Patents by Inventor James M. PARSEY, JR.

James M. PARSEY, JR. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF FORMING A SEMICONDUCTOR DIE CUTTING TOOL
    Publication number: 20160035599
    Abstract: In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
    Type: Application
    Filed: October 16, 2015
    Publication date: February 4, 2016
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gordon M. GRIVNA, James M. PARSEY, JR.
  • Semiconductor die singulation methods
    Patent number: 9196511
    Abstract: In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
    Type: Grant
    Filed: September 12, 2014
    Date of Patent: November 24, 2015
    Assignee: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gordon M. Grivna, James M. Parsey, Jr.
  • SEMICONDUCTOR DIE SINGULATION METHODS
    Publication number: 20150027290
    Abstract: In one embodiment, a method of singulating semiconductor die from a semiconductor wafer includes forming a material on a surface of a semiconductor wafer and reducing a thickness of portions of the material. Preferably, the thickness of the material is reduced near where singulation openings are to be formed in the semiconductor wafer.
    Type: Application
    Filed: September 12, 2014
    Publication date: January 29, 2015
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Gordon M. GRIVNA, James M. PARSEY, JR.