Abstract: A holographic scatterometer with continuous readout can rapidly identify the presence of deposits (particles or other defects) on an unpatterned wafer surface and determine the volume density (size) and location. The scatterometer can also determine chemical composition of the detected deposits. The range of the deposit (particle) size to be measured is below 80 nm, which currently existing scatterometer type instruments cannot readily detect. The inspection can be achieved as an in-line stage during the processing of wafers or in situ in combination with another processing tool or as a separate off-line analysis device.

Abstract: A holographic scatterometer with continuous readout can rapidly identify the presence of deposits (particles or other defects) on an unpatterned wafer surface and determine the volume density (size) and location. The scatterometer can also determine chemical composition of the detected deposits. The range of the deposit (particle) size to be measured is below 80 nm, which currently existing scatterometer type instruments cannot readily detect. The inspection can be achieved as an in-line stage during the processing of wafers or in situ in combination with another processing tool or as a separate off-line analysis device.

Abstract: A scatterometer for detecting and analyzing wafer surface defects includes a light source generating a beam of light and a photodetector. Optics are used for splitting the beam of light into a reference beam and a detection beam. Optics also direct the reference beam and the detection beam to the photodetector through different optical paths. The optics direct the detection beam to the surface of the wafer and when incident upon a defect creates a scattered beam. The optics direct the scattered beam to the photodetector. A driver moves the surface of the wafer with respect to the detection beam. A computer coupled to the photodetector determines the presence of a defect on the surface by analyzing an interference pattern from the superposition of the reference beam and the scattered beam.

Abstract: A solenoid operated circuit breaker trip device has a base defining a guide channel and an actuator that slides in the guide channel and interacts with a contact breaking mechanism having a trip bar operable to make or break electrical contacts. A spring biases the actuator toward the trip bar. A solenoid on the base electromagnetically displaces a plunger along a linear path and is coupled to a trigger having a latching surface that holds or releases the actuator. The guide channel runs parallel to the path of the plunger, adjacent the solenoid. The trigger is L-shaped and pivoted on a pivot pin between two legs of its L-shape, on an axis transverse to the path of the plunger. One of the two trigger legs is coupled to the plunger, and the other has an engagement surface that is moved behind a complementary surface of the actuator to selectively block its displacement. The base can be a slotted frame attached to the solenoid or a molded housing having an interior cavity for receiving the solenoid.