Abstract: A layered heater is provided that includes at least one resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length, a width, and a thickness, wherein the thickness varies along the length of the resistive circuit pattern and/or the width of the resistive circuit pattern for a variable watt density. The present disclosure also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density.

Abstract: A layered heater is provided with a dielectric layer formed by a first layered process, a resistive layer formed on the dielectric layer, the resistive layer formed by a second layered process, and a protective layer formed on the resistive layer, wherein the protective layer is formed by one of the first or second layered processes or yet another layered process. The first layered process is different than the second layered process in order to take advantage of the unique processing benefits of each of the first and second layered processes for a synergistic result. The layered processes include, by way of example, thick film, thin film, thermal spraying, and sol-gel. Additional functional layers are also provided by the present invention, along with methods of forming each of the individual layers.

Abstract: A layered heater is provided that comprises at least one resistive layer defining a circuit configuration, the circuit configuration comprising at least one resistive trace oriented relative to a heating target and comprising a material having temperature coefficient characteristics such that the resistive trace provides power commensurate with demands of the heating target In one form, resistive traces of the resistive layer are an NTC material having a relatively high BETA coefficient and are oriented approximately parallel to a primary heating direction.

Abstract: A layered heater is provided that comprises at least one resistive layer defining a circuit configuration, the circuit configuration comprising at least one resistive trace oriented relative to a heating target and comprising a material having temperature coefficient characteristics such that the resistive trace provides power commensurate with demands of the heating target. In one form, resistive traces of the resistive layer are a PTC material having a relatively high TCR and are oriented approximately perpendicular to a primary heating direction. In another form, resistive traces of the resistive layer are an NTC material having a relatively high BETA coefficient and are oriented approximately parallel to a primary heating direction.

Abstract: An instrumented heater sleeve is provided that has a plurality of zones, a dielectric layer disposed over an outer surface of the sleeve, a resistive element layer disposed over the first dielectric layer, and a plurality of pairs of lead wires secured to a portion of the resistive element layer. Each pair of lead wires is connected to and corresponds with each of the zones and a protective layer is disposed over the dielectric layer. An amount of power is supplied to each of the zones and adjusted during a test run, or multiple test runs, to achieve a desired temperature profile along a heating target such as a hot runner nozzle. Methods of designing a hot runner nozzle heater using the instrumented heater sleeve are also provided.

Abstract: Methods of forming a layered heater are provided that comprise at least one resistive layer comprising a resistive circuit pattern, the resistive circuit pattern defining a length, a thickness, and a spacing, wherein the thickness varies along the length of the trace of the resistive circuit pattern for a variable watt density. The methods include achieving the variable thickness by varying a dispensing rate of a conductive ink used to form the resistive circuit pattern, varying the feed rate of a target surface relative to the dispensing of the ink, and overwriting a volume of conductive ink on top of a previously formed trace of the resistive circuit pattern.

Abstract: Methods of assembling a high heat transfer and tailored heat transfer layered heater systems are provided. One method includes a step of pressing one of a target part and a layered heater into the other one of the target part and the layered heater to create an interference fit between the layered heater and the target part. When the target part is disposed within the layered heater, the layered heater includes a substrate defining an inner periphery less than or equal to an outer periphery of the target part. When the layered heater is disposed within the target part, the layered heater includes a substrate defining an outer periphery larger than or equal to an inner periphery of the target.

Abstract: An instrumented heater sleeve is provided that has a plurality of zones, a dielectric layer disposed over an outer surface of the sleeve, a resistive element layer disposed over the first dielectric layer, and a plurality of pairs of lead wires secured to a portion of the resistive element layer. Each pair of lead wires is connected to and corresponds with each of the zones and a protective layer is disposed over the dielectric layer. An amount of power is supplied to each of the zones and adjusted during a test run, or multiple test runs, to achieve a desired temperature profile along a heating target such as a hot runner nozzle. Methods of designing a hot runner nozzle heater using the instrumented heater sleeve are also provided.

Abstract: A tailored heat transfer layered heater system is provided that comprises a target part defining a room temperature periphery and a layered heater disposed around or within the target part, the layered heater comprising a substrate having a room temperature periphery that is sized such that an interference fit is formed between the layered heater and the target part either through mechanical or thermal methods. The layered heater in one form is disposed around the target part and in another form is disposed inside the target part. Additionally, heat transfer is tailored along the layered heater using other devices such as thermal spacers, insulative pads, and a transfer substrate in other forms of the present invention.

Abstract: A layered heater is provided with a dielectric layer formed by a first layered process, a resistive layer formed on the dielectric layer, the resistive layer formed by a second layered process, and a protective layer formed on the resistive layer, wherein the protective layer is formed by one of the first or second layered processes or yet another layered process. The first layered process is different than the second layered process in order to take advantage of the unique processing benefits of each of the first and second layered processes for a synergistic result The layered processes include, by way of example, thick film, thin film, thermal spraying, and sol-gel Additional functional layers are also provided by the present invention, along with methods of forming each of the individual layers.

Abstract: A hot runner nozzle heater is provided that includes a sleeve defining a slot extending along a length of the sleeve. A first dielectric layer is disposed over an outer surface of the sleeve, and a resistive element layer is disposed over the first dielectric layer, wherein the resistive element layer defines a resistive circuit pattern that is preferably formed by a laser trimming process. A pair of terminal leads are secured to a portion of the resistive element layer thus defining a termination area, and the termination area is positioned proximate the slot and away from the proximal end and the distal end of the sleeve. A second dielectric layer is disposed over the resistive element layer but not over the termination area, a third dielectric layer is disposed over the termination area, and a protective layer disposed over the second dielectric layer and the third dielectric layer.

Abstract: A hot runner nozzle heater is provided that includes a sleeve defining a slot extending along a length of the sleeve. A first dielectric layer is disposed over an outer surface of the sleeve, and a resistive element layer is disposed over the first dielectric layer, wherein the resistive element layer defines a resistive circuit pattern that is preferably formed by a laser trimming process. A pair of terminal leads are secured to a portion of the resistive element layer thus defining a termination area, and the termination area is positioned proximate the slot and away from the proximal end and the distal end of the sleeve. A second dielectric layer is disposed over the resistive element layer but not over the termination area, a third dielectric layer is disposed over the termination area, and a protective layer disposed over the second dielectric layer and the third dielectric layer.

Abstract: A layered heater is provided that includes at least one resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length, a width, and a thickness, wherein the thickness varies along the length of the resistive circuit pattern and/or the width of the resistive circuit pattern for a variable watt density. The present disclosure also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density.

Abstract: Methods of assembling a high heat transfer and tailored heat transfer layered heater systems are provided. One method includes a step of pressing one of a target part and a layered heater into the other one of the target part and the layered heater to create an interference fit between the layered heater and the target part. When the target part is disposed within the layered heater, the layered heater includes a substrate defining an inner periphery less than or equal to an outer periphery of the target part. When the layered heater is disposed within the target part, the layered heater includes a substrate defining an outer periphery larger than or equal to an inner periphery of the target.

Abstract: A layered heater is provided with a resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length and a thickness, wherein the thickness varies along the length of the resistive circuit pattern for a variable watt density. The present invention also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density. Methods are also provided wherein the variable thickness is achieved by varying a dispensing rate of a conductive ink used to form the resistive circuit pattern, varying the feed rate of a target surface relative to the dispensing of the ink, and overwriting a volume of conductive ink on top of a previously formed trace of the resistive circuit pattern.

Abstract: Methods of forming a layered heater are provided that comprise at least one resistive layer comprising a resistive circuit pattern, the resistive circuit pattern defining a length, a thickness, and a spacing, wherein the thickness varies along the length of the trace of the resistive circuit pattern for a variable watt density. The methods include achieving the variable thickness by varying a dispensing rate of a conductive ink used to form the resistive circuit pattern, varying the feed rate of a target surface relative to the dispensing of the ink, and overwriting a volume of conductive ink on top of a previously formed trace of the resistive circuit pattern.

Abstract: Methods of forming a layered heater are provided with a dielectric layer formed by a first layered process, a resistive layer formed on the dielectric layer, the resistive layer formed by a second layered process, and a protective layer formed on the resistive layer, wherein the protective layer is formed by one of the first or second layered processes or yet another layered process. The first layered process is different than the second layered process in order to take advantage of the unique processing benefits of each of the first and second layered processes for a synergistic result. The layered processes include, by way of example, thick film, thin film, thermal spraying, and sol-gel. Additional functional layers are also provided by the present invention, along with methods of forming each of the individual layers.

Abstract: A layered heater is provided that comprises at least one resistive layer defining a circuit configuration, the circuit configuration comprising at least one resistive trace oriented relative to a heating target and comprising a material having temperature coefficient characteristics such that the resistive trace provides power commensurate with demands of the heating target. In one form, resistive traces of the resistive layer are a PTC material having a relatively high TCR and are oriented approximately perpendicular to a primary heating direction. In another form, resistive traces of the resistive layer are an NTC material having a relatively high BETA coefficient and are oriented approximately parallel to a primary heating direction.

Abstract: Coating compositions based on nonlinear, low molecular weight, polyester-based polyols having low viscosity and high solids content made by reacting a branched, polyhydric alcohol having at least three hydroxyl groups, such as trimethylolpropane; a glycol or diol; and a compound selected from the group consisting of a aliphatic or aromatic dicarboxylic acid, C1–C6 alkyl ester, anhydride, diacid halide, or mixtures thereof. The nonlinear, polyester-based polyols are quite effective in maintaining a high solids content while lowering viscosity when blended with other coating resins, such as acrylic resins, making the coating resins more effective in cured coatings by improving flexibility, impact resistance and hardness without adversely affecting appearance, solvent resistance, and/or accelerated weathering. This invention also relates to the process of coating a substrate with these coating compositions.

Abstract: A layered heater is provided with a resistive layer having a resistive circuit pattern, the resistive circuit pattern defining a length and a thickness, wherein the thickness varies along the length of the resistive circuit pattern for a variable watt density. The present invention also provides layered heaters having a resistive circuit pattern with a variable thickness along with a variable width and/or spacing of the resistive circuit pattern in order to produce a variable watt density. Methods are also provided wherein the variable thickness is achieved by varying a dispensing rate of a conductive ink used to form the resistive circuit pattern, varying the feed rate of a target surface relative to the dispensing of the ink, and overwriting a volume of conductive ink on top of a previously formed trace of the resistive circuit pattern.