Patents by Inventor James Lupton Hedrick, Jr.

James Lupton Hedrick, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5660921
    Abstract: A multilevel electronic package comprising at least two levels, each level including a poly(aryl ether benzimidazole), a polymide and copper. A process of preparing this package is disclosed. Several novel poly(aryl ether benzimidazoles) useful in preparing this package are also set forth.
    Type: Grant
    Filed: May 23, 1995
    Date of Patent: August 26, 1997
    Assignee: IBM Corporation
    Inventors: Kie Yeung Ahn, James Lupton Hedrick, Jr., Jeffrey William Labadie, Kang-Wook Lee, Robert James Twieg, Alfred Viehbeck, George Frederick Walker