Patents by Inventor James M. Ma

James M. Ma has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230031778
    Abstract: Surface modifications and coating materials are provided that may be applied to a substrate to reduce or eliminate damage that would accrue to do environmental effects or operational stress when incorporated into a device such as a heat exchanger. Structured ceramic surface modification materials may be incorporated into the surface modification and may optionally include a gradient in one or more physical or chemical property.
    Type: Application
    Filed: December 11, 2020
    Publication date: February 2, 2023
    Inventors: Michael A. Ung, James M. Ma, David C. Walther, Lance R. Brockway
  • Patent number: 9640746
    Abstract: The present invention provides a composite thermoelectric material. The composite thermoelectric material can include a semiconductor material comprising a rare earth metal. The atomic percent of the rare earth metal in the semiconductor material can be at least about 20%. The composite thermoelectric material can further include a metal forming metallic inclusions distributed throughout the semiconductor material. The present invention also provides a method of forming this composite thermoelectric material.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: May 2, 2017
    Assignee: California Institute of Technology
    Inventors: James M. Ma, Sabah K. Bux, Jean-Pierre Fleurial, Vilupanur A. Ravi, Samad A. Firdosy, Kurt Star, Richard B. Kaner
  • Publication number: 20160111619
    Abstract: The present invention provides a composite thermoelectric material. The composite thermoelectric material can include a semiconductor material comprising a rare earth metal. The atomic percent of the rare earth metal in the semiconductor material can be at least about 20%. The composite thermoelectric material can further include a metal forming metallic inclusions distributed throughout the semiconductor material. The present invention also provides a method of forming this composite thermoelectric material.
    Type: Application
    Filed: January 22, 2014
    Publication date: April 21, 2016
    Applicant: CALIFORNIA INSTITUTE OF TECHNOLOGY
    Inventors: James M. Ma, Sabah K. Bux, Jean-Pierre Fleurial, Vilupanur A. Ravi, Samad A. Firdosy, Kurt Star, Richard B. Kaner