Patents by Inventor James LORENZO

James LORENZO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Biodegradable and recyclable barrier paper laminate
    Patent number: 11913173
    Abstract: A biodegradable and recyclable barrier paper laminate comprising an inorganic barrier layer against permeation.
    Type: Grant
    Filed: October 7, 2021
    Date of Patent: February 27, 2024
    Assignee: The Procter & Gamble Company
    Inventors: Emily Charlotte Boswell, Uwe Bolz, Patti Jean Kellett, James Terry Knapmeyer, Pier-Lorenzo Caruso, Lee Mathew Arent, John Moncrief Layman, Jack Alan Hunter
  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 11112103
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: November 8, 2018
    Date of Patent: September 7, 2021
    Assignees: Covestro LLC, Thermal Solution Resources, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • TWO SHOT INJECTION MOLDING PROCESS FOR THERMOPLASTIC PARTS
    Publication number: 20200001508
    Abstract: Two shot injection molding processes are disclosed for making thermoplastic parts of two different compositions, the second shot composition having a higher thermal conductivity than the first, and the mold cavity surface temperature is greater than 70° C., preferably 70-100° C. In embodiments, the cavity surface temperature is within 20° C. of the Vicat temperature for the composition being injected, the cavity pressure is between 20 and 150 MPa, and the melt temperature of the second shot material is 200-400° C., or 250-340° C. The resulting molded part provides for improved thermal conductivity between the two molded compositions.
    Type: Application
    Filed: March 7, 2017
    Publication date: January 2, 2020
    Inventors: James LORENZO, James ROBBINS, Jessee MCCANNA, Terry DAVIS
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20190093874
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: November 8, 2018
    Publication date: March 28, 2019
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • In mold electronic printed circuit board encapsulation and assembly
    Patent number: 10156352
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Grant
    Filed: April 16, 2014
    Date of Patent: December 18, 2018
    Assignees: COVESTRO LLC, THERMAL SOLUTION RESOURCES, LLC
    Inventors: Terry G. Davis, David Rocco, Mikhail Sagal, Jessee McCanna, Nicolas Sunderland, James Lorenzo, Mark Matsco, Kevin Dunay
  • IN MOLD ELECTRONIC PRINTED CIRCUIT BOARD ENCAPSULATION AND ASSEMBLY
    Publication number: 20160084490
    Abstract: The present invention provides an assembly comprising a thermally conductive thermoplastic polymer as a heat sink to provide thermal management for an electrical/electronic component and a reaction injection molded (RIM) polyurethane to replace the potting compound typically used in such assemblies. In addition to replacing the potting compound, the cured polyurethane forms the part, such as the base of the LED bulb, which heretofore has been a separate component, thus reducing the number of components and saving a production step.
    Type: Application
    Filed: April 16, 2014
    Publication date: March 24, 2016
    Inventors: Terry G. DAVIS, David ROCCO, Mikhail SAGAL, Jessee MCCANNA, Nicolas SUNDERLAND, James LORENZO, Mark MATSCO, Kevin DUNAY