Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: A user specified high level design selects a plurality of IP cores for placement in a customized system on a chip. A single integrated service automatically performs each of a design integration phase, specification phase, and verification phase for the user specified high level design to generate an integration file specifying stitching between a plurality of pins of each of the plurality of IP cores, a specification file specifying one or more characteristics of the customized system on a chip based on the user specified high level design, and a verification testbench for verification of the user specified high level design.

Abstract: Improved tape automated bonding (TAB) packaging technology is disclosed having particular utility with semiconductor integrated circuit chips having high gate count and I/O requirements, utilizing a polymer layer of the package to support decoupling capacitor(s) mounted across power and ground leads connecting the chip and internal planes of a printed circuit board to which the TAB package is attached.

Abstract: The print wires 4 of an electroerosion printhead 1 are retained in grooves 3 of a substrate 2. These wires 4 are fixed to the substrate and covered by a copper layer 6. The copper layer is machined to provide a smooth surface on the copper and between the copper in the grooves and the surface of the substrate. Contact pads 7 are formed on or applied to the strip-like copper layers 6 to fan out the contact areas for suitable accessibility for attaching control cables 17.

Abstract: A plurality of arrays of heating elements, forming printing zones, are arranged separated from each other a predetermined distance (SL) on a substrate along a line (X) transverse the media transport direction (Y). The heating elements in each zone are arranged parallel to the transport direction (Y). Mover elements sweep the head back and forth relative to print line, a distance of SL. Releasable backing element is formed by rollers and each printing zone, the length of which is SL, is associated with a roller. The backing-rollers are moved together with the head for urging the print media against the thermal transfer ribbon and the latter against the multi-zone thermal print head.

Abstract: A current shunt multiplexed driver circuit in a high resolution multi-wire printhead is provided for use in an electroerosion printer. The circuit can reduce to the number of active devices required per print wire to two times the square root of the number of wires.

Abstract: A drive system for energizing the elements of a fixed bar printer of the type in which a pair of parallel bars, of, for example, resistive material, have a series of first connections to individual bars interspersed by second connections to both bars. By driving a second connection, any one of four elements can be energized by selecting one of the adjacent first connections as a voltage source path. The drive lines which return current are fed by a driver/shift register system having a stage for each drive line. Data is fed to the driver/shift register system serially from a plurality of memories, each of which has a capacity equal to that of the driver/shift register system. The memories are grouped in fours, so that each memory stores data for energizing one of the print bar elements in each group of four defined by a drive connection and its adjacent current return connections. An addressing system controls the sequence of loading and unloading the memories.

Abstract: A thermal print head includes a pair of parallel bars of resistive material. A first set of lines is connected to one bar at equal spacings, a second set is similarly connected to the other bar. Each line of a third set of lines is connected to both bars between the connections of the lines of the other sets. From each line of the third set there are four resistance paths along the bars to adjacent lines of the first and second sets. Each of these paths can be selected to heat the bars along the selected paths to create marks on a paper sheet or web.

Abstract: In a thermal print head employing a line of print elements, temperature sensing is effected by means of an elongated temperature sensing device positioned in parallel with the line of elements and in heat-transfer proximity thereto. The sensor may be of thermo-resistive material and is coupled to a control circuit to effect energy control of drive pulses to the print elements.

Abstract: In apparatus which uses a plurality of stepper motors for the actuation of various moving members therein, e.g., impact printer apparatus, an expedient is provided wherein at least one pair of stepper motors which operate during mutually exclusive periods share common driver means which are switchable to be connected to the active stepper motor and disconnected from the dormant one. When thus connected to the active stepper motor, the driver means operate in the conventional manner to couple the windings of the active stepper motor to the particular current supply associated with that active motor in a predetermined sequence so that each winding of the active motor is energized during portions of the sequence and deenergized during other portions. The apparatus further includes switching means for selectively connecting and disconnecting the drive means to the first and second stepper motors in accordance with the requirements of the apparatus driven by said stepper motors.