Patents by Inventor James Lionel Panian

James Lionel Panian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240094792
    Abstract: Aspects relate to techniques for controlling signal voltage levels across a wired data link for data communication between apparatuses. A first device can advertise multiple supported signal voltage levels to a peer device connected by the wired data link. The devices can implement the same signal voltage level(s) or different signal voltage levels. The peer devices can compare and select a compatible signal voltage level for data communication. The first device can provide a signal voltage indication signal that is configurable to a plurality of voltage levels corresponding to a plurality of signal voltages. At least one of the plurality of voltage levels can indicate that the first device can operate the data link at a plurality of signal voltages. In some examples, the wired data link can be a peripheral component interconnect express (PCIe) link.
    Type: Application
    Filed: September 21, 2022
    Publication date: March 21, 2024
    Inventors: James Lionel PANIAN, John EATON, Lakshmi BASKARAN, Shrinivas GOPALAN UPPILI
  • Publication number: 20230056239
    Abstract: Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivity may dissipate excess heat from the cable into the environment. In another aspect, a USB cable connector or the USB receptacle portion of a device may include a thermoelectric heat pump. The thermoelectric heat pump may move excess heat from the cable assembly or receptacle into a portion of the cable assembly or device that dissipates the heat into the environment.
    Type: Application
    Filed: November 1, 2022
    Publication date: February 23, 2023
    Inventors: Lalan Jee MISHRA, Richard Dominic WIETFELDT, James Lionel PANIAN, Georgios Konstantinos PAPARRIZOS
  • Patent number: 11520727
    Abstract: Alternate sideband signaling in a Peripheral Component Interconnect (PCI) express (PCIE) link may be enabled over existing sideband lines in a conventional PCIE link. For example, the default sideband communication of PCIE may be changed to a Universal Asynchronous receiver/transmitter (UART), line multiplex UART (LM-UART), serial peripheral interface (SPI), I2C, or I3C mode of communication. This change may be negotiated between the host and slave of the communication link, with a transition occurring after the negotiation concludes. The new mode of communication may include or encode the conventional PCIE sideband signals.
    Type: Grant
    Filed: November 19, 2020
    Date of Patent: December 6, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Mohit Kishore Prasad, Richard Dominic Wietfeldt, James Lionel Panian
  • Patent number: 11515676
    Abstract: Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivity may dissipate excess heat from the cable into the environment. In another aspect, a USB cable connector or the USB receptacle portion of a device may include a thermoelectric heat pump. The thermoelectric heat pump may move excess heat from the cable assembly or receptacle into a portion of the cable assembly or device that dissipates the heat into the environment.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: November 29, 2022
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Richard Dominic Wietfeldt, James Lionel Panian, Georgios Konstantinos Paparrizos
  • Publication number: 20220156220
    Abstract: Alternate sideband signaling in a Peripheral Component Interconnect (PCI) express (PCIE) link may be enabled over existing sideband lines in a conventional PCIE link. For example, the default sideband communication of PCIE may be changed to a Universal Asynchronous receiver/transmitter (UART), line multiplex UART (LM-UART), serial peripheral interface (SPI), I2C, or I3C mode of communication. This change may be negotiated between the host and slave of the communication link, with a transition occurring after the negotiation concludes. The new mode of communication may include or encode the conventional PCIE sideband signals.
    Type: Application
    Filed: November 19, 2020
    Publication date: May 19, 2022
    Inventors: Lalan Jee Mishra, Mohit Kishore Prasad, Richard Dominic Wietfeldt, James Lionel Panian
  • Publication number: 20210265786
    Abstract: Thermal mitigation features may be included in a Universal Serial Bus (USB) cable assembly or in the USB receptacle portion of a device. In one aspect, one or both ends of a USB cable jacket may have greater thermal conductivity than the portion between them. The portion having the greater thermal conductivity may dissipate excess heat from the cable into the environment. In another aspect, a USB cable connector or the USB receptacle portion of a device may include a thermoelectric heat pump. The thermoelectric heat pump may move excess heat from the cable assembly or receptacle into a portion of the cable assembly or device that dissipates the heat into the environment.
    Type: Application
    Filed: February 21, 2020
    Publication date: August 26, 2021
    Inventors: Lalan Jee MISHRA, Richard Dominic WIETFELDT, James lionel PANIAN, Georgios Konstantinos PAPARRIZOS
  • Patent number: 10963035
    Abstract: A system for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems, while maintaining both lower level physical layer (PHY) pin requirements and upper layer functionality being capable of both differential and single-ended signaling modes optimized for power savings. An apparatus includes an integrated circuit (IC) adapted to be connected to a Peripheral Component Interconnect (PCI) Express (PCIe) bus. The IC includes a control block selects between differential and single-ended signaling for the PCIe bus. The single-ended signaling is transmitted through existing pins of the IC that are coupled to the PCIe bus for differential signaling when single-ended signaling is selected for the PCIe bus.
    Type: Grant
    Filed: October 9, 2018
    Date of Patent: March 30, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, James Lionel Panian, Richard Dominic Wietfeldt, Mohit Kishore Prasad, Amit Gil, Shaul Yohai Yifrach
  • Patent number: 10922252
    Abstract: Extended message signaled interrupts (MSI) data are disclosed. In one aspect, MSI bits are modified to include a system level identifier. In an exemplary aspect, an upper sixteen bits of the MSI message data are modified to be the system level identifier. By providing the system level identifier within the MSI message data, an interrupt controller can verify the interrupt source.
    Type: Grant
    Filed: June 16, 2016
    Date of Patent: February 16, 2021
    Assignee: QUALCOMM Incorporated
    Inventors: Ofer Rosenberg, Amit Gil, James Lionel Panian, Piyush Patel, Shaul Yohai Yifrach
  • Publication number: 20200192838
    Abstract: Extended message signaled interrupts (MSI) data are disclosed. In one aspect, MSI bits are modified to include a system level identifier. In an exemplary aspect, an upper sixteen bits of the MSI message data are modified to be the system level identifier. By providing the system level identifier within the MSI message data, an interrupt controller can verify the interrupt source.
    Type: Application
    Filed: February 24, 2020
    Publication date: June 18, 2020
    Inventors: Ofer Rosenberg, Amit Gil, James Lionel Panian, Piyush Patel, Shaul Yohai Yifrach
  • Publication number: 20200089645
    Abstract: Security techniques for a Peripheral Component Interconnect (PCI) express (PCIE) system include a transport layer protocol (TLP) packet that has a prepended TLP prefix indicating the security features of the TLP packet and an integrity check value (ICV) appended to the TLP packet. The ICV is based on the TLP packet and any TLP prefixes including a security prefix. At a receiver, if the ICV does not match, then the receiver has evidence that the TLP packet may have been subjected to tampering. Further, the TLP packet may be encrypted to prevent snooping, and this feature would be indicated in the TLP prefix. Still further, the TLP prefix may include a counter that may be used to prevent replay attacks. PCIE contemplates flexible TLP prefixes, and thus, the standard readily accommodates the addition of a TLP prefix which indicates the security features of the TLP packet.
    Type: Application
    Filed: September 13, 2019
    Publication date: March 19, 2020
    Inventors: Yiftach Benjamini, Lior Amarilio, Amit Gil, James Lionel Panian, Dafna Shaool
  • Patent number: 10585734
    Abstract: Fast invalidation in peripheral component interconnect (PCI) express (PCIe) address translation services (ATS) initially utilize a fast invalidation request to alert endpoints that an address is being invalidated with a fast invalidation synchronization command that causes the endpoints to flush through any residual read/write commands associated with any invalidated address and delete any associated address entries in an address translation cache (ATC). Each endpoint may send a synchronization complete acknowledgement to the host. Further, a tag having an incrementing identifier for each invalidation request may be used to determine if an endpoint has missed an invalidation request.
    Type: Grant
    Filed: December 18, 2018
    Date of Patent: March 10, 2020
    Assignee: Qualcomm Incorporated
    Inventors: James Lionel Panian, Derek Rohde
  • Publication number: 20190205278
    Abstract: Fast invalidation in peripheral component interconnect (PCI) express (PCIe) address translation services (ATS) initially utilize a fast invalidation request to alert endpoints that an address is being invalidated with a fast invalidation synchronization command that causes the endpoints to flush through any residual read/write commands associated with any invalidated address and delete any associated address entries in an address translation cache (ATC). Each endpoint may send a synchronization complete acknowledgement to the host. Further, a tag having an incrementing identifier for each invalidation request may be used to determine if an endpoint has missed an invalidation request.
    Type: Application
    Filed: December 18, 2018
    Publication date: July 4, 2019
    Inventors: James Lionel Panian, Derek Rohde
  • Patent number: 10310585
    Abstract: A replacement physical layer (PHY) for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems is disclosed. In one aspect, an analog PHY of a conventional PCIe system is replaced with a digital PHY. The digital PHY is coupled to a media access control (MAC) logic by a PHY interface for PCIe (PIPE) directly. In further exemplary aspects, the digital PHY may be a complementary metal oxide semiconductor (CMOS) PHY that includes a serializer and a deserializer. Replacing the analog PHY with the digital PHY allows entry and exit from low-power modes to occur much quicker, resulting in substantial power savings and reduced latency. Because the digital PHY is operable with low-speed communication, the digital PHY can maintain sufficient bandwidth that communication is not unnecessarily impacted by digital logic of the digital PHY.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: June 4, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Shaul Yohai Yifrach, Amit Gil, James Lionel Panian, Ofer Rosenberg, Richard Dominic Wietfeldt
  • Publication number: 20190107882
    Abstract: A system for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems, while maintaining both lower level physical layer (PHY) pin requirements and upper layer functionality being capable of both differential and single-ended signaling modes optimized for power savings. An apparatus includes an integrated circuit (IC) adapted to be connected to a Peripheral Component Interconnect (PCI) Express (PCIe) bus. The IC includes a control block selects between differential and single-ended signaling for the PCIe bus. The single-ended signaling is transmitted through existing pins of the IC that are coupled to the PCIe bus for differential signaling when single-ended signaling is selected for the PCIe bus.
    Type: Application
    Filed: October 9, 2018
    Publication date: April 11, 2019
    Inventors: Lalan Jee MISHRA, James Lionel PANIAN, Richard Dominic WIETFELDT, Mohit Kishore PRASAD, Amit GIL, Shaul Yohai YIFRACH
  • Patent number: 10241953
    Abstract: A hybrid virtual general purpose input/output (VGI) architecture is provided including a pair of devices coupled through a high-speed cable. The architecture enables a device to communicate sideband signals through the high-speed cable using two pins coupled to respective interconnects of a bus. In an aspect, the architecture may implement link selection without protocol consolidation where the device may configure the two pins for I2C (or I3C) signaling or VGI signaling. In another aspect, the architecture may implement link bridging with protocol consolidation where the device may transmit (or receive) I2C (or I3C) signals through the high-speed cable using a VGI communication protocol.
    Type: Grant
    Filed: August 4, 2016
    Date of Patent: March 26, 2019
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Richard Dominic Wietfeldt, James Lionel Panian
  • Patent number: 10089275
    Abstract: Communicating transaction-specific attributes in a peripheral component interconnect express (PCIe) system is disclosed. A PCIe system includes a host system and at least one PCIe endpoint. The PCIe endpoint is configured to determine one or more transaction-specific attributes that can improve efficiency and performance of a predefined host transaction. In this regard, in one aspect, the PCIe endpoint encodes the transaction-specific attributes in a transaction layer packet (TLP) prefix of at least one PCIe TLP and provides the PCIe TLP to the host system. In another aspect, a PCIe root complex (RC) in the host system is configured to detect and extract the transaction-specific attributes from the TLP prefix of the PCIe TLP received from the PCIe endpoint. By communicating the transaction-specific attributes in the TLP prefix of the PCIe TLP, it is possible to improve efficiency and performance of the PCIe system without violating the existing PCIe standard.
    Type: Grant
    Filed: May 31, 2016
    Date of Patent: October 2, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Ofer Rosenberg, Amit Gil, James Lionel Panian, Piyush Patel, Shaul Yohai Yifrach
  • Patent number: 9971666
    Abstract: System, methods, and apparatuses are described that facilitate a first device to transmit/retransmit a message to a second device. The first device transmits a first message to the second device. The first device then receives a second message and identifies a bit of the second message indicating an originator of the second message. If the bit indicates the first device as the originator of the second message, then the second message is an echo of the first message. Reception of the echo indicates that the second device is in a sleep state. Accordingly, the first device waits for the second device to wake and retransmits the first message to the second device to ensure that any packets lost during the original transmission of the first message (when the second device was asleep) are now retransmitted while the second device is known to be awake.
    Type: Grant
    Filed: March 3, 2016
    Date of Patent: May 15, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Richard Dominic Wietfeldt, James Lionel Panian, George Alan Wiley, Amit Gil
  • Publication number: 20180120921
    Abstract: A replacement physical layer (PHY) for low-speed Peripheral Component Interconnect (PCI) Express (PCIe) systems is disclosed. In one aspect, an analog PHY of a conventional PCIe system is replaced with a digital PHY. The digital PHY is coupled to a media access control (MAC) logic by a PHY interface for PCIe (PIPE) directly. In further exemplary aspects, the digital PHY may be a complementary metal oxide semiconductor (CMOS) PHY that includes a serializer and a deserializer. Replacing the analog PHY with the digital PHY allows entry and exit from low-power modes to occur much quicker, resulting in substantial power savings and reduced latency. Because the digital PHY is operable with low-speed communication, the digital PHY can maintain sufficient bandwidth that communication is not unnecessarily impacted by digital logic of the digital PHY.
    Type: Application
    Filed: October 6, 2017
    Publication date: May 3, 2018
    Inventors: Shaul Yohai Yifrach, Amit Gil, James Lionel Panian, Ofer Rosenberg, Richard Dominic Wietfeldt
  • Patent number: 9933834
    Abstract: A dual-data-rate interface is provided that includes a transmitter driving a transmit pin coupled to a receive pin of a receiver. The receiver drives its receive pin with cycles of a fetch clock. The transmitter responds to each edge of the fetch clock by transmitting a bit over the transmit pin to the receiver.
    Type: Grant
    Filed: September 24, 2015
    Date of Patent: April 3, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Richard Dominic Wietfeldt, James Lionel Panian
  • Patent number: 9880965
    Abstract: A virtual GPIO interface is provided that receives a transmit set of GPIO signals from a processor. The virtual GPIO interface transmits a portion of the transmit set of GPIO signals over GPIO pins in a conventional fashion. However, the virtual GPIO interface provides a remaining portion of the transmit set of GPIO signals to a finite state machine that serializes the GPIO signals in the remaining portion into frames of virtual GPIO signals. A modified UART interface transmits the frames over a UART transmit pin responsive to cycles of a UART oversampling clock.
    Type: Grant
    Filed: September 10, 2015
    Date of Patent: January 30, 2018
    Assignee: QUALCOMM Incorporated
    Inventors: Lalan Jee Mishra, Richard Dominic Wietfeldt, James Lionel Panian, Radu Pitigoi-Aron