Patents by Inventor James McSpadden
James McSpadden has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9743465Abstract: A microwave module lid is disclosed. The microwave module lid can include an inner side operable to define, at least in part, a cavity configured to have a radio frequency (RF) emitting component disposed therein. The microwave module lid can also include two or more dielectric layers proximate one another. Each layer can have a thickness, a dielectric constant, and a dielectric loss characteristic. In addition, the microwave module lid can include a metal backing layer proximate one of the dielectric layers to contain RF energy within the lid. The thicknesses, the dielectric constants, and/or the dielectric loss characteristics of the dielectric layers can be configured to minimize RF resonance in the cavity.Type: GrantFiled: May 19, 2014Date of Patent: August 22, 2017Assignee: Raytheon CompanyInventor: James Mcspadden
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Patent number: 9653799Abstract: A method of controlling sidelobe distribution in an active electronically steered array, including electronically reshaping the array aperture so as to reduce sidelobes over a selected region of a coverage volume of the array. In one example, reshaping of the aperture is achieved by electronically turning on and/or off selected radiators in the array to vary the angle of edge discontinuities of the aperture, and thereby move the main sidelobes off the principal plane(s) of operation of the array.Type: GrantFiled: November 7, 2011Date of Patent: May 16, 2017Assignee: RAYTHEON COMPANYInventors: Jerome H. Pozgay, James McSpadden, Joel C. Roper, Fatemeh Tingley
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Publication number: 20170105311Abstract: An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.Type: ApplicationFiled: October 9, 2015Publication date: April 13, 2017Inventors: Brandon W. Pillans, James Mcspadden
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Patent number: 9603283Abstract: An electronic module, and method for making same, includes free-formed, self-supported interconnect pillars that electrically connect cover electronic components disposed on a cover substrate with base electronic components disposed on a base substrate. The free-formed, self-supported interconnect pillars may extend vertically in a straight path between the cover electronic components and the base electronic components. The free-formed, self-supported interconnect pillars may be formed from an electrically conductive filament provided by an additive manufacturing process. By free-forming the self-supported interconnect pillars directly on the electronic components, the flexibility of electronic module design may be enhanced, while reducing the complexity and cost to manufacture such electronic modules.Type: GrantFiled: October 9, 2015Date of Patent: March 21, 2017Assignee: Raytheon CompanyInventors: Brandon W. Pillans, James Mcspadden
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Publication number: 20150334787Abstract: A microwave module lid is disclosed. The microwave module lid can include an inner side operable to define, at least in part, a cavity configured to have a radio frequency (RF) emitting component disposed therein. The microwave module lid can also include two or more dielectric layers proximate one another. Each layer can have a thickness, a dielectric constant, and a dielectric loss characteristic. In addition, the microwave module lid can include a metal backing layer proximate one of the dielectric layers to contain RF energy within the lid. The thicknesses, the dielectric constants, and/or the dielectric loss characteristics of the dielectric layers can be configured to minimize RF resonance in the cavity.Type: ApplicationFiled: May 19, 2014Publication date: November 19, 2015Applicant: Raytheon CompanyInventor: James Mcspadden
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Patent number: 8693947Abstract: Various embodiments provide a satellite communication system including a first transceiver and a second transceiver geographically fixed on the earth, and a first satellite configured to communicate with the first transceiver through a first link. The system further includes a second satellite configured to communicate with the second transceiver through a second link and communicate with the first satellite through a laser communication crosslink. The first satellite and the second satellite are at a low earth orbit or medium earth orbit below the geostationary earth orbit of approximately 36000 km.Type: GrantFiled: May 27, 2011Date of Patent: April 8, 2014Inventors: John F. Silny, Gary D. Coleman, C. Thomas Hastings, Jr., William J. Miniscalco, James McSpadden
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Patent number: 8334816Abstract: According to one embodiment, a cover comprising a higher dielectric constant layer disposed outwardly from a lower dielectric constant layer is coupled to a rectenna operable to convert microwave power to electrical power. The cover receives microwave power, provides a substantial impedance match for a plurality of angles of incidence, and directs the microwave power to the rectenna. The impedance match is selected to broaden a receive pattern of the rectenna.Type: GrantFiled: July 30, 2009Date of Patent: December 18, 2012Assignee: Raytheon CompanyInventor: James McSpadden
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Publication number: 20120302160Abstract: Various embodiments provide a satellite communication system including a first transceiver and a second transceiver geographically fixed on the earth, and a first satellite configured to communicate with the first transceiver through a first link. The system further includes a second satellite configured to communicate with the second transceiver through a second link and communicate with the first satellite through a laser communication crosslink. The first satellite and the second satellite are at a low earth orbit or medium earth orbit below the geostationary earth orbit of approximately 36000 km.Type: ApplicationFiled: May 27, 2011Publication date: November 29, 2012Applicant: RAYTHEON COMPANYInventors: John F. SILNY, Gary D. COLEMAN, C. Thomas HASTINGS, JR., William J. MINISCALCO, James MCSPADDEN
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Publication number: 20120249366Abstract: Embodiments of the present apparatus and system are directed to a compact satellite communications on the move (SOTM) antenna system that maintains a communications link with a hybrid combination of mechanical and electronic beam steering. This hybrid system ensures that the antenna beamwidth in the plane of the geosynchronous satellites remains within internationally agreed to limits, independent of the location of the satellite with respect to the ground terminal. Systems constructed according to the principles presently disclosed also provide reduced antenna sidelobes in the satellite plane and minimize the electronic scan loss while simultaneously achieving controllable beamwidth, full field of view coverage, and low antenna height.Type: ApplicationFiled: April 4, 2011Publication date: October 4, 2012Applicant: Raytheon CompanyInventors: Jerome H. Pozgay, David L. Hendry, James Mcspadden
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Publication number: 20120119952Abstract: A method of controlling sidelobe distribution in an active electronically steered array, including electronically reshaping the array aperture so as to reduce sidelobes over a selected region of a coverage volume of the array. In one example, reshaping of the aperture is achieved by electronically turning on and/or off selected radiators in the array to vary the angle of edge discontinuities of the aperture, and thereby move the main sidelobes off the principal plane(s) of operation of the array.Type: ApplicationFiled: November 7, 2011Publication date: May 17, 2012Applicant: RAYTHEON COMPANYInventors: Jerome H. Pozgay, James McSpadden, Joel C. Roper, Fatemeh Tingley
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Publication number: 20100026603Abstract: According to one embodiment, a cover comprising a higher dielectric constant layer disposed outwardly from a lower dielectric constant layer is coupled to a rectenna operable to convert microwave power to electrical power. The cover receives microwave power, provides a substantial impedance match for a plurality of angles of incidence, and directs the microwave power to the rectenna. The impedance match is selected to broaden a receive pattern of the rectenna.Type: ApplicationFiled: July 30, 2009Publication date: February 4, 2010Applicant: Raytheon CompanyInventor: James McSpadden