Abstract: A connector port assembly for releasably securing an implantable lead to a header of an implantable medical device comprises a connector block having a connector block bore and an access hole extending radially through the connector block and oriented orthogonally to an axis of the connector block bore and sized to receive a shaft of a release tool, and a collet assembly including a collet body and a plurality of bearings arranged about a circumference of the collet body, the collet body including a forward end portion having a curved outer surface, and a distal portion opposite the forward end portion, wherein the access hole of the connector block is positioned such that a shaft of the release tool can engage the curved outer surface of the forward end portion of the collet body.

Abstract: Embodiments herein relate to implantable chemical sensors. In an embodiment, an implantable optical chemical sensor includes a circuit board, at least one optical emitter, and at least one optical detector. The optical emitter can be disposed on the circuit board along with the optical detector. The optical chemical sensor can also include a floor plate and a well plate, the well plate defining at least one well and the well plate disposed over the floor plate. The well plate can include a vertical facet and a beveled facet disposed on a perimeter edge of the well plate. A feed-through flange can define a window with the vertical facet of the well plate fitting into the window. The optical emitter can emit light through the floor plate and into the well plate which is then redirected by the beveled facet into the well. Other embodiments are also included herein.

Abstract: An implantable medical device may include a plurality of electrical components connected to form operational circuitry, a canister shaped for housing the operational circuitry, and a dampening layer configured to reduce internal motion between the operational circuitry and at least one of a plurality of additional component within the canister, the dampening layer selectively disposed over the operational circuitry but not over the at least one additional component, the dampening layer providing electrical isolation to the operational circuitry, the dampening layer comprising a moldable material in direct contact with an inner surface of the canister. Methods of manufacturing such a medical device are also disclosed.

Abstract: A method of manufacturing an implantable medical device having electrical components disposed within a cavity of a housing. The method comprises heating a gel filler material to a liquid, flowable state, depositing the gel filler material in the liquid, flowable state into the cavity to substantially encapsulate the electrical components within the gel filler material; and allowing the gel filler material to cool to a semi-solid state.

Abstract: Methods of manufacturing an implantable medical device, and devices resulting from such methods. A printed circuit board assembly is made, and a first portion of encapsulant is applied to at least a portion of the printed circuit board assembly. A flex circuit is attached, such as by soldering, to the printed circuit board assembly. The flex circuit is then secured to the first portion of encapsulant, prior to applying a second portion of encapsulant.

Abstract: Methods of manufacturing a medical device, and medical devise made by such methods. One or more layers or portions of encapsulant are used to secure components of a medical device in a housing. The case fit-up of the device may be modified to reduce reliance on size tolerances of components of the medical device, while still accounting for any anticipated changes in component size due to aging.

Abstract: Embodiments of the present disclosure relate to implantable medical devices. According to an exemplary embodiment, a method for forming an electrode on an implantable medical device (IMD), comprises forming a nonconductive body comprising a well having a bottom surface and at least one side surface extending from the bottom surface. The method further comprises forming a conduit through the bottom surface and inserting the nonconductive body into an opening in an external surface of the IMD. The method also comprises depositing conductive material into the well and coupling the conductive material to a circuit of the IMD via the conduit through the bottom surface of the well.

Abstract: Implantable medical devices including a housing that contains operational circuitry for the implantable medical device and a dispensed hydrogen getter. The hydrogen getter may include a getter carrier material and one or more getter materials carried as suspensions in the getter carrier material, with the getter materials taking the form of organic compounds, such as fatty acids, or powdered metal oxides, or combinations thereof. The hydrogen getter may instead be comprised of two fatty acids having different melt temperatures. The hydrogen getter may be dispensed onto an encapsulant layer or other component of the implantable medical device, or may be blended into an encapsulant layer.

Abstract: A connector apparatus for a medical device includes connector apparatus of a medical device to provide electrical contact to at least one conductive lead, the apparatus comprising: at least one lead receptacle including an opening to receive the at least one conductive lead, wherein the at least one lead receptacle includes: at least a first electrode to contact the at least one conductive lead when the conductive lead is inserted into the lead receptacle; and a moveable visual indicator to be moved to become visible through the connector apparatus when the at least one conductive lead is inserted in the lead receptacle and contacts the at least one electrode.

Abstract: Systems and methods are disclosed to absorb a portion of a positive or negative manufacturing tolerance of at least one component of a stacked bore assembly are disclosed, the stacked bore assembly comprising a first component having a distal mechanical feature and a second component having a proximal mechanical feature configured to engage the distal mechanical feature the first component to a shoulder on a first one of the distal mechanical feature of the first component or the proximal mechanical feature of the second component. The shoulder can be positioned at a distance from an end of the first one of the distal mechanical feature of the first component or the proximal mechanical feature of the second component shorter or longer than a length of a second of the distal mechanical feature of the first component or the proximal mechanical feature of the second component.

Abstract: An ambulatory medical device includes an energy storage component having a metal case and one output pin; a circuit board including a supply connection and a ground connection; a first conductive wire connected to the supply connection of the circuit board and the output pin of the energy storage component; and a second conductive wire connected to the ground connection of the circuit board and the metal case of the energy storage component.

Abstract: Hydrogen getters are provided in active implantable medical device by applying a layer of selected metal with a chosen thickness over an un-oxidized portion of a base metal. The base metal may be titanium, and the selected metal may be palladium or platinum, with a thickness of less than 250 nanometers, where the selected metal acts as a passivation layer relative to oxidation but allows hydrogen capture by the base metal. The getter may be a separate component or may be formed as part of an existing component such as a feedthrough ferrule.

Abstract: Systems and methods to couple electrical contacts of a header of a medical device to respective feedthrough pins of a connector block of a medical device housing using a preformed wire are disclosed. The preformed wire can include a proximate portion comprising a number of turns shaped to engage a feedthrough pin. The number of turns of the preformed wire, once engaged with the feedthrough pin, can physically separate a major portion of the preformed wire from the connector block and the housing. The major portion of the preformed wire can be shaped to route a distal portion of the preformed wire to a first electrical contact of the header when the proximate portion of the preformed wire engages the feedthrough pin.

Abstract: Implantable medical devices with a dampening layer, and methods for manufacturing such devices. A dampening layer may be dispensed onto assembled electrical components of an implantable medical device. The dampening layer may include a first material which is modified with a second material to reduce one or more of the heat capacity or density thereof.

Abstract: An implantable medical device includes a metal case having a hermetic seal; and an identification (ID) tag arranged within the sealed metal case, wherein the ID tag is readable by X-raying the device.

Abstract: A medical device comprises a metal case having a hermetic seal; one or more Input/Output (I/O) conductors, wherein the I/O conductors pass through the hermetic seal such that a first end of the I/O conductors reside on a non-hermetic side of the hermetic seal and a second end of the I/O conductors reside on a hermetic side of the hermetic seal within the metal case; a ceramic substrate, wherein the one or more I/O conductors pass through the ceramic substrate and the ceramic substrate has a non-hermetic surface on a non-hermetic side of the hermetic seal; and wherein the non-hermetic surface of the ceramic substrate is a laser etched surface.

Abstract: An implantable medical device includes a metal case, a mold layer internal to the metal case and including a molded cavity arranged next to the metal case, and a piezo speaker arranged between the metal case and the molded cavity of the mold layer. The piezo speaker contacts the metal case.

Abstract: An implantable medical device can include a housing including electronic devices within the housing, and a header attached to the housing. The header can include a first silicone portion configured to surround a first portion of internal electronics of the header, and a second silicone portion configured to surround a second portion of internal electronics of the header. The header can further include a splitline where the first silicone portion abuts the second silicone portion, wherein an outer edge of the first silicone portion and an outer edge of the second silicone portion are rounded at the splitline to prevent a sharp edge that may cause damage during assembly or insertion.

Abstract: An implantable medical device can include a housing including electronic devices within the housing, and a header attached to the housing. The header can have an index locking assembly including one or more connector bores arranged within the header, each of the one or more connector bores including a proximal end and a distal end. The index locking assembly can also include one or more connector pins configured to be inserted into and interference fit within the one or more connector bores. The proximal end of the one or more connector bores and a portion of the one or more connector pins can include a tapered portion configured to prevent rotation of the one or more connector pins when inserted into the one or more connector bores.

Abstract: An implantable medical device can include a housing including electronic devices within the housing; a header attached to the housing and including one or more bores; and a feedthrough assembly between the housing and the header; wherein the electronic devices include a PCB electronically connected to the header by a feedthrough wire running from the feedthrough assembly to the PCB, wherein the feedthrough wire is connected to the PCB with a pigtail spring connector.