Patents by Inventor James M. Burnett

James M. Burnett has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5995361
    Abstract: This invention relates in general to capacitors including one or more layers of dielectric material wherein at least one of the layers including a multiaxially oriented lyotropic liquid crystalline polymer (LCP) film. The present invention also provides lyotropic LCPs films having less than 0.5% residual ionic contaminants and a method of preparing such films and capacitors including such films. In preferred embodiments, the invention further provides a capacitor wherein the liquid crystalline polymer film has less than 0.5% residual ionic contaminants.
    Type: Grant
    Filed: January 10, 1997
    Date of Patent: November 30, 1999
    Assignee: Foster-Miller, Inc.
    Inventors: Kumaraswamy Jayaraj, James M. Burnett, Joseph W. Piche, Paul J. Glatkowski, Richard W. Lusignea
  • Patent number: 5836197
    Abstract: An improved machine tool assembly for use with sizing and shaping machines comprising a translating body, a stationary body, and an interconnecting structure is provided. The translating body can be provided in the form of a mandrel or jaw assembly while the stationary body, which cooperates with the translating body to deform a work piece, can be provided in the form of a ring or a housing assembly having a plurality of radially movable fingers. The interconnecting structure joins the translating body and the stationary body so that the same can be removed from the sizing machine as a single unit. The interconnecting structure also has an axial, angular, and/or radial alignment member(s) which maintain the relative alignment between the translating body and the stationary body during installation and/or removal of the machine tool assembly from a sizing machine.
    Type: Grant
    Filed: December 16, 1996
    Date of Patent: November 17, 1998
    Assignee: McKee Machine Tool Corp.
    Inventors: Ralph E. McKee, James M. Burnett
  • Patent number: 5137618
    Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and imaging of dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using imaging techniques. The method may also be used in single-sided and double-sided circuit board fabrication and for inner layers used in multilayer circuit boards.
    Type: Grant
    Filed: June 7, 1991
    Date of Patent: August 11, 1992
    Assignee: Foster Miller, Inc.
    Inventors: James M. Burnett, Richard J. Mathisen
  • Patent number: 4668038
    Abstract: An integral safety-grade pressurizer heater power supply connector assembly which can withstand severe environmental conditions such as a loss of coolant accident and main steam-line break while providing uninterrupted power to a pressurizer heater in a pressurized water nuclear reactor system.
    Type: Grant
    Filed: October 1, 1985
    Date of Patent: May 26, 1987
    Assignee: The Babcock & Wilcox Company
    Inventors: James M. Burnett, Rohit M. Daftari, Randolph M. Reyns