Abstract: An interface structure for use in a semiconductor integrated circuit tester for connecting a test head interface to a DUT interface includes a first frame member having first and second opposite main faces, a second frame member having first and second opposite main faces, and a spacer securing the first and second frame members together in spaced relationship. A first cable assembly header is received in an aperture of the first frame member and includes a conductive element and electrically conductive terminal members exposed at a main face of the first frame member and electrically insulated from the conductive element of the first header. A second cable assembly header is received in an aperture of the second frame member and includes a conductive element and electrically conductive terminal members exposed at a main face of the second frame member and electrically insulated from the conductive element of the second header.

Abstract: Apparatus for testing semiconductor integrated circuit devices in wafer form includes a test head, a probe card support mechanism attached to the test head for supporting a probe card beneath the test head, a wafer prober for presenting successive wafers to be tested to the test head from beneath the test head, and a lifting mechanism attached to the wafer prober for lifting the test head above the wafer prober. Upon lifting the test head above the wafer prober, the probe card support mechanism can move horizontally relative to the test head between an inserted position in which the probe card support mechanism is positioned to enable the probe card to engage contact elements of the test head and an extended position in which the probe card can be removed from the probe card support mechanism.

Abstract: A docking mechanism docks a test head having a docking plate to a machine having a docking fixture when the docking plate is in a predetermined position with respect to the docking fixture. The test head has cam blocks which are moveable with respect to the docking plate. The docking fixture includes cam followers for engaging cam slots in the cam members when the docking plate is in the predetermined position and the cam blocks are in a first position, so that when the cam blocks are moved to a second position the docking plate and the docking fixture are drawn together. At least two sensors are carried by the docking plate and spaced apart from one another. The sensors cooperate with the docking fixture and are in a first state when the docking plate is not engaged with the docking fixture and the docking plate is being brought towards, but has not attained its predetermined position, and are in a second state when the docking plate attains the predetermined position.

Abstract: A load board is attached to the test head of a semiconductor tester and has a receptacle surface oriented substantially perpendicular to a Z-axis and presented toward a handler location. An adaptor plate is attached to a Z axis abutment structure and has a surface at a predetermined Z axis position relative to the receptacle surface of the load board, the surface of the adaptor plate being presented toward the handler location. At least three spacers are attached to the adaptor plate and project from the surface of the adaptor plate.

Abstract: A load board is attached to the test head of a semiconductor tester and has a receptacle surface oriented substantially perpendicular to a Z-axis and presented toward a handler location. An adaptor plate is attached to a Z axis abutment structure and has a surface at a predetermined Z axis position relative to the receptacle surface of the load board, the surface of the adaptor plate being presented toward the handler location. At least three spacers are attached to the adaptor plate and project from the surface of the adaptor plate.

Abstract: A thermal isolation plate for a probe card comprises a stiff, generally annular plate made of a metal having good thermal conductivity. One surface of the plate has a low emissivity and the opposite surface has a low absorptivity. Preferably the surface of low absorptivity is a highly polished surface.