Abstract: Methods and systems for monitoring an integrity of electrical connectivity between a repair patch and a parent structure include providing the repair patch with an embedded sensor configured to detect electrical conductivity. The repair patch includes a ply of conductive material that overlaps a portion of a conductive layer of the parent structure. A baseline set of sensor data is acquired from the sensor indicative of an electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure. One or more additional sets of data may be obtained from the sensor and compared to the baseline set of data to determine an integrity of the electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure.

Abstract: A system comprising: a parent structure made of composite material and having a repair site; a repair patch made of composite material, the repair patch being bonded to the parent structure at the repair site; and a sensor embedded in the repair patch. The system may further comprise non-volatile memory and an interface unit embedded in the repair patch and electrically connected to the sensor. In one embodiment, the sensor is a loop-shaped sensor comprising an electrically conductive structure having an electrical conductivity that varies as a function of a pressure exerted on the repair patch. In another embodiment, the sensor comprises a sensor chip having nonvolatile memory. In a further embodiment, the sensor comprises an optical fiber that is sensitive to changes in pressure on or strain in the repair patch.

Abstract: Methods and systems for monitoring an integrity of electrical connectivity between a repair patch and a parent structure include providing the repair patch with an embedded sensor configured to detect electrical conductivity. The repair patch includes a ply of conductive material that overlaps a portion of a conductive layer of the parent structure. A baseline set of sensor data is acquired from the sensor indicative of an electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure. One or more additional sets of data may be obtained from the sensor and compared to the baseline set of data to determine an integrity of the electrical connectivity between the ply of conductive material of the repair patch and the conductive layer of the parent structure.

Abstract: A method for monitoring structural integrity of a repaired aircraft component made of composite material. The method comprises: (a) placing a multiplicity of plies of repair composite material over a repair site on the component with a sensor disposed between two plies; (b) curing the plies of repair composite material so that the repair composite material, with the sensor embedded therein, is bonded to the repair site; (c) acquiring first sensor data from the sensor before a flight of the aircraft; (d) acquiring second sensor data from the sensor during or after the flight; (e) comparing the first sensor data to the second sensor data; (f) identifying differences between the first and second sensor data indicative of structural change; and (g) determining whether the identified differences indicate structural change in excess of a specified threshold. Steps (c) through (g) are performed by a computer system.