Abstract: A fabrication line includes a texturizing module configured to texture a substrate, an emitter module configured to form an emitter region, a passivation layer module configured to form a passivation layer, a barrier contact module configured to form a barrier contact region, a firing module configured to anneal the barrier contact region, a top metal contact module configured to form a top metal contact region, and a soldering module configured to solder the barrier contact region to the top metal contact region. The modules are integrated by one or more automated substrate handlers into a single fabrication line. A method for fabricating a solar cell includes sequentially, in an automated fabrication line: doping a dopant in a substrate; disposing a passivation layer; disposing and annealing a barrier metal paste to form a barrier contact; and disposing and annealing a metal contact paste to form a top metal contact region.

Abstract: Methods for processing substrates are provided herein. In some embodiments, the method includes providing a substrate supported on a starting template; adhering a first superstrate to a first side of the substrate; separating the substrate with the superstrate from the starting template; determining if a useful life of the used template has been reached; and re-using the used template as a starting template if the useful life has not been reached.

Abstract: Embodiments of the invention contemplate formation of a high efficiency solar cell utilizing an adjustable or optimized laser patterning process to form openings with different geometry in a passivation layer disposed on a substrate based on different film properties in the passivation layer and the substrate. In one embodiment, a method of forming a solar cell includes transferring a substrate having a passivation layer formed on a back surface of a substrate into a laser patterning apparatus, performing a substrate inspection process by a detector disposed in the laser patterning apparatus, determining a laser patterning recipe configured to form openings in the passivation layer based on information obtained from the substrate inspection process, and performing a laser patterning process on the passivation layer using the determined laser patterning recipe.

Abstract: Apparatuses and assembly methods are provided for a monolithic solar cell panel assembly. The assembly comprises an array of solar cells having front electrical contacts and back electrical contacts, wherein a first set of the solar cells in the array are aligned to be electrically connected in series through a back circuit sheet having an array of back metal contacts connected to corresponding back electrical contacts on the first set of solar cells, and through a front circuit sheet having an array of front metal contacts connected to corresponding front electrical contacts on the first set of solar cells. Electrical connections may be made in a lamination step, in which an encapsulant polymer flows into gaps and an interconnect material connects the circuits to form the monolithic solar cell panel assembly.

Abstract: A fabrication line includes a texturizing module configured to texture a substrate, an emitter module configured to form an emitter region, a passivation layer module configured to form a passivation layer, a barrier contact module configured to form a barrier contact region, a firing module configured to anneal the barrier contact region, a top metal contact module configured to form a top metal contact region, and a soldering module configured to solder the barrier contact region to the top metal contact region. The modules are integrated by one or more automated substrate handlers into a single fabrication line. A method for fabricating a solar cell includes sequentially, in an automated fabrication line: doping a dopant in a substrate; disposing a passivation layer; disposing and annealing a barrier metal paste to form a barrier contact; and disposing and annealing a metal contact paste to form a top metal contact region.

Abstract: Embodiments of the invention generally relate to solar cells having reduced carrier recombination and methods of forming the same. The solar cells have eutectic local contacts and passivation layers which reduce recombination by facilitating formation of a back surface field (BSF). A patterned aluminum back contact doped with a Group III element is disposed on the passivation layer for removing current form the solar cell. The methods of forming the solar cells include depositing a passivation layer including aluminum oxide and silicon nitride on a back surface of a solar cell, and then forming openings through the passivation layer. An aluminum back contact doped with a Group III element is disposed on the passivation layer in a pattern covering the holes, and thermally processed to form a silicon-aluminum eutectic within the openings.

Abstract: A laser scanning apparatus that uses a polygonal mirror and a beam shaper for laser drilling of holes in one or more layers during solar cell fabrication is provided. The apparatus may be used to laser drill holes in a back side passivation layer of a solar cell during back electrical contact formation. The apparatus includes the use of a polygonal mirror to improve the speed of the back electrical formation of a solar cell. The apparatus may also include the use of a beam shaper to tune the profile of the beam to prevent damage to the underlying solar cell substrate during laser drilling operations. A laser scanning module is provided which controls the speed and timing of linear movement of substrates and the operation of the laser scanning apparatus in a closed loop manner for laser drilling of material layers disposed on the substrates.

Abstract: Methods and systems for manufacturing back contact solar cells that have improved efficiency and device electrical properties. the solar cell device described herein includes an Emitter Wrap Through (EWT) solar cell that has plurality of laser drilled vias disposed in a spaced apart relationship to metal gridlines formed on a surface of the substrate. Solar cell structures that may benefit from the invention disclosed herein include back-contact solar cells, such as those in which both positive and negative contacts are formed only on the rear surface of the device.

Abstract: Embodiments of the invention relate to methods and apparatus for laser drilling holes in a silicon substrate during the fabrication of back contact solar cells, such as emitter-wrap-through (EWT) solar cells. In one embodiment, the method and apparatus use a short focal length flat field lens and a dynamic scanning technique to accomplish single pulse drilling in the silicon substrate. The method and apparatus result in increased speed and quality of holes in an EWT solar cell substrate as compared to conventional apparatus and processes.

Abstract: Embodiments of the invention relate to methods of forming solar cell devices to reduce recombination losses and solar cell devices made by such methods, for example back contact solar cells, such as emitter-wrap-through (EWT) solar cells. The methods may include disposing an amount of impurities into a charge compensating region formed on a rear surface of a substrate and forming a rear surface passivation layer over at least a portion of the charge compensating region, wherein the amount of the impurities disposed in the charge compensating region is selected to compensate for an amount of charge formed in the rear surface passivation layer.

Abstract: Embodiments of the invention contemplate the formation of a high efficiency solar cell using novel methods to form metal contact structures of the solar cell device. In one embodiment, a solar cell device includes a substrate comprising a doped semiconductor material, a surface formed on the substrate having a second doped semiconductor layer having a conductivity type opposite to the first doped semiconductor material, a dielectric layer disposed on the surface of the substrate, a metal contact structure formed in the dielectric layer with a first predetermined cross sectional area, and a metal line formed on the metal contact structure with a second predetermined cross sectional area, wherein the second predetermined cross sectional area is larger than the first predetermined cross sectional area.

Abstract: Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.

Abstract: The present invention generally relates to low-concentration photovoltaic modules. The photovoltaic modules may comprise a flexible backsheet having a plurality of electrically conductive circuit elements that have been embossed or imprinted to create optical features in the electrically conductive surface. The solar cells are then in electrical contact with the electrically conductive circuit elements to complete the photovoltaic module. By imprinting/embossing the electrically conductive circuit elements, incident solar radiation that would normally not reach the solar cells may be reflected and collected by the solar cells. Thus, substantially all of the solar radiation that is exposed to the photovoltaic module is collected by the solar cells of the photovoltaic module.

Abstract: Photovoltaic modules comprising back-contact solar cells manufactured using monolithic module assembly techniques comprising a flexible circuit comprising a back sheet and a patterned metallization. The module may comprise busses in electrical contact with the patterned metallization to extract the current. The module may alternatively comprise multilevel metallizations. Interlayer dielectric comprising islands or dots relieves stresses due to thermal mismatch. The use of multiple cord plates enables flexible circuit layouts, thus optimizing the module. The modules preferably comprise a thermoplastic encapsulant and/or hybrid adhesive/solder materials. An ultrathin moisture barrier enables roll-to-roll processing.

Abstract: Embodiments of the invention generally provide a solar cell formation process that includes the formation of metal contacts over heavily doped regions that are formed in a desired pattern on a surface of a substrate. Embodiments of the invention also provide an inspection system and supporting hardware that is used to reliably position a similarly shaped, or patterned, metal contact structure on the patterned heavily doped regions to allow an Ohmic contact to be made. The metal contact structure, such as fingers and busbars, are formed on the heavily doped regions so that a high quality electrical connection can be formed between these two regions.

Abstract: Embodiments of the invention provide a thin single crystalline silicon film solar cell and methods of forming the same. The method includes forming a thin single crystalline silicon layer on a silicon growth substrate, followed by forming front or rear solar cell structures on and/or in the thin single crystalline silicon film. The method also includes attaching the thin single crystalline silicon film to a mechanical carrier and then separating the growth substrate from the thin single crystalline silicon film along a cleavage plane formed between the growth substrate and the thin single crystalline silicon film. Front or rear solar cell structures are then formed on and/or in the thin single crystalline silicon film opposite the mechanical carrier to complete formation of the solar cell.

Abstract: Embodiments of the invention provide a thin single crystalline silicon film solar cell and methods of forming the same. The method includes forming a thin single crystalline silicon layer on a silicon growth substrate, followed by forming front or rear solar cell structures on and/or in the thin single crystalline silicon film. The method also includes attaching the thin single crystalline silicon film to a mechanical carrier and then separating the growth substrate from the thin single crystalline silicon film along a cleavage plane formed between the growth substrate and the thin single crystalline silicon film. Front or rear solar cell structures are then formed on and/or in the thin single crystalline silicon film opposite the mechanical carrier to complete formation of the solar cell.

Abstract: Embodiments of the invention generally provide copper contact structures on a solar cell formed using copper metallization pastes and/or copper inks. In one embodiment, the copper metallization paste includes an organic matrix, glass frits within the organic matrix, and a metal powder within the organic matrix, the metal powder comprising encapsulated copper-containing particles. The encapsulated copper-containing particles further include a copper-containing particle and at least one coating surrounding the copper-containing particle. In another embodiment, a solar cell includes a front contact structure on a substrate comprising a doped semiconductor material. The front contact structure includes a copper layer comprising sintered encapsulated copper-containing particles, wherein at least some of the encapsulated copper-containing particles include a copper-containing particle and at least one coating surrounding the copper-containing particle.

Abstract: Embodiments of the invention contemplate the formation of a solar cell device that has improved efficiency and device electrical properties. In one embodiment, the solar cell device described herein includes an Emitter Wrap Through (EWT) solar cell that has plurality of laser drilled vias disposed in a spaced apart relationship to metal gridlines formed on a surface of the substrate. Solar cell structures that may benefit from the invention disclosed herein include back-contact solar cells, such as those in which both positive and negative contacts are formed only on the rear surface of the device.

Abstract: Methods and systems for interconnecting back contact solar cells. The solar cells preferably have reduced area busbars, or are entirely busbarless, and current is extracted from a variety of points on the interior of the cell surface. The interconnects preferably relieve stresses due to solder reflow and other thermal effects. The interconnects may be stamped and include external or internal structures which are bonded to the solder pads on the solar cell. These structures are designed to minimize thermal stresses between the interconnect and the solar cell. The interconnect may alternatively comprise porous metals such as wire mesh, wire cloth, or expanded metal, or corrugated or fingered strips. The interconnects are preferably electrically isolated from the solar cell by an insulator which is deposited on the cell, placed on the cell as a discrete layer, or laminated directly to desired areas of the interconnect.