Abstract: Improved vie-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multi-layer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract: Improved via-filling compositions for producing conductive vias in circuitized ceramic substrates, particularly multilayer substrates, without cracking and/or loss of hermetic sealing. The via-filling compositions comprise pastes containing a mixture of (a) ceramic and/or glass spheres of substantially- uniform diameter between about 0.5 and 6 .mu.m, (b) conductive metal particles or spheres having a maximum dimension or diameter between about 1/3 and 1/4 of the diameter of the ceramic and/or glass spheres, and (c) a binder vehicle. The formed conductive via bodies comprise a uniform conductive skeletal network of sintered metal particles densely packed within a uniform matrix of the co-sintered ceramic and/or glass spheres, which matrix is hermetically fused and integrated with ceramic layers forming the wall of the via in the ceramic circuit substrate.

Abstract: The bonding of an external metal taken from the group of Cu, Ni, Fe, Ti, Mo and alloys thereof to an oxide ceramic substrate is accomplished through the use of an ionic diffusion accommodating metal oxide where the ionic diffusion oxide metal is taken from the group of Fe, Mn, Ti and the combination 33 Ni 67 V. The bond adhesion and processing parameters can be enhanced by addition of Li, Ni, Cu, Co and Mo and the ceramic can be at least one member of the group of glass, pyrex, Al.sub.2 O.sub.3 and SiO.sub.2 glass.

Abstract: In a process for sintering a metal member bonded to a substrate during which the metal member undergoes densification at a temperature which is different from the curing temperature of the substrate, an improvement is provided which comprises causing the densification temperature of the metal member to be closer to or identical with the curing temperature of the substrate by adding to said metal member prior to sintering an amount of organometallic compound which undergoes decomposition before the densification temperature of the metal member has been reached to provide under the sintering conditions employed a densification temperature-modifying amount of a metal or metal oxide which can be the same as or different from the metal of the aforesaid metal member.The improved sintering process of the present invention is particularly adapted for use in the fabrication of multilayer ceramic substrates which serve as circuit modules for seminconductor chips.

Abstract: A process is described for the sintering and densification of ceramic materials containing hydrocarbon materials to produce ceramic bodies substantially free from carbonaceous residues of such hydrocarbon materials by compacting ceramic particles and a binder containing a pyrolysis catalyst selected from the group consisting of nickel and palladium ions, heating in a low oxygen atmosphere to a temperature in the range of 350.degree. to 780.degree. C. to remove the carbonaceous residue and further heating the material to produce a sintered, dense ceramic body.

Abstract: Improved zinc silicate phosphor particles are made by using silicic acid particles in the range from 0.7 to 10 micrometers coated with Mn.sub.2 O.sub.3 .multidot.xH.sub.2 O and then a layer of ZnO particles about an order of magnitude smaller which are fired to form the phosphors. The particle size is held within the range preferred and preferably is even narrower. The particles are not milled or mechanically crushed. Instead, the ZnO powder prevents agglomeration during firing. Baths are provided for formation of the particles prior to firing. Brightness and persistance are improved over conventional phosphors.

Abstract: Luminescent material may be fabricated of silicon dioxide containing as activators approximately up to 1% monovalent copper together with up to approximately 15% aluminum. The material may be in powder form, it may be in glass form or it may be produced by electrolytic ingredient transfer. The material is luminescent in the blue range from 380-580 nanometers.