Patents by Inventor James M. Mothersbaugh

James M. Mothersbaugh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040002670
    Abstract: The invention is directed to wound care apparatus and methods that provide for non-contact wound covering. The apparatus can be configured to be positioned on any portion of the body, and comprises a body member having a base providing a sealing surface for application to the skin or other surface. The body member has a shape and size to at least substantially circumscribe the area of a wound. The body member further includes at least one wall forming an enclosed space over the wound area. The apparatus substantially seals a wound under the enclosed space from the external environment. One or more ports to allow the ingress or egress of fluids or treatment agents may be provided. Treatment methods are also provided for treatment of wounds using the device.
    Type: Application
    Filed: February 7, 2003
    Publication date: January 1, 2004
    Applicant: Circle Prime Manufacturing, Inc.
    Inventors: James M. Mothersbaugh, James L. Canterbury, Detlev F. Smith
  • Patent number: 5185568
    Abstract: The invention describes an internal test load and method for forming an internal test load which is adapted to absorb energy from a power source such as an RF transmitter, transceiver, or amplifier. The test load is positioned internally within a housing, and includes at least one impedance device, such as a power resistor, coupled to the power source which is matched to the impedance thereof. The impedance device is supported on a heat sink which is adapted to absorb heat generated by the impedance device so as to be distributed over a relatively large area constituting the heat sink. The heat sink is positioned in spaced part relation to the housing, and is not directly supported or secured to the housing. A potting material surrounds the load assembly and supports the heat sink, wherein the heat sink effectively "floats" within the potting material such that heat absorbed by the heat sink will not be directly transferred to the housing, but will be dissipated through the potting compound.
    Type: Grant
    Filed: January 22, 1991
    Date of Patent: February 9, 1993
    Assignee: Circle Prime Mfg. Co.
    Inventors: James M. Mothersbaugh, John E. Keim