Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: Methods of forming a fluid channel in a semiconductor substrate may include providing a semiconductor substrate having a backside and a device side, wherein the device side is configured to secure ink ejecting devices thereon and applying a material layer to the backside of the semiconductor substrate. The method may further include providing a gray scale mask configured with a pattern corresponding to a fluid channel having a plurality of slots, exposing the material layer to sufficient light radiation energy through the gray scale mask and etching the exposed material layer and the semiconductor substrate through to the device side of the semiconductor substrate.

Abstract: A method of substantially simultaneously forming at least two fluid supply slots through a thickness of semiconductor substrate from a first surface to a second surface thereof. The method includes the steps of applying a photoresist layer to the first surface of the semiconductor substrate. The photoresist layer is patterned and developed using a gray scale mask for a first fluid supply slot. The semiconductor substrate is then reactive ion etched, to form the at least two fluid supply slots through the thickness of the substrate. The first fluid supply slot is substantially wider than the second fluid supply slot, and the first and second fluid supply slots are etched through the substrate at substantially the same rate.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Abstract: A radiation curable resin composition having improved flexibility. The radiation curable composition having from about 5 to about 50 weight percent of a difunctional polymeric compound; from about 1 to about 10 weight percent of a photoinitiator; from about 1 to about 10 weight percent of a flexibilizer agent, wherein the flexibilizer agent has a molecular weight ranging from about 400 to about 10,000; and about 30 to about 90 weight percent of the non-photoreactive solvent, wherein the weight percents are based on the total weight of the resin composition. Ink jet print heads and ink jet printing apparatusess comprising ink jet print heads utilizing the radiation curable resin compositions are also included.

Abstract: A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (referred to collectively as “slots”) in the substrates. The process includes applying a first layer to a first surface of substrate to provide an etch mask material layer on the first surface of the substrate. A second layer is applied to a second surface of the substrate to provide an etch stop material layer on the second surface of the substrate. The first layer and the second layer have similar solubilities in one or more organic solvents. The substrate is etched from the first surface of the wafers to provide a slot in the substrate. After etching the substrate, the etch mask material layer and the etch stop material layer are removed by contacting the first surface and the second surface of the substrate with a single organic solvent.

Abstract: A micro-fluid ejection device structure, a multi-fluid cartridge containing the ejection device structure, and methods for making the ejection device structure and cartridge. The ejection device includes an ejection head substrate having a fluid supply side and a device side and containing two or more fluid flow paths therein for supplying fluid from the fluid supply side to the device side thereof. A multi-channel manifold is attached to the fluid supply side of the ejection head substrate for providing fluid from two or more fluid reservoirs to the fluid flow paths in the ejection head substrate. The multi-channel manifold has fluid flow channels therein in fluid flow communications with the fluid flow paths in the ejection head substrate and the manifold consists essentially of a patterned photoresist material.

Abstract: A method of etching a semiconductor substrate. The method includes the steps of applying a photoresist etch mask layer to a device surface of the substrate. A select first area of the photoresist etch mask is masked, imaged and developed. A select second area of the photoresist etch mask layer is irradiated to assist in post etch stripping of the etch mask layer from the select second area. The substrate is etched to form fluid supply slots through a thickness of the substrate. At least the select second area of the etch mask layer is removed from the substrate, whereby mask layer residue formed from the select second area of the etch mask layer is significantly reduced.

Abstract: A method for improving fluidic flow for a microfluidic device having a through hole or slot therein. The method includes the steps of forming one or more openings through at least part of a thickness of a substrate from a first surface to an opposite second surface using a reactive ion etching process whereby an etch stop layer is applied to side wall surfaces in the one or more openings during alternating etching and passivating steps as the openings are etched through at least a portion of the substrate. Substantially all of the etch stop layer coating is removed from the side wall surfaces by treating the side wall surfaces using a method selected from chemical treatment and mechanical treatment, whereby a surface energy of the treated side wall surfaces is increased relative to a surface energy of the side wall surfaces containing the etch stop layer coating.

Abstract: An ink system comprising a first ink containing a flocculating dye in an aqueous solution and a second ink containing a dispersant-pigment complex in an aqueous solution reduces bleed between the two inks when they are applied side by side.

Abstract: An aqueous jet ink of water, dissolved dyes and a surfactant of R--N(C.sub.2 H.sub.4 O).sub.x (C.sub.2 H.sub.4 O).sub.y H, where x+y is from 5 to 25, with x and y each at least 2, and R is alkyl or oxygen containing. The static surface tension is less than 40 dynes/cm while the dynamic surface tension is about 65 dynes/cm. Satellites and splatter in thermal drop on demand printing are greatly reduced, and drop misdirection is reduced.

Abstract: An ink refill device includes a body having a chamber with ink therein. The chamber has one wall formed of a frangible material. The body has a needle communicating the chamber with a reservoir, which has a foam of a controlled porosity therein, in a print cartridge when the needle is inserted in a vent of the reservoir to fill the reservoir. Breaking of the frangible wall of the chamber with the needle extending downwardly enables ink to flow from the chamber at a controlled flow rate to the reservoir in the cartridge. In the preferred embodiment, the needle has one or more notched openings adjacent its distal end to increase its surface area through which ink flows to increase flow of ink to the reservoir.

Abstract: Hydroxyethylated polyethyleneimine is added to jet ink having an anionic dye to prevent whisker forming overnight. To avoid excessive viscosity at start-up, the polyethyleneimine is low molecular weight or a low molecular weight hydroxyethylated amine is combined with high molecular weight polyethyleneimine.

Abstract: A waterfast ink having 3.0% Food Black 2, 2.5% highly hydroxyethylated polyethyleneimine, 10.0% ammonium benzoate, and the balance water. The invention appears to function upon loss of water after printing by a polar neutralizing between the dye and the polyimine, which results in an affinity of the dye to paper. It is applicable to any dye having anionic solubilizing groups but not having quaternary ammonium and to any ammonium salt.

Abstract: A printer ribbon having nigrosine dye with hydroxide counter ion, preferably at 23% by weight, in an oleic acid vehicle to form an ink saturating a fabric. The ribbon has the long life of a dye-only fabric ribbon and is effective for both correspondence and bar code applications.

Abstract: A cartridge ribbon (2) for impact printing containing an endless ribbon (4) initially carrying ink having dye as its only coloring matter. The initial dye is in heavy enough quantity to permit infrared readability of bar codes printed by the ribbon. Re-inking reservoir (16) transfers ink through drive gear (10) only to the track (28) which is impacted during printing. The ink in the reservoir is colored with carbon black. Bar code functioning is maintained by the carbon black added by re-inking. This limited presence of carbon black does not hamper ribbon feed unacceptably, while a ribbon with a full carbon-black ink would not feed well.