Union Telecommunication Standardization Sector (ITU-T) Recommendation Guide For Recommendation, G.709/Y.1331.

Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.

Abstract: A data communication system transports a sequence of digital data frames that convey client input data encoded with secondary data. The system can utilize known, proprietary, or future techniques for digital data encoding, digital watermarking, data encryption, or the like. The secondary data can be frame alignment data, private data intended only for certain destination devices, and/or other data types. In a practical embodiment, the data frames are compliant with optical transport networks.

Abstract: An optical transport network data frame structure is configured to provide an in-band data channel. The in-band channel data is contained in the data frame space that would otherwise be allocated to forward error correction (“FEC”) bytes. Consequently, the provision of the in-band data channel does not affect the number of client data bytes contained in the data frame structure. In accordance with a practical embodiment, the data frame structure is compliant with IaDI specifications set forth in ITU-T Recommendation G.709/Y.1331.

Abstract: A high speed flexible interconnect cable includes a number of conductive layers and a number of dielectric layers. Conductive signal traces, located on the conductive layers, combine with the dielectric layers to form one or more high speed electrical transmission line structures. The transmission line structure may be realized as a grounded coplanar waveguide structure, a microstrip structure, a stripline structure, or the like. The cable can be coupled to destination components using a variety of connection techniques, e.g., direct bonding to a circuit substrate, direct soldering to a flip chip, mechanical attachment to a component, or integration with a circuit substrate. The cable can also be terminated with any number of known or standardized connector packages, e.g., SMA, GPPO, or V connectors.