Patents by Inventor James Michael Olson

James Michael Olson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240132218
    Abstract: Apparatuses, systems, and methods comprising acoustically absorptive air ducts comprising an internally positioned structure component as an endoskeleton and an air impervious inner layer, and an acoustically absorptive foam outer layer, environmental control systems comprising such air ducts, and vehicles incorporating such environmental control systems are disclosed with methods for manufacture and installations are disclosed.
    Type: Application
    Filed: October 20, 2022
    Publication date: April 25, 2024
    Inventors: Rachel Ann Bires, Douglas Dean Maben, Christopher Edward Plass, Mark Michael Gmerek, David William Olson, Sonny Keever Nguyen, James Julius Koch, Greta Grace Hadford, Bryce Avery Van Dyke, Xin Han
  • Patent number: 7078305
    Abstract: A resistor structure is disclosed that is constructed out of two layers of polysilicon. The intrinsic device is made using the top layer which is either a dedicated deposition, or formed as part of an existing process step such as a base epi growth in a BiCMOS flow. This poly layer can be made with a relatively high (greater than 2000 ohms per square) sheet resistance by appropriate scaling of the implant dose or by insitu doping methods. In this invention this layer is arranged to be about 1000 A or less thick. Such a resistor form with this thickness has been shown to demonstrate a better standard deviation of resistance compared to resistors made with a thicker layer. Additionally, practical resistors made in elongated forms demonstrate better standard deviations of resistance when five bends were incorporated into the form. The resistor ends are formed by the addition of a bottom poly layer in a self aligned manner with a deposition that may already be part of the process sequence.
    Type: Grant
    Filed: December 21, 2004
    Date of Patent: July 18, 2006
    Assignee: Fairchild Semiconductor Corporation
    Inventor: James Michael Olson
  • Patent number: 6885280
    Abstract: A resistor structure is disclosed that is constructed out of two layers of polysilicon. The intrinsic device is made using the top layer which is either a dedicated deposition, or formed as part of an existing process step such as a base epi growth in a BiCMOS flow. This poly layer can be made with a relatively high (greater than 2000 ohms per square) sheet resistance by appropriate scaling of the implant dose or by insitu doping methods. In this invention this layer is arranged to be about 1000 A or less thick. Such a resistor form with this thickness has been shown to demonstrate a better standard; deviation of resistance compared to resistors made with a thicker layer. Additionally, practical resistors made in elongated forms demonstrate better standard deviations of resistance when five bends were incorporated into the form. The resistor ends are formed by the addition of a bottom poly layer in a self aligned manner with a deposition that may already be part of the process sequence.
    Type: Grant
    Filed: January 31, 2003
    Date of Patent: April 26, 2005
    Assignee: Fairchild Semiconductor Corporation
    Inventor: James Michael Olson
  • Publication number: 20040150507
    Abstract: A resistor structure is disclosed that is constructed out of two layers of polysilicon. The intrinsic device is made using the top layer which is either a dedicated deposition, or formed as part of an existing process step such as a base epi growth in a BiCMOS flow. This poly layer can be made with a relatively high (greater than 2000 ohms per square) sheet resistance by appropriate scaling of the implant dose or by insitu doping methods. In this invention this layer is arranged to be about 1000 A or less thick. Such a resistor form with this thickness has been shown to demonstrate a better standard; deviation of resistance compared to resistors made with a thicker layer. Additionally, practical resistors made in elongated forms demonstrate better standard deviations of resistance when five bends were incorporated into the form. The resistor ends are formed by the addition of a bottom poly layer in a self aligned manner with a deposition that may already be part of the process sequence.
    Type: Application
    Filed: January 31, 2003
    Publication date: August 5, 2004
    Inventor: James Michael Olson