Abstract: A method for testing an electronic module to evaluate solder joint failures caused by thermally induced stress includes determining a thermal shock endurance test profile that represents field temperature conditions, estimating time/cycles to failure of solder joints in the module using numerical simulation techniques, selecting a design life duration for the module, comparing the design life duration of the module with the estimated time/cycles to failure of the weakest solder joint in the module, determining between robust, marginal, and non-robust module designs based on the design life duration of the module and the estimated time/cycles to failure of the at least one solder joint in the module, and determining an accelerated thermal shock endurance test specification having a test duration for testing the electronic module upon determining a marginal module design.