Abstract: A rinse spray bar (24), added to CMP equipment (10), provides complete and uniform wetting and rinsing of the polishing pad (12) for an improved process. The rinse spray bar has a first opening (26) running through a portion of its length and multiple second openings (28) connected to the first opening to create multiple flow paths for a rinse agent. These second openings (28) are capped with spray nozzles (36) on the bottom surface of the rinse spray bar so that the rinse agent can be sprayed out from the second openings at a pressure higher than ambient such that the sprays patterns overlap each other to ensure uniform wetting. An in-line valve (34) adjusts and controls the pressure of the incoming rinse agent through the input line (30) so that the spray nozzle pressure can be varied. The rinse spray bar can be used at every polishing pad station in the CMP apparatus.

Abstract: A preconditioning plate (10) prepares the surface of a polishing pad (24) to prepare the pad's surface for subsequent metal polishing of semiconductor wafers (27). The preconditioning plate has at least three intersecting radial ridges (14) on its surface and is made from a rigid plastic material. The preconditioning plate is rotated relative to the surface of the polishing pad prior to actual polishing to provide a uniform and stable polishing surface. The preconditioning plate does not abrade or wear away the polishing pad, nor does it form grooves in the polishing pad. Additionally, the preconditioning plate is reusable.