Abstract: Disclosed are wearable ultrasound probes for use in trauma triage and assessment. The probes define a finger-receiving aperture and include an ultrasound array disposed adjacent the distal end wherein the ultrasound array is angled toward the bottom side of the probe about 10-50 degrees from the longitudinal axis and a second ultrasound array adjacent the distal end and proximal to the first ultrasound array, wherein the second ultrasound array is angled about 105-155 degrees from the first ultrasound array.

Abstract: A 3D printer includes a gantry configured to move in a plane substantially parallel to a x-y build plane and a print head configured to extrude molten material to print a 3D part in a layer-by-layer process. The 3D printer includes a platen configured to support the part being printed in the layer by layer process and positionable with a primary Z positioner along a z-axis substantially normal to the x-y build plane. The 3D printer includes a local Z positioner moved by the gantry, the local Z positioner comprising a linear motor configured to move the print head in the z-direction and having an operable range of motion extending from a nominal build position at which a nozzle of the print head is positioned in the x-y build plane to a raised position above the x-y build plane.

Abstract: A polishing composition includes an anionic abrasive, a pH adjuster a low-k removal rate inhibitor, a ruthenium removal rate enhancer, and water. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises ruthenium or a hard mask material; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

Abstract: A polishing composition includes an anionic abrasive; a pH adjuster; a transition metal catalyst; and an amino acid. A method of polishing a substrate includes the steps of: applying the polishing composition described herein to a surface of a substrate, wherein the surface comprises tungsten or molybdenum; and bringing a pad into contact with the surface of the substrate and moving the pad in relation to the substrate.

Abstract: The present disclosure provides a polishing composition that includes at least one first amine, at least one second amine, and other components such as azoles. The first amine has a low molecular weight, for example 120 g/mol or less. The second amine has a high molecular weight, for example 125 g/mol or higher. The compositions can polish substrates that include copper and molybdenum, or alloys of each, at a high selectivity of copper to molybdenum.

Abstract: Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 ?m bin size.

Abstract: Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 ?m bin size.

Abstract: Various examples are described for the integration and customization of third-party applications and services with computing infrastructure of a data center. One or more computing devices can maintain a remote computing environment for an enterprise that provides at least one remote computing service on behalf of the enterprise. A portal can be provided that is configured to, from an entity not associated with the remote computing environment, receive a specification of information associated with one of a plurality of third-party services and compatibility criteria of the one of the third-party services. Existing infrastructure used by the remote computing environment in providing the at least one remote computing service is identified. Third-party services that are compatible with the existing infrastructure is identified and presented in a console in association with operation of the remote computing environment.

Abstract: This disclosure features a polishing composition that includes at least one abrasive; at least one first corrosion inhibitor that includes a phosphate or a phosphonate group; at least one complexing agent; at least one second corrosion inhibitor that is at least one azole compound; and optionally a pH adjuster.

Abstract: Chemical mechanical polishing compositions include an abrasive, an additive, and water. The polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 ?m bin size.

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 ?m bin size.

Abstract: Chemical mechanical polishing compositions include an abrasive, a first removal rate enhancer; and water; wherein the polishing compositions have a value of less than 800,000 for the relation: large particle counts/weight percent abrasive, when measured using a 0.2 ?m bin size.

Abstract: Various examples are described for the integration and customization of third-party applications and services with computing infrastructure of a data center. One or more computing devices can maintain a remote computing environment for an enterprise that provides at least one remote computing service on behalf of the enterprise. A portal can be provided that is configured to, from an entity not associated with the remote computing environment, receive a specification of information associated with one of a plurality of third-party services and compatibility criteria of the one of the third-party services. Existing infrastructure used by the remote computing environment in providing the at least one remote computing service is identified. Third-party services that are compatible with the existing infrastructure is identified and presented in a console in association with operation of the remote computing environment.

Abstract: Various examples are described for the integration and customization of third-party applications and services with computing infrastructure of a data center. One or more computing devices can maintain a remote computing environment for an enterprise that provides at least one remote computing service on behalf of the enterprise. The one or more computing devices can identify existing infrastructure used by the remote computing environment in providing the at least one remote computing service, identify third-party services that are compatible with the existing infrastructure, present the third-party services in a console in association with operation of the remote computing environment, and in an instance in which one of the third-party services is selected for deployment in the console, automatically reconfigure the remote computing environment to include the one of the third-party services selected.

Abstract: Various examples are described for the integration and customization of third-party applications and services with computing infrastructure of a data center. One or more computing devices can maintain a remote computing environment for an enterprise that provides at least one remote computing service on behalf of the enterprise. The one or more computing devices can identify existing infrastructure used by the remote computing environment in providing the at least one remote computing service, identify third-party services that are compatible with the existing infrastructure, present the third-party services in a console in association with operation of the remote computing environment, and in an instance in which one of the third-party services is selected for deployment in the console, automatically reconfigure the remote computing environment to include the one of the third-party services selected.

Abstract: The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.

Abstract: The present disclosure provides chemical mechanical polishing compositions that achieve minimal dishing at reduced dishing reducer (DR) levels when compared to known CMP compositions. The compositions of the disclosure include a dynamic surface tension reducer (DSTR) which allows for lower levels of dishing reducer in the compositions. Indeed, the compositions of the disclosure allow for lower levels of dishing reducer to achieve the same dishing as known compositions having higher levels of dishing reducer. Deleterious effects of high DR levels are thereby avoided or minimized when employing the compositions of the disclosure.

Abstract: The present disclosure provides a method for reducing large particle counts (LPCs) in copper chemical mechanical polishing slurry by way of using high purity removal rate enhancer (RRE) in the slurry. The conductivity of the RRE in deionized water solutions correlates very strongly with the number of LPCs in the RRE, and thus in a slurry using the RRE.