Patents by Inventor James M. Elliott
James M. Elliott has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 10887978Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.Type: GrantFiled: April 30, 2019Date of Patent: January 5, 2021Assignee: Raytheon CompanyInventors: Brian W. Johansen, Justin Kasemodel, James M. Elliott
-
Publication number: 20190261502Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.Type: ApplicationFiled: April 30, 2019Publication date: August 22, 2019Inventors: Brian W. Johansen, Justin Kasemodel, James M. Elliott
-
Patent number: 10292255Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.Type: GrantFiled: May 18, 2016Date of Patent: May 14, 2019Assignee: Raytheon CompanyInventors: Brian W. Johansen, Justin Kasemodel, James M. Elliott
-
Patent number: 9942975Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.Type: GrantFiled: October 5, 2015Date of Patent: April 10, 2018Assignee: RAYTHEON COMPANYInventors: James M. Elliott, James S. Wilson, David E. Swernofsky
-
Publication number: 20170339779Abstract: Heat transfer devices and systems for thermally coupling electrical components to a heatsink can comprise one or more all-metal heat transfer device(s) thermally coupling at least one electrical component to a heatsink. A heat transfer device can comprise a metal cup attached to a metal heatsink, and a metal piston and a compliant device disposed in the cup. The piston is forcible to a secured first position, upon reflowing solder, while compressing the compliant device. Upon reflowing solder again, the compliant device causes the piston to bias and attach to the electrical component to provide an all-metal thermal path and absorb assembly tolerances to avoid using thermal gap fillers. A method is provided for thermally coupling a heatsink to a plurality of electrical components via a plurality of all-metal, expandable heat transfer devices.Type: ApplicationFiled: May 18, 2016Publication date: November 23, 2017Inventors: Brian W. Johansen, Justin Kasemodel, James M. Elliott
-
Publication number: 20170099726Abstract: An apparatus includes a printed circuit board (PCB) including a surface that has a layer of circuitry. The apparatus also includes a heat sink configured to receive heat from the PCB. The apparatus further includes a thermally-conductive post configured to remove the heat from the PCB to the heat sink via thermal conduction through a thermal path. The thermal path is substantially orthogonal to the surface of the PCB. The post includes an end configured to physically couple to the layer of circuitry.Type: ApplicationFiled: October 5, 2015Publication date: April 6, 2017Inventors: James M. Elliott, James S. Wilson, David E. Swernofsky
-
Patent number: 9554488Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.Type: GrantFiled: April 18, 2014Date of Patent: January 24, 2017Assignee: Raytheon CompanyInventors: Cary C. Kyhl, Scott M. Heston, James M. Elliott
-
Patent number: 9468103Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.Type: GrantFiled: October 8, 2014Date of Patent: October 11, 2016Assignee: RAYTHEON COMPANYInventors: Robert S. Isom, Justin Kasemodel, James M. Elliott
-
Publication number: 20160105963Abstract: A transition apparatus for connecting first and second circuit boards is provided. The transition apparatus includes a beam having edges and a length defined between the edges, beam circuitry running along the length of the beam and connections disposed at the edges of the beam to connect the beam circuitry with respective circuitry of the first and second circuit boards at respective interior, opposing surfaces thereof.Type: ApplicationFiled: October 8, 2014Publication date: April 14, 2016Inventors: Robert S. Isom, Justin Kasemodel, James M. Elliott
-
Publication number: 20150305191Abstract: A surface mount device is disclosed. The surface mount device can include an electronic component operable in an electronic circuit. The surface mount device can also include a heat transfer component thermally coupled to the electronic component. The heat transfer component can have a heat transfer surface configured to interface with a heat sink. In addition, the surface mount device can include a resiliently flexible lead to electrically couple the electronic component to a circuit board. The resiliently flexible lead can be configured to resiliently deflect to facilitate a variable distance of the heat transfer surface from the circuit board, to enable the heat transfer surface and a planar heat transfer surface of another similarly configured surface mount device to be substantially aligned for interfacing with the heat sink.Type: ApplicationFiled: April 18, 2014Publication date: October 22, 2015Applicant: Raytheon CompanyInventors: Cary C. Kyhl, Scott M. Heston, James M. Elliott
-
Patent number: 8704144Abstract: A dual speed Read-Out Integrated Circuit employs a native pixel array with associated high resolution integration circuits for each pixel and a superpixel array created within the native pixel array by combination of native pixels for charge sharing integration in reduced resolution integration circuits simultaneously with the integration of the high resolution integration circuits. Switching control for readout of the high resolution integration circuits is accomplished at a first frame rate and switching control for readout of the reduced resolution integration circuits is accomplished at a second higher frame rate.Type: GrantFiled: October 27, 2011Date of Patent: April 22, 2014Assignee: Teledyne Scientific & Imaging, LLCInventors: James M. Elliott, Mark Alan Massie
-
Publication number: 20120104231Abstract: A dual speed Read-Out Integrated Circuit employs a native pixel array with associated high resolution integration circuits for each pixel and a superpixel array created within the native pixel array by combination of native pixels for charge sharing integration in reduced resolution integration circuits simultaneously with the integration of the high resolution integration circuits. Switching control for readout of the high resolution integration circuits is accomplished at a first frame rate and switching control for readout of the reduced resolution integration circuits is accomplished at a second higher frame rate.Type: ApplicationFiled: October 27, 2011Publication date: May 3, 2012Applicant: NOVA RESEARCH, INC.Inventors: James M. Elliott, Mark Alan Massie
-
Publication number: 20030075937Abstract: A disc handling tool includes a housing and first and second arms which are pivotally mounted to the housing in spaced relation to each other. A first gripper is located adjacent a distal end of the first arm. A second gripper is located adjacent a distal end of the second arm. The first and second grippers fit about a peripheral edge of an associated disc with the grippers being tangential to the peripheral edge of the associated disc. A locking member is provided for locking at least one of the first and second arms in one end position in relation to the housing.Type: ApplicationFiled: February 4, 2002Publication date: April 24, 2003Applicant: Maf-Nif IncorporateInventors: Jerzy Perkitny, James Groman, James M. Elliott
-
Patent number: 6547296Abstract: A disc handling tool includes a housing and first and second arms which are pivotally mounted to the housing in spaced relation to each other. A first gripper is located adjacent a distal end of the first arm. A second gripper is located adjacent a distal end of the second arm. The first and second grippers fit about a peripheral edge of an associated disc with the grippers being tangential to the peripheral edge of the associated disc. A locking member is provided for locking at least one of the first and second arms in one end position in relation to the housing.Type: GrantFiled: February 4, 2002Date of Patent: April 15, 2003Assignee: Mag-Nif IncorporatedInventors: Jerzy Perkitny, James Groman, James M. Elliott
-
Patent number: 4440465Abstract: An electrical plug connector lock assembly for retaining the engagement of two plug connectors includes a pair of lock members, each having a collar portion releasably secured to the electrical cable adjacent to the base of the respective plug connector. A pair of arms extends from each collar member toward the other collar member. The arms are provided with means for mutual engagement, so that the engaged plug connectors cannot be longitudinally displaced and disconnected. In one embodiment one of the plug connectors is provided with means for engaging the arms of a confronting locking member.Type: GrantFiled: April 6, 1981Date of Patent: April 3, 1984Inventors: James M. Elliott, Eric A. Rickel, Terri F. Rickel
-
Patent number: 4385814Abstract: A system for controlling a plurality of distinct devices in a theater displaying a projected motion picture or other visual program and having a multichannel sound signal contained on a moving film or other type strip, which system has a memory unit for storing groups of digital control signals for operating the distinct devices, each forming a channel, in a selected manner during a selected portion of the moving strip. This system has means for selecting one of the groups of the digital control signals for a selected portion of the visual program and means independent of the strip for causing the stored digital control signals of the selected group to be outputted in a time sequence corresponding to the selected portion of the visual program.Type: GrantFiled: March 10, 1982Date of Patent: May 31, 1983Assignee: Paramount Sound Systems CorporationInventor: James M. Elliott